A ceramic electronic device includes a multilayer structure in which each of a plurality of dielectric layers of which a main component is ceramic and each of three or more of internal electrode layers are alternately stacked. The three or more of internal electrode layers include Ni and Sn. An internal electrode layer having a larger Sn concentration is closer to an outermost edge in a stacking direction than an internal electrode layer having a smaller Sn concentration and being located on a center side of the stacking direction, in a relationship of at least two of the three or more of internal electrode layers.

A multilayer capacitor includes a body including a plurality of dielectric layers and a plurality of internal electrodes laminated with the dielectric layers interposed therebetween, and an external electrode disposed externally on the body and connected to one or more of the plurality of internal electrodes. One of the plurality of dielectric layers includes a barium titanate composition including a Sn component. One of the plurality of internal electrodes includes a Sn component. The one of the plurality of dielectric layers has a Sn content equal to at least twice a Sn content of the one of the plurality of internal electrodes adjacent to the one of the plurality of dielectric layers.

A module having a power semiconductor device and a ceramic capacitor which is configured for cooling the power semiconductor device.

A porous ceramic laminate, which can reduce pressure loss of a fluid, includes a first porous layer and a second porous layer. The second porous layer is laminated on, in contact with or via air, the first porous layer. A part of the second porous layer is laminated on, in contact with, the first porous layer. Each of the first porous layer and the second porous layer contains a metal oxide. A ratio Da/Db of an average pore diameter Da of the first porous layer relative to an average pore diameter Db of the second porous layer is 10 or more. A proportion of a portion in which a distance between the first porous layer and the second porous layer is smaller than 1 μm is 70% or less.

The present disclosure relates to a method for manufacturing a ceramic heater. The method for manufacturing a ceramic heater according to the present disclosure comprises: separately charging a ceramic powder into a center portion and multiple split edge portions in a formation mold and leveling the charged ceramic powder; manufacturing a molded body or pre-sintered body of the ceramic powder from the leveled ceramic powder; disposing a high-frequency electrode or a heating element on the molded body or pre-sintered body of the ceramic powder and filling a second ceramic powder; and integrally sintering the molded body or pre-sintered body of the ceramic powder and the second ceramic powder.

The invention relates to A slurry composition, comprising: an inorganic powder; a dispersant; and a solvent wherein the dispersant is a block copolymer comprising at least one hydrophobic block A and at least one hydrophilic block B, and wherein the blocks A and B comprise repeating units represented by the following general formula (I) wherein R.sup.1 is selected from a hydrogen atom, a linear or branched alkyl group having 1 to 10 carbon atoms and a cyclic alkyl group having 4 to 6 carbon atoms, and wherein at least one carboxylic acid group or a salt thereof is covalently linked to the block copolymer.

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A multilayer ceramic capacitor includes a multilayer structure having a substantially rectangular parallelepiped shape and including dielectric layers and internal electrode layers that are alternately stacked, the dielectric layers being mainly composed of BaTiO.sub.3, the internal electrode layers being alternately exposed to two edge faces of the multilayer chip opposite to each other. A Zr/Ti ratio is 0.02 or more and 0.10 or less in a capacity section. A Ba/Ti ratio is more than 0.900 and less than 1.010 in the capacity section. A Eu/Ti ratio is 0.005 or more and 0.05 or less in the capacity section. A Mn/Ti ratio is 0.0005 or more and 0.05 or less in the capacity section. A total amount of a rare earth element or rare earth elements is less than the amount of Eu.

The disclosure describes techniques for forming a surface layer of an article including a CMC using a cast. In some examples, the surface layer includes three-dimensional surface features, which may increase adhesion between the CMC and a coating on the CMC. In some examples, the surface layer may include excess material, with or without three-dimensional surface features, which is on the CMC. The excess material may be machined to remove some of the excess material and facilitate conforming the article to dimensional tolerances, e.g., for fitting the article to another component. The excess material may reduce a likelihood that the CMC (e.g., reinforcement material in the CMC) is damaged by the machining.

A multilayer electronic component according to some embodiments of the present disclosure includes: a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer; and an external electrode disposed on the body, wherein a ratio of the number of dielectric grains having a size of 100 to 250 nm included in the dielectric layer is 55% or more with respect to a total number of the dielectric grains included in the dielectric layer.

A production method for producing a product by joining a first part containing an inorganic powder and a binder to a second part containing an inorganic powder and a binder is provided. The production method includes a first step of forming the first part by a three-dimensional shaping apparatus, a second step of forming the second part, a third step of assembling the first part and the second part, thereby obtaining an assembly, a fourth step of heating the assembly at a first temperature, and a fifth step of heating the assembly at a second temperature higher than the first temperature after the fourth step, wherein the first part has a first region that comes in contact with the second part and a second region that does not come in contact with the second part, and a melting point of the binder contained in the first region is lower than a melting point of the binder contained in the second region.