Provided are an actinic ray-sensitive or radiation-sensitive resin composition including a compound (A) whose dissolution rate in an alkali developer decreases by the action of an acid, a resin (B) having a group that decomposes by the action of an alkali developer to increase the solubility in the alkali developer and having at least one of a fluorine atom or a silicon atom, and a resin (C) having a phenolic hydroxyl group, different from the resin (B), an actinic ray-sensitive or radiation-sensitive film and a mask blank, each formed using the actinic ray-sensitive or radiation-sensitive resin composition, a pattern forming method using the actinic ray-sensitive or radiation-sensitive resin composition, and a method for manufacturing an electronic device.

Provided are an actinic ray-sensitive or radiation-sensitive resin composition including a compound (A) whose dissolution rate in an alkali developer decreases by the action of an acid, a resin (B) having a group that decomposes by the action of an alkali developer to increase the solubility in the alkali developer and having at least one of a fluorine atom or a silicon atom, and a resin (C) having a phenolic hydroxyl group, different from the resin (B), an actinic ray-sensitive or radiation-sensitive film and a mask blank, each formed using the actinic ray-sensitive or radiation-sensitive resin composition, a pattern forming method using the actinic ray-sensitive or radiation-sensitive resin composition, and a method for manufacturing an electronic device.

A copolymer, a method for producing the copolymer, a porous structure formed by the copolymer, a method for producing the porous structure, and a porous carbon sphere formed by carbonizing the porous structure are shown. The copolymer has a chemical structure of formula (1) or (2):

##STR00001##

wherein the molecular weight of the copolymer structure is 120,000 or less g/mole, m and t are both greater than 0, 8%≦p≦80%, y≧0, z≧0, and X is selected from —Cl, —Br and —I.

A copolymer, a method for producing the copolymer, a porous structure formed by the copolymer, a method for producing the porous structure, and a porous carbon sphere formed by carbonizing the porous structure are shown. The copolymer has a chemical structure of formula (1) or (2):

##STR00001##

wherein the molecular weight of the copolymer structure is 120,000 or less g/mole, m and t are both greater than 0, 8%≦p≦80%, y≧0, z≧0, and X is selected from —Cl, —Br and —I.

A polyphenylene ether resin of Formula (1) and a resin composition including the polyphenylene ether resin of Formula (1) are provided. The resin composition is useful for making different articles, including a prepreg, a resin film, a laminate or a printed circuit board, which may achieve excellent multi-layer board thermal resistance and excellent height of impact whitening, in addition to the desirable properties such as fully dissolvable varnish, absence of branch-like pattern or dry board on laminate appearance, high glass transition temperature, low dissipation factor, low Z-axis ratio of thermal expansion and high copper foil peeling strength.

##STR00001##

A polyphenylene ether resin of Formula (1) and a resin composition including the polyphenylene ether resin of Formula (1) are provided. The resin composition is useful for making different articles, including a prepreg, a resin film, a laminate or a printed circuit board, which may achieve excellent multi-layer board thermal resistance and excellent height of impact whitening, in addition to the desirable properties such as fully dissolvable varnish, absence of branch-like pattern or dry board on laminate appearance, high glass transition temperature, low dissipation factor, low Z-axis ratio of thermal expansion and high copper foil peeling strength.

##STR00001##

A process for preparing an aqueous polymer dispersion, the process including forming a copolymer A from at least one α,β-monoethylenically unsaturated C.sub.3 to C.sub.6 monocarboxylic acid (monomers A1) and at least one other monoethylenically unsaturated compound (monomers A2); reacting the copolymer A with a metal compound M in an aqueous medium; and conducting free-radical polymerization of at least one ethylenically unsaturated compound (monomer P) in the presence of the copolymer A in an aqueous medium.

A process for preparing an aqueous polymer dispersion, the process including forming a copolymer A from at least one α,β-monoethylenically unsaturated C.sub.3 to C.sub.6 monocarboxylic acid (monomers A1) and at least one other monoethylenically unsaturated compound (monomers A2); reacting the copolymer A with a metal compound M in an aqueous medium; and conducting free-radical polymerization of at least one ethylenically unsaturated compound (monomer P) in the presence of the copolymer A in an aqueous medium.

A thiosulfate polymer composition includes an electron-accepting photosensitizer component, either as a separate compound or as an attachment to the thiosulfate polymer. The thiosulfate polymer composition can be applied to various articles, or used to form a predetermined polymeric pattern after photothermal reaction to form crosslinked disulfide bonds, removing non-crosslinked polymer, and reaction with a disulfide-reactive material. Such thiosulfate polymer compositions can also be used to sequester metals in nanoparticulate form, and as a way for shaping human hair in hairdressing operations.

A thiosulfate polymer composition includes an electron-accepting photosensitizer component, either as a separate compound or as an attachment to the thiosulfate polymer. The thiosulfate polymer composition can be applied to various articles, or used to form a predetermined polymeric pattern after photothermal reaction to form crosslinked disulfide bonds, removing non-crosslinked polymer, and reaction with a disulfide-reactive material. Such thiosulfate polymer compositions can also be used to sequester metals in nanoparticulate form, and as a way for shaping human hair in hairdressing operations.