A method for producing a green body includes forming a layer which contains a powder of a ceramic on a substrate, applying at least one solidifying composition on at least a part of the layer, repeating forming the layer and applying at least one solidifying composition at least one time, removing the solvent or dispersing agent at least in part for forming a green body, and removing the powder which has not bonded and thereby exposing the green body. The solidifying composition contains a dissolved or liquid organometallic compound, which has at least one atom other than C, Si, H, O, or N bonded to at least one organic moiety, an organic binding agent, and a solvent or dispersing agent.

A pressure sensor system having a pressure sensor chip is specified. The pressure sensor chip is mounted on a mounting receptacle of a ceramic housing body having a pressure feed guided to the pressure sensor chip. The housing body is three-dimensionally shaped and monolithically formed and is formed by a ceramic material having a coefficient of thermal expansion which deviates by less than 30% from the coefficient of thermal expansion of the pressure sensor chip in a temperature range of greater than or equal to 40 C. and less than or equal to 150 C.

A refractory object can include at least approximately 10 wt % Al.sub.2O.sub.3 and at least approximately 1 wt % SiO.sub.2. In an embodiment, the refractory object can include an additive. In a particular embodiment, the additive can include TiO.sub.2, Y.sub.2O.sub.3, SrO, BaO, CaO, Ta.sub.2O.sub.5, Fe.sub.2O.sub.3, ZnO, or MgO. The refractory object can include at least approximately 3 wt % of the additive. In an additional embodiment, the refractory object can include no greater than approximately 8 wt % of the additive. In a further embodiment, the creep rate of the refractory object can be at least approximately 110.sup.6 h.sup.1. In another embodiment, the creep rate of the refractory object can be no greater than approximately 510.sup.5 h.sup.1. In an illustrative embodiment, the refractory object can include a glass overflow trough or a forming block.

A method of fabricating a part made of ceramic matrix composite material, the method includes fabricating the part by forming a ceramic matrix in the pores of a fiber structure, the ceramic matrix being formed by self propagating high temperature synthesis from a powder composition present in the pores of the fiber structure,

The invention is directed to a method of providing a protective coating composition that protects a refractory wall or lining from chemical attack by molten aluminum and molten alkali metals. The method includes the steps of coating a refractory wall or liner with an aqueous protective composition that includes, by weight of the solids, about 20-90% Al.sub.2O.sub.3 (excluding calcined alumina), about 15-55% SiO.sub.2, and about 1-15% of a metallic non-wetting agent; and evaporating the water before contacting the protective coating with the reactive molten metal.

A honeycomb structure having crystal phases of aluminum titanate and mullite, which is obtained by sintering a honeycomb molding made of a mixture comprising titania powder, alumina powder, silica powder and mullite powder, the mixture containing 1-10 parts by mass of silica powder and 5-30 parts by mass of mullite powder per the total amount (100 parts by mass) of the titania powder and the alumina powder, and the mullite powder containing 40-60% by mass of particles having particle sizes of 10-50 gm and 5-30% by mass of particles having particle sizes of 3 gm or less, and its production method.

A thermal barrier coating for a component includes an insulating layer applied to a surface of a substrate. The insulating layer comprises a plurality of ceramic microspheres. A sealing layer is bonded to the insulating layer. The sealing layer is non-permeable such that the sealing layer seals against the insulating layer. A method for applying a thermal barrier coating to a surface of a substrate of a component includes providing a plurality of ceramic microspheres and applying the plurality of ceramic microspheres to the surface of the substrate. At least one heat treatment is applied to the plurality of ceramic microspheres on the surface of the component to create an insulating layer on the surface of the substrate.

Disclosed herein are methods for controlling and/or predicting the shrinkage and/or growth of a ceramic honeycomb structure between a green body state and a fired state by adjusting the hydrated alumina content of the batch composition. Also disclosed herein is substantially clay-free cordierite honeycombs produced in accordance with such methods.

Disclosed are ceramic bodies comprised of composite cordierite-mullite-aluminum magnesium titanate (CMAT) ceramic compositions having high cordierite-to-mullite ratio and methods for the manufacture of same.

This invention relates to an assemblage of a semiconductor processing apparatus comprising a first aluminum nitride (AlN) component and a second aluminum nitride component, wherein the first and second aluminum nitride components are connected by a joint, said joint comprising a composite glass-ceramic comprising Y.sub.2O.sub.3Al.sub.2O.sub.3SiO.sub.2 (YAS) glass; and at least one of crystalline aluminosilicate and aluminum nitride.