Patent classifications
C
CHEMISTRY; METALLURGY
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C07
ORGANIC CHEMISTRY
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C07C
ACYCLIC OR CARBOCYCLIC COMPOUNDS
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217/00
Compounds containing amino and etherified hydroxy groups bound to the same carbon skeleton
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C07C217/78
having amino groups and etherified hydroxy groups bound to carbon atoms of six-membered aromatic rings of the same carbon skeleton
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C07C217/80
having amino groups and etherified hydroxy groups bound to carbon atoms of non-condensed six-membered aromatic rings
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C07C217/82
of the same non-condensed six-membered aromatic ring
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C07C217/84
the oxygen atom of at least one of the etherified hydroxy groups being further bound to an acyclic carbon atom
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C07C217/86
to an acyclic carbon atom of a hydrocarbon radical containing six-membered aromatic rings
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C07C217/86

RESIN COMPOSITION, DIAMINE COMPOUND, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
20260003281 · 2026-01-01 · ·

A resin composition containing a resin that contains a specific repeating unit and a group having an ethylenically unsaturated bond, in which a content of a phenolic hydroxyl group is 0.250 mmol/g or less, and a polymerizable compound having an ethylenically unsaturated bond, a cured substance obtained by curing the resin composition, a laminate including the cured substance, a manufacturing method for the cured substance, a manufacturing method for a laminate, a manufacturing method for a semiconductor device including the manufacturing method for a cured substance, and a semiconductor device including the cured substance, and a diamine compound having a specific structure.

RESIN COMPOSITION, DIAMINE COMPOUND, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
20260003281 · 2026-01-01 · ·

A resin composition containing a resin that contains a specific repeating unit and a group having an ethylenically unsaturated bond, in which a content of a phenolic hydroxyl group is 0.250 mmol/g or less, and a polymerizable compound having an ethylenically unsaturated bond, a cured substance obtained by curing the resin composition, a laminate including the cured substance, a manufacturing method for the cured substance, a manufacturing method for a laminate, a manufacturing method for a semiconductor device including the manufacturing method for a cured substance, and a semiconductor device including the cured substance, and a diamine compound having a specific structure.