This disclosure relates to inhibitors of IRES-mediated protein synthesis, compositions comprising therapeutically effective amounts of these compounds, and methods of using those compounds and compositions in treating hyperproliferative disorders, e.g., cancers. This disclosure also relates to compositions comprising inhibitors of IRES-mediated protein synthesis and mTOR inhibitors, and to methods of treating cancer by conjoint administration of inhibitors of IRES-mediated protein synthesis and mTOR inhibitors.

Provided is a curable compound having a low melting temperature, having excellent workability as a result of having good solvent solubility, and being capable of forming a cured product having excellent heat resistance. The curable compound according to an embodiment of the present invention includes the following characteristics (a) to (e). (a) Number average molecular weight (calibrated with polystyrene standard): 1000 to 15000. (b) Proportion of a structure derived from an aromatic ring in the total amount of the curable compound: 50 wt. % or greater. (c) Solvent solubility at 25° C.: 1 g/100 g or greater. (d) Glass transition temperature: 280° C. or lower. (e) 5% Weight loss temperature (T.sub.d5) measured at a rate of temperature increase of 10° C./min (in nitrogen), for a cured product of the curable compound: 300° C. or higher.

Provided is a curable compound having a low melting temperature, having excellent workability as a result of having good solvent solubility, and being capable of forming a cured product having excellent heat resistance. The curable compound according to an embodiment of the present invention includes the following characteristics (a) to (e). (a) Number average molecular weight (calibrated with polystyrene standard): 1000 to 15000. (b) Proportion of a structure derived from an aromatic ring in the total amount of the curable compound: 50 wt. % or greater. (c) Solvent solubility at 25° C.: 1 g/100 g or greater. (d) Glass transition temperature: 280° C. or lower. (e) 5% Weight loss temperature (T.sub.d5) measured at a rate of temperature increase of 10° C./min (in nitrogen), for a cured product of the curable compound: 300° C. or higher.

The invention provides novel methods for preparing indolinobenzodiazepine dimer compounds and their synthetic precursors.

Synthesis of a sulfoxide-containing homobifunctional cysteine-reactive mass spectrometry-cleavable cross-linker for mapping intra-protein interactions in a protein and inter-protein interactions in a protein complex is provided. Methods for mapping intra-protein interactions in a protein and inter-protein interactions in a protein complex and cross-linking mass spectrometry for identifying one or more cross-linked peptides using the cross-linker are provided.

Synthesis of a sulfoxide-containing homobifunctional cysteine-reactive mass spectrometry-cleavable cross-linker for mapping intra-protein interactions in a protein and inter-protein interactions in a protein complex is provided. Methods for mapping intra-protein interactions in a protein and inter-protein interactions in a protein complex and cross-linking mass spectrometry for identifying one or more cross-linked peptides using the cross-linker are provided.

Provided is a maleimide resin with superior solution stability. Also provided is a cured product with a superior dielectric characteristic that is obtained by curing a curable resin composition in which said maleimide resin is used. The maleimide resin expressed in formula (1), wherein the N,N′-(phenylene-di-(2,2,-propylidene)-di-p-phenylene) bismaleimide content is 90 area % or less. (In formula (1), n is the number of repetitions, and 1<n<5.)

Provided is a maleimide resin with superior solution stability. Also provided is a cured product with a superior dielectric characteristic that is obtained by curing a curable resin composition in which said maleimide resin is used. The maleimide resin expressed in formula (1), wherein the N,N′-(phenylene-di-(2,2,-propylidene)-di-p-phenylene) bismaleimide content is 90 area % or less. (In formula (1), n is the number of repetitions, and 1<n<5.)

There is provided a curable compound having good solvent solubility and being capable of forming a cured material having super heat resistance. The curable compound according to the present invention is represented by the following formula (1). In the formula (1), R.sup.1 and R.sup.2 each represent a curable functional group; D.sup.1 and D.sup.2 each represent a single bond or a linking group; and L represents a divalent group having a repeating unit containing a structure represented by the following formula (I) and a structure represented by the following formula (II) (wherein Ar.sup.1 to Ar.sup.3 each represent a group made by eliminating two hydrogen atoms from a structural formula of an aromatic ring or a group made by eliminating two hydrogen atoms from a structural formula in which two or more aromatic rings are bound through a single bond or a linking group; X represents —CO—, —S— or —SO.sub.2—; each Y represents —S—, —SO.sub.2—, —O—, —CO—, —COO— or —CONH—; and n represents an integer of 0 or more): ##STR00001##

There is provided a curable compound having good solvent solubility and being capable of forming a cured material having super heat resistance. The curable compound according to the present invention is represented by the following formula (1). In the formula (1), R.sup.1 and R.sup.2 each represent a curable functional group; D.sup.1 and D.sup.2 each represent a single bond or a linking group; and L represents a divalent group having a repeating unit containing a structure represented by the following formula (I) and a structure represented by the following formula (II) (wherein Ar.sup.1 to Ar.sup.3 each represent a group made by eliminating two hydrogen atoms from a structural formula of an aromatic ring or a group made by eliminating two hydrogen atoms from a structural formula in which two or more aromatic rings are bound through a single bond or a linking group; X represents —CO—, —S— or —SO.sub.2—; each Y represents —S—, —SO.sub.2—, —O—, —CO—, —COO— or —CONH—; and n represents an integer of 0 or more): ##STR00001##