The present disclosure relates to a leveling composition for electrodepositing metals. The composition comprises a compound of formula (I):

##STR00001##

The present disclosure relates to a leveling composition for electrodepositing metals. The composition comprises a compound of formula (I):

##STR00001##

Described are a compound of formula (II) or (III):

##STR00001##

The compounds are effective in the treatment of disease, including a tauopathy condition or a disease of tau protein aggregation.

The present disclosure relates to a leveling compound for electrodepositing metals. The compound is of formula (I) or a salt thereof:

##STR00001##

The present disclosure relates to a leveling compound for electrodepositing metals. The compound is of formula (I) or a salt thereof:

##STR00001##

Described are a compound of formula (II) or (III): ##STR00001## The compounds are effective in the treatment of disease, including a tauopathy condition or a disease of tau protein aggregation.

The present disclosure relates to a leveling composition for electrodepositing metals. The composition comprises a compound of formula (I): ##STR00001##

The present disclosure relates to a leveling composition for electrodepositing metals. The composition comprises a compound of formula (I): ##STR00001##