The present disclosure relates to a process to integrate sintered components in a laminate substrate. The disclosed process starts with providing a precursor substrate, which includes a substrate body having an opening through the substrate body, and a first foil layer. Herein, the first foil layer is formed underneath the substrate body, so as to fully cover a bottom of the opening. Next, a sinterable base material is applied into the opening and over the first foil layer, and then sintered at a first sintering temperature to create a sintered base component. A sinterable contact material is applied over the sintered base component, and then sintered at a second sintering temperature to create a sintered contact film. The sintered base component is confined within the opening by the substrate body on sides, by the first foil layer on bottom, and by the sintered contact film on top.

A process for preparing a porous ceramic body includes forming a green body with a mixture of ceramic material powder, binder material, and pore-forming particles. The process further includes extracting the binder material, decomposing the pore-forming particles, and removing residual organic materials from the green body at respective, progressively higher pre-firing temperatures. After these three stages, the green body is sintered at a still-higher temperature to form the porous ceramic body. Embodiments facilitate manufacturing and can render most or all surface grinding unnecessary, allowing electrode deposition directly onto substantially non-porous surfaces of the porous ceramic body that are naturally formed during sintering. Advantageously, the green body may be formed into net shape by injection molding the mixture that includes the pore-forming particles, and embodiments can result in porous ceramic bodies that are much thicker than currently available, with better structural integrity.

A method to produce a multilayer ceramic electronic component includes forming supports by an ink jet printing method to produce a green multilayer ceramic capacitor. A green ceramic layer and outer electrodes of the multilayer ceramic electronic component are formed by the ink jet printing method while the supports define peripheries of the green ceramic layer and the outer electrodes. When fired, the green multilayer ceramic electronic component is converted to a sintered multilayer ceramic electronic component, and the supports disappear by heating.

A ceramic composition in one embodiment contains, relative to 100 parts by mass of diopside crystal powder, 0.3 to 1.5 parts by mass of a Li component in terms of an oxide thereof and 0.1 to 1 part by mass of a B component in terms of an oxide thereof. In this embodiment, the content of the Li component in terms of an oxide thereof is larger than the content of the B component in terms of an oxide thereof. In this embodiment, a total content of the Li component and the B component is 2.25 parts by mass or less in terms of oxides thereof.

A ceramic composition in one embodiment contains, relative to 100 parts by mass of diopside crystal powder, 0.3 to 1.5 parts by mass of a Li component in terms of an oxide thereof and 0.1 to 1 part by mass of a B component in terms of an oxide thereof. In this embodiment, the content of the Li component in terms of an oxide thereof is larger than the content of the B component in terms of an oxide thereof. In this embodiment, a total content of the Li component and the B component is 2.25 parts by mass or less in terms of oxides thereof.

According to the present invention, a dielectric ceramic composition, which can be fired in a reducing atmosphere, has a high dielectric constant, has an electrostatic capacity exhibiting little change, when used as a dielectric layer of a ceramic electronic component such as a laminated ceramic capacitor even under a condition of 150 to 200° C., and has small dielectric losses at 25° C. and 200° C., can be provided.

According to the present invention, a dielectric ceramic composition, which can be fired in a reducing atmosphere, has a high dielectric constant, has an electrostatic capacity exhibiting little change, when used as a dielectric layer of a ceramic electronic component such as a laminated ceramic capacitor even under a condition of 150 to 200° C., and has small dielectric losses at 25° C. and 200° C., can be provided.

A sandwich-structured dielectric material for pulse energy storage is provided as well as a preparation method thereof. Employing a sandwich structure and combining the properties of ceramic-glass materials prepares a high performance dielectric material for pulse energy storage, in which the ceramic dielectric is core-shell structured powder of Ba.sub.xSr.sub.1-xTiO.sub.3 coated with SiO.sub.2, and the glass material is alkali-free glass AF45, of which the chemical composition is 63% SiO.sub.2-12% BaO-16% B.sub.2O.sub.3-9% Al.sub.2O.sub.3. AF45 alkali-free glass paste is spin-coated on both sides of the ceramic and calcined to get a layer-structured material of glass-ceramic-glass.

A method of manufacturing a ceramic dielectric, including: heat-treating a barium precursor or a strontium precursor, a titanium precursor, and a donor element precursor to obtain a conducting or semiconducting oxide, preparing a mixture including the conducting or semiconducting oxide and a liquid-phase acceptor element precursor, and sintering the mixture to form a ceramic dielectric, wherein the ceramic dielectric includes a plurality of grains and a grain boundary between adjacent grains, and wherein the plurality of grains including an insulating oxide comprising an acceptor element derived from the acceptor element precursor.

A method of manufacturing a ceramic dielectric, including: heat-treating a barium precursor or a strontium precursor, a titanium precursor, and a donor element precursor to obtain a conducting or semiconducting oxide, preparing a mixture including the conducting or semiconducting oxide and a liquid-phase acceptor element precursor, and sintering the mixture to form a ceramic dielectric, wherein the ceramic dielectric includes a plurality of grains and a grain boundary between adjacent grains, and wherein the plurality of grains including an insulating oxide comprising an acceptor element derived from the acceptor element precursor.