C04B2235/3206

Dielectric ceramic composition and multilayer ceramic capacitor comprising the same

A dielectric ceramic composition includes a barium titanate (BaTiO.sub.3)-based base material main ingredient and an accessory ingredient, the accessory ingredient including dysprosium (Dy) and praseodymium (Pr) as first accessory ingredients. A content of the Pr satisfies 0.233 mol≤Pr≤0.699 mol, based on 100 mol of the barium titanate base material main ingredient.

OXIDE SINTERED BODY

An oxide sintered body may include zinc, magnesium, a positive trivalent or positive tetravalent metal element X, and oxygen as constituent elements. The atomic ratio of the metal element X to the sum of the zinc, the magnesium, and the metal element X [X/(Zn+Mg+X)] may be 0.0001 or more and 0.6 or less. The atomic ratio of the magnesium to the sum of the zinc and the magnesium [Mg/(Zn+Mg)] may be 0.25 or more and 0.8 or less.

Method for preparing ceramic molded body for sintering and method for producing ceramic sintered body

A method includes molding a raw material powder containing a ceramic powder and a thermoplastic resin having a glass transition temperature higher than room temperature into a shape by isostatic pressing and in which a raw material powder slurry is prepared by adding the ceramic powder and the thermoplastic resin to a solvent so that the thermoplastic resin is 2% by weight or more and 40% by weight or less with respect to a total weight of the ceramic powder and the thermoplastic resin, a cast-molded body is to formed by wet-casting the raw material powder slurry into a shape, dried, and subjected to first-stage isostatic press molding at a temperature lower than the glass transition temperature of the thermoplastic resin, then this first-stage press-molded body is heated to the glass transition temperature of the thermoplastic resin or above, and warm isostatic press (WIP) molding is performed.

ALUMINUM TITANATE-CONTAINING PARTICLES, AT-CONTAINING GREEN AND CERAMIC HONEYCOMB BODIES, BATCH MIXTURES, AND METHODS OF MANUFACTURE
20230101880 · 2023-03-30 ·

Aluminum titanate-containing particles made up of a conglomerate of multiple partial grains. The aluminum titanate-containing particles are formed by breaking apart ceramic bodies along cracks, which are formed predominantly through the grains, rather than between the grains. Batch mixtures forming the aluminum titanate-containing particles, as well as batch mixtures utilizing the aluminum titanate particles are disclosed. Green bodies, such as green honeycomb bodies having peak intensity ratios (PIRs) in an axial direction of less than or equal to 0.50, ceramic honeycomb bodies, methods of manufacturing green honeycomb bodies, and ceramic honeycomb bodies are provided, as are other aspects.

METHOD OF PRODUCING CORE-SHELL PARTICLES AND MULTILAYER CERAMIC ELECTRONIC COMPONENT INCLUDING CORE-SHELL PARTICLES

A method of producing a core-shell particle includes introducing a barium titanate-based base powder and an additive to a reactor, and exposing the barium titanate-based base powder and the additive to a thermal plasma torch to obtain core-shell particles including a core portion having barium titanate (BaTiO.sub.3) and a shell portion including the additive and formed on a surface of the core portion.

CERAMIC ELECTRONIC DEVICE AND MANUFACTURING METHOD OF THE SAME
20230094498 · 2023-03-30 ·

A ceramic electronic device includes a multilayer chip in which each of a plurality of dielectric layers and each of a plurality of internal electrode layers including Ni as a main phase are alternately stacked. At least one of the plurality of dielectric layers includes a secondary phase including Si, at an interface between the at least one of the plurality of dielectric layers and one of the plurality of internal electrode layers next to the at least one of the plurality of dielectric layers. The one of the plurality of internal electrode layers includes a layer including an additive element including one or more of Au, Pt, Cu, Fe, Cr, Zn, and In, at a region contacting the secondary phase at the interface.

Ceramic Surface Modification Materials
20230032108 · 2023-02-02 ·

Porous, binderless ceramic surface modification materials are described, and applications of use thereof. The ceramic surface material is in the form of an interconnected network of porous ceramic material on a substrate. The ceramic material may include a metal oxide, a metal hydroxide, and/or hydrates thereof, or a metal carbonate or metal phosphate, on a substrate surface. The substrate may be in the form of a metal or polymer particulate, powder, extrudate, or flakes.

CERAMIC JOINT BODY, METHOD FOR MANUFACTURING CERAMIC JOINT BODY, STATOR FOR FLOW CHANNEL SWITCHING VALVE, AND FLOW CHANNEL SWITCHING VALVE
20230034636 · 2023-02-02 ·

The ceramic joint body according to the present disclosure includes: a first member made of ceramic and including a first flow channel configured to feed fluid; and a second member made of ceramic and including a second flow channel connected to the first flow channel to feed the fluid. The ceramic includes zirconium oxide and aluminum oxide, and at least one of the zirconium oxide and the aluminum oxide is a primary constituent, and a first opposing surface of the first member, which faces the second member, and a second opposing surface of the second member, which faces the first member, are connected by diffusion bonding.

Method of depositing nanoscale materials within a nanofiber network and networked nanofibers with coating
11489166 · 2022-11-01 · ·

Provided herein is a method of making a conductive network by combining uncoated carbon nanotubes and carbon nanotubes coated with an electroactive substance to create an electrically conductive network; and redistributing at least a portion of the electroactive substance. Also provided herein is an electrically conductive network with an active material coating; first carbon nanotubes coated with the active material coating; and second carbon nanotubes partially coated with the active material coating, wherein at least a portion of the surfaces of the second carbon nanotubes directly contact surfaces of other second carbon nanotubes without the active material coating between these second carbon nanotubes, and wherein the first carbon nanotubes and the second carbon nanotubes are entangled to form an electrically conductive network.