C04B41/5061

Seal coat
12534415 · 2026-01-27 · ·

A coating for an article includes a seal coat comprising self-healing particles disposed in a seal coat matrix and a bond coat disposed on the seal coat. The bond coat includes a matrix, diffusive particles disposed in the matrix, and gettering particles disposed in the matrix. A coating for an article and a method of applying a coating to an article are also disclosed.

Electrostatic chuck, electrostatic chuck heater comprising same, and semiconductor holding device
12545630 · 2026-02-10 · ·

An electrostatic chuck is provided. Implemented according to an embodiment of the present invention is an electrostatic chuck comprising: a silicon nitride sintered body; a surface modification layer covering at least a portion of the external surface of the silicon nitride sintered body and having corrosion resistance and plasma resistance; and an electrostatic electrode laid inside the silicon nitride sintered body. Therefore, the electrostatic chuck includes a ceramic sintered body of silicon nitride, and thus has excellent plasma resistance, chemical resistance, and thermal shock resistance while exhibiting an equivalent or similar level of heat dissipation performance compared to ceramic sintered bodies of aluminum nitride that have been conventionally widely used, so that the electrostatic chuck can be widely used in semiconductor processes.

High temperature coatings

A method includes forming a crystallized metal carbide undercoat on a surface of a carbon-carbon composite substrate. The method further includes forming an overcoat on a surface of the undercoat. The overcoat includes a plurality of crystallized ultra-high melting point overcoat layers. Each overcoat layer is sequentially formed by applying a mixture to a surface of an underlying layer and heating the mixture. The mixture includes a plurality of ultra-high melting point refractory ceramic particles and a pre-ceramic polymer. The mixture is heated to a heat treatment temperature to pyrolyze the pre-ceramic polymer and form the overcoat layer in an inert atmosphere or under vacuum. As a result, the overcoat layer includes a crystallized ultra-high melting point polymer-derived ceramic matrix that includes the plurality of ultra-high melting point refractory ceramic particles.

High temperature coatings

A method includes forming a crystallized metal carbide undercoat on a surface of a carbon-carbon composite substrate. The method further includes forming an overcoat on a surface of the undercoat. The overcoat includes a plurality of crystallized ultra-high melting point overcoat layers. Each overcoat layer is sequentially formed by applying a mixture to a surface of an underlying layer and heating the mixture. The mixture includes a plurality of ultra-high melting point refractory ceramic particles and a pre-ceramic polymer. The mixture is heated to a heat treatment temperature to pyrolyze the pre-ceramic polymer and form the overcoat layer in an inert atmosphere or under vacuum. As a result, the overcoat layer includes a crystallized ultra-high melting point polymer-derived ceramic matrix that includes the plurality of ultra-high melting point refractory ceramic particles.

Hybrid high and low temperature coating

A high temperature article includes a carbon/carbon (C/C) composite substrate and a hybrid coating on the C/C composite substrate. The hybrid coating includes a high temperature antioxidant layer on a surface of the C/C composite substrate and a low temperature sealant on a surface of the high temperature antioxidant layer. The low temperature sealant is formed from a glass-forming soluble salt.

Metal carbide infiltrated C/C composites

An article includes a substrate. The substrate includes at least two phases. The first phase includes a carbon-carbon (C/C) composite. The second phase includes a metal carbide. The second phase is disposed within a plurality of interconnected pores of the first phase, wherein the second phase extends from a surface of the substrate to a depth of at least 300 micrometers below the surface of the substrate.