A molded article having a small difference in thermal conductivities between a central section and a section located at an outer peripheral surface side; and a method for producing the same; wherein, a plate-shaped molded article includes an aluminum-silicon carbide composited section in which a metal including aluminum was impregnated into a silicon carbide porous body, wherein a difference in the densities, by Archimedes’ principle, of a central section of the aluminum-silicon carbide composited section and of at least a portion of an outer side section located further toward the outside peripheral surface side than the central section is 3% or less.

Provided is a method for manufacturing a circuit board including: (a) preparing a mixture of a metal powder, an anti-sintering agent, and an activator; (b) immersing a dielectric substrate in the mixture; (c) forming a metal-containing layer on the surface of the dielectric substrate by heating the mixture under an inert atmosphere or under a reducing atmosphere; (d) forming a first metal layer on the metal-containing layer by electroless plating and forming a second metal layer thereon by electroplating; and (e) forming a metal pattern on the dielectric substrate, wherein the first metal layer includes Cu, Ni, Co, Au, Pd, or an alloy thereof, the second metal layer includes Cu, Ni, Fe, Co, Cr, Zn, Au, Ag, Pt, Pd, Rh, or an alloy thereof, and the method further includes performing heat treatment at least once after step (c).

Provided is a method for manufacturing a circuit board including: (a) preparing a mixture of a metal powder, an anti-sintering agent, and an activator; (b) immersing a dielectric substrate in the mixture; (c) forming a metal-containing layer on the surface of the dielectric substrate by heating the mixture under an inert atmosphere or under a reducing atmosphere; (d) forming a first metal layer on the metal-containing layer by electroless plating and forming a second metal layer thereon by electroplating; and (e) forming a metal pattern on the dielectric substrate, wherein the first metal layer includes Cu, Ni, Co, Au, Pd, or an alloy thereof, the second metal layer includes Cu, Ni, Fe, Co, Cr, Zn, Au, Ag, Pt, Pd, Rh, or an alloy thereof, and the method further includes performing heat treatment at least once after step (c).

A composition based on a certain chromium-free silicate-based binder is described. The composition is an aqueous solution of lithium-doped potassium silicate in combination with an aluminum or aluminum alloy powder, zinc powder or a combination thereof. The coatings of the present invention are capable of achieving a full cure at temperatures as low as 350-450 degrees F. by the inclusion of a colloidal solution of a nano-sized ceria, thus making the coatings especially suitable for application on temperature sensitive base materials.

A plate-shaped heat dissipation member includes a metal-silicon carbide composite containing aluminum or magnesium, in which at least one of two main surfaces of the heat dissipation member is curved to be convex in an outward direction of the heat dissipation member, and when a flatness of the one main surface defined by JIS B 0621 is represented by f.sub.1 and a flatness of the other main surface different from the one main surface defined by JIS B 0621 is represented by f.sub.2, f.sub.2 is less than f.sub.1 by 10 μm or more.

A plate-shaped heat dissipation member includes a metal-silicon carbide composite containing aluminum or magnesium, in which at least one of two main surfaces of the heat dissipation member is curved to be convex in an outward direction of the heat dissipation member, and when a flatness of the one main surface defined by JIS B 0621 is represented by f.sub.1 and a flatness of the other main surface different from the one main surface defined by JIS B 0621 is represented by f.sub.2, f.sub.2 is less than f.sub.1 by 10 μm or more.

The disclosure relates to a process for preparing particulate materials having high electrochemical capacities that are suitable for use as anode active materials in rechargeable metal-ion batteries. In one aspect, the disclosure provides a process for preparing a particulate material comprising a plurality of composite particles. The process includes providing particulate porous carbon frameworks comprising micro pores and/or mesopores, wherein the porous carbon frameworks have a D.sub.50 particle diameter of at least 20 μm; depositing an electroactive material selected from silicon and alloys thereof into the micropores and/or mesopores of the porous carbon frameworks using a chemical vapour infiltration process in a fluidised bed reactor, to provide intermediate particles; and comminuting the intermediate particles to provide said composite particles.

The disclosure relates to a process for preparing particulate materials having high electrochemical capacities that are suitable for use as anode active materials in rechargeable metal-ion batteries. In one aspect, the disclosure provides a process for preparing a particulate material comprising a plurality of composite particles. The process includes providing particulate porous carbon frameworks comprising micro pores and/or mesopores, wherein the porous carbon frameworks have a D.sub.50 particle diameter of at least 20 μm; depositing an electroactive material selected from silicon and alloys thereof into the micropores and/or mesopores of the porous carbon frameworks using a chemical vapour infiltration process in a fluidised bed reactor, to provide intermediate particles; and comminuting the intermediate particles to provide said composite particles.

According to one or more embodiments of the present invention, a mirrored apparatus includes a substrate with a non-metal inorganic material that is non-diamond turnable. The mirrored apparatus further includes a finish layer arranged on the surface of the substrate. The finish layer has a polished surface opposite the substrate. The mirrored apparatus also includes a reflective layer arranged on the polished surface of the finish layer.

According to one or more embodiments of the present invention, a mirrored apparatus includes a substrate with a non-metal inorganic material that is non-diamond turnable. The mirrored apparatus further includes a finish layer arranged on the surface of the substrate. The finish layer has a polished surface opposite the substrate. The mirrored apparatus also includes a reflective layer arranged on the polished surface of the finish layer.