Provided is a method for manufacturing a circuit board including: (a) preparing a mixture of a metal powder, an anti-sintering agent, and an activator; (b) immersing a dielectric substrate in the mixture; (c) forming a metal-containing layer on the surface of the dielectric substrate by heating the mixture under an inert atmosphere or under a reducing atmosphere; (d) forming a first metal layer on the metal-containing layer by electroless plating and forming a second metal layer thereon by electroplating; and (e) forming a metal pattern on the dielectric substrate, wherein the first metal layer includes Cu, Ni, Co, Au, Pd, or an alloy thereof, the second metal layer includes Cu, Ni, Fe, Co, Cr, Zn, Au, Ag, Pt, Pd, Rh, or an alloy thereof, and the method further includes performing heat treatment at least once after step (c).

Provided is a method for manufacturing a circuit board including: (a) preparing a mixture of a metal powder, an anti-sintering agent, and an activator; (b) immersing a dielectric substrate in the mixture; (c) forming a metal-containing layer on the surface of the dielectric substrate by heating the mixture under an inert atmosphere or under a reducing atmosphere; (d) forming a first metal layer on the metal-containing layer by electroless plating and forming a second metal layer thereon by electroplating; and (e) forming a metal pattern on the dielectric substrate, wherein the first metal layer includes Cu, Ni, Co, Au, Pd, or an alloy thereof, the second metal layer includes Cu, Ni, Fe, Co, Cr, Zn, Au, Ag, Pt, Pd, Rh, or an alloy thereof, and the method further includes performing heat treatment at least once after step (c).

Provided is a method for manufacturing a circuit board including: (a) preparing a mixture of a metal powder, an anti-sintering agent, and an activator; (b) immersing a dielectric substrate in the mixture; (c) forming a metal-containing layer on the surface of the dielectric substrate by heating the mixture under an inert atmosphere or under a reducing atmosphere; (d) forming a first metal layer on the metal-containing layer by electroless plating and forming a second metal layer thereon by electroplating; and (e) forming a metal pattern on the dielectric substrate, wherein the first metal layer includes Cu, Ni, Co, Au, Pd, or an alloy thereof, the second metal layer includes Cu, Ni, Fe, Co, Cr, Zn, Au, Ag, Pt, Pd, Rh, or an alloy thereof, and the method further includes performing heat treatment at least once after step (c).

Provided is a method for manufacturing a circuit board including: (a) preparing a mixture of a metal powder, an anti-sintering agent, and an activator; (b) immersing a dielectric substrate in the mixture; (c) forming a metal-containing layer on the surface of the dielectric substrate by heating the mixture under an inert atmosphere or under a reducing atmosphere; (d) forming a first metal layer on the metal-containing layer by electroless plating and forming a second metal layer thereon by electroplating; and (e) forming a metal pattern on the dielectric substrate, wherein the first metal layer includes Cu, Ni, Co, Au, Pd, or an alloy thereof, the second metal layer includes Cu, Ni, Fe, Co, Cr, Zn, Au, Ag, Pt, Pd, Rh, or an alloy thereof, and the method further includes performing heat treatment at least once after step (c).

The present disclosure belongs to the field of biological materials, and particularly relates to a multilayer zirconia ceramic with uniform transition and a method for preparing the same. The specific technical solution of the present disclosure is as follows: a zirconia ceramic with a formula comprising, in percentage by mass, 0-3% of lanthana, 1.5-16% of yttria, 0-2.5% of silicon carbide nano-whiskers, and 0-1.5% of a coloring agent, the balance being zirconia. Correspondingly provided are a multi-layer zirconia ceramic with uniform transition prepared using the formula and a method for preparing the same. By using the method of the present disclosure, multilayer zirconia ceramics with good and uniformly transitioning core properties can be quickly and conveniently prepared, meeting the requirements of patients with dental disorders on the use and esthetics of dentures.

The present disclosure belongs to the field of biological materials, and particularly relates to a multilayer zirconia ceramic with uniform transition and a method for preparing the same. The specific technical solution of the present disclosure is as follows: a zirconia ceramic with a formula comprising, in percentage by mass, 0-3% of lanthana, 1.5-16% of yttria, 0-2.5% of silicon carbide nano-whiskers, and 0-1.5% of a coloring agent, the balance being zirconia. Correspondingly provided are a multi-layer zirconia ceramic with uniform transition prepared using the formula and a method for preparing the same. By using the method of the present disclosure, multilayer zirconia ceramics with good and uniformly transitioning core properties can be quickly and conveniently prepared, meeting the requirements of patients with dental disorders on the use and esthetics of dentures.

To provide a surface-coated cutting tool exhibiting excellent wear resistance in a high-speed cutting process and having prolonged service life. The surface-coated cutting tool includes a tool substrate containing WC crystal grains and insulating grains, and a coating layer composed of a multiple nitride of Ti, Al, and V and disposed on the surface of the tool substrate. The multiple nitride is represented by a compositional formula: Ti.sub.aAl.sub.bV.sub.cN satisfying the following relations:

0.25≤a≤0.35,

0.64≤b≤0.74,

0<c≤0.06, and

a+b+c=1

(wherein each of a, b, and c represents an atomic proportion). The coating layer is characterized by exhibiting a peak attributed to a hexagonal crystal phase and a peak attributed to a cubic crystal phase as observed through X-ray diffractometry.

To provide a surface-coated cutting tool exhibiting excellent wear resistance in a high-speed cutting process and having prolonged service life. The surface-coated cutting tool includes a tool substrate containing WC crystal grains and insulating grains, and a coating layer composed of a multiple nitride of Ti, Al, and V and disposed on the surface of the tool substrate. The multiple nitride is represented by a compositional formula: Ti.sub.aAl.sub.bV.sub.cN satisfying the following relations:

0.25≤a≤0.35,

0.64≤b≤0.74,

0<c≤0.06, and

a+b+c=1

(wherein each of a, b, and c represents an atomic proportion). The coating layer is characterized by exhibiting a peak attributed to a hexagonal crystal phase and a peak attributed to a cubic crystal phase as observed through X-ray diffractometry.

Provided are a coating structure, a turbine part having the same, and a method for manufacturing the coating structure. The coating structure is provided on a surface of a base portion including a ceramic matrix composite. The coating structure is layered on the surface of the base portion, and includes a bond coat layer formed of a rare-earth silicate and a top coat layer layered on the bond coat layer. The residual stress present in the bond coat layer is compressive residual stress. The oxygen permeability coefficient of the bond coat layer is no greater than 10.sup.−9 kg.Math.m.sup.−1.Math.s.sup.−1 at a temperature of not lower than 1200° C. and a higher oxygen partial pressure of not less than 0.02 MPa. The bond coat layer may contain carbonitride particles or carbonitride whiskers.

Provided are a coating structure, a turbine part having the same, and a method for manufacturing the coating structure. The coating structure is provided on a surface of a base portion including a ceramic matrix composite. The coating structure is layered on the surface of the base portion, and includes a bond coat layer formed of a rare-earth silicate and a top coat layer layered on the bond coat layer. The residual stress present in the bond coat layer is compressive residual stress. The oxygen permeability coefficient of the bond coat layer is no greater than 10.sup.−9 kg.Math.m.sup.−1.Math.s.sup.−1 at a temperature of not lower than 1200° C. and a higher oxygen partial pressure of not less than 0.02 MPa. The bond coat layer may contain carbonitride particles or carbonitride whiskers.