The ceramic joint body according to the present disclosure includes: a first member made of ceramic and including a first flow channel configured to feed fluid; and a second member made of ceramic and including a second flow channel connected to the first flow channel to feed the fluid. The ceramic includes zirconium oxide and aluminum oxide, and at least one of the zirconium oxide and the aluminum oxide is a primary constituent, and a first opposing surface of the first member, which faces the second member, and a second opposing surface of the second member, which faces the first member, are connected by diffusion bonding.

Methods of forming joinery between components formed from dissimilar materials, and assemblies utilizing the joinery. The components include interface surfaces having complementary peaks and valleys that interlock. A compliant interface is formed between the interface surfaces and the interface can be configured to provide functionality.

A first detection electrode is provided on an insulating layer. A second detection electrode is provided away from the first detection electrode on the insulating layer, and forms a capacitance together with the first detection electrode. The protection layer covers the first detection electrode and the second detection electrode, has a thickness d satisfying 1 μm≤d≤10 μm, and is made of zirconia or alumina. The protection layer is a sintered body.

A hard lead zirconate titanate (PZT) ceramic has an ABO.sub.3 structure with A sites and B sites. The PZT ceramic is doped with Mn and with Nb on the B sites and the ratio Nb/Mn is <2. A piezoelectric multilayer component having such a PZT ceramic and also a method for producing a piezoelectric multilayer component are also disclosed.

Set forth herein are processes and materials for making ceramic thin green tapes by casting ceramic source powders and precursor reactants, binders, and functional additives into unsintered thin green tapes in a non-reactive environment.

A ceramic circuit substrate having high bonding performance and excellent thermal cycling resistance properties, having a circuit pattern provided on a ceramic substrate with a braze material layer interposed therebetween, and a protruding portion formed by the braze material layer protruding from the outer edge of the circuit pattern, wherein: the braze material layer includes Ag, Cu, Ti, and Sn or In; and an Ag-rich phase is formed continuously for 300 μm or more, towards the inside, from an outer edge of the protruding portion, along a bonding interface between the ceramic substrate and the circuit pattern, and has a bonding void ratio of 1.0% or less.

A method for forming a ceramic-based material comprises depositing a ceramic-precursor composition comprising nanoparticles having at least one dimension less than 100 nm and an aspect ratio of 1.5 or greater, and a carrier fluid on a surface of a substrate to form an as-deposited layer of the ceramic precursor composition; and sintering the as-deposited layer of the ceramic precursor composition at a sintering temperature to form a ceramic-based material.

In a manufacturing method for a member for a semiconductor manufacturing device, a metal terminal and a ceramic member are joined by using a paste that contains a resin and a metal particle(s), and a metal fine particle(s) that has/have a particle size(s) of 100 nm or less in the metal particle(s) account(s) for 1% by mass or more of 100% by mass of the metal particle(s). A member for a semiconductor manufacturing device includes a metal terminal, a ceramic member, and a joining part that connects the metal terminal and the ceramic member. The joining part contains a metal particle(s).

A multilayer ceramic capacitor includes a multilayer body including dielectric layers and first and second inner electrodes that are laminated, and first and second outer electrodes. Each of the first inner electrodes includes a first opposing electrode portion and a first extending electrode portion. The first extending electrode portions at least positioned in a vicinity of the first and second principal surfaces in a lamination direction among the first inner electrodes include a first bent portion bent inward and a second bent portion bent outward in the lamination direction. A distance between vertices of the first and second bent portions in the lamination direction in the first inner electrodes positioned in the vicinity of the first and second principal surface in a lamination direction is larger than a distance in the first inner electrodes positioned in a central portion in the lamination direction.

Embodiments of this application provide a middle frame, a rear cover, and fabrication methods thereof, and an electronic device. The electronic device may include a mobile or fixed terminal with a frame or a housing, such as a mobile phone, a tablet computer, a notebook computer, an ultra-mobile personal computer (UMPC), a handheld computer, a walkie-talkie, a netbook, a POS terminal, a personal digital assistant (PDA), an event data recorder, a wearable device, a virtual reality device, a wireless USB flash drive, a Bluetooth speaker/headset, or a vehicle-mounted device. Ceramics and fiber reinforced composite are used to form frames of a rear cover and a middle frame, to reduce thicknesses of a ceramic outer housing and a ceramic outer frame, thereby reducing a weight of the electronic device.