An acrylic rubber contains a copolymer of a monomer mixture of: 25 to 46 wt. % of alkoxyalkyl acrylate, 23 to 37 wt. % of 2-ethylhexyl acrylate, 9 to 17 wt. % of alkyl methacrylate, 1 to 3 wt. % of monoalkyl fumarate and the remaining amount is ethyl acrylate. This acrylic rubber improves hydrolysis resistance by introducing a specific alkyl acrylic monomer with extremely low hydrolysis property i.e. low hydrophilicity, and at the same time satisfies all of oil resistance, cold resistance, and hydrolysis resistance in a well-balanced manner.

Latexes are provided which may comprise water and resin particles comprising a polymerization product of reactants comprising a dioxane/dioxolane monomer and a vinyl co-monomer, wherein the dioxane/dioxolane monomer is an ester of (meth)acrylic acid with an alcohol comprising a dioxane moiety, an ester of (meth)acrylic acid with an alcohol comprising a dioxolane moiety, or both.

Latexes are provided which may comprise water and resin particles comprising a polymerization product of reactants comprising a dioxane/dioxolane monomer and a vinyl co-monomer, wherein the dioxane/dioxolane monomer is an ester of (meth)acrylic acid with an alcohol comprising a dioxane moiety, an ester of (meth)acrylic acid with an alcohol comprising a dioxolane moiety, or both.

Monomers and polymers are provided that comprise a carbon alicyclic group or heteroalicyclic group that comprises 1) one or more acid-labile ring substituents and 2) one or more ether or thioether ring substituents. Photoresists that comprise such polymers also are provided.

An object of the present disclosure is to provide a photocurable composition from which a molded product having excellent mechanical properties is obtained. The present disclosure provides a photocurable composition containing a urethane (meth)acrylate oligomer and a vinyl monomer, wherein the vinyl monomer includes a first monomer having a glass transition temperature (Tg) of −100° C. or more and 20° C. or less, and a second monomer having a glass transition temperature (Tg) of more than 20° C. and 150° C. or less, an amount of the urethane (meth)acrylate oligomer ranges from 20 mass % to 80 mass %, an amount of the first monomer ranges from 15 mass % to 75 mass %, an amount of the second monomer ranges from 5 mass % to 65 mass %, and a total amount of the urethane (meth)acrylate oligomer and the vinyl monomer is 100 mass %.

An object of the present disclosure is to provide a photocurable composition from which a molded product having excellent mechanical properties is obtained. The present disclosure provides a photocurable composition containing a urethane (meth)acrylate oligomer and a vinyl monomer, wherein the vinyl monomer includes a first monomer having a glass transition temperature (Tg) of −100° C. or more and 20° C. or less, and a second monomer having a glass transition temperature (Tg) of more than 20° C. and 150° C. or less, an amount of the urethane (meth)acrylate oligomer ranges from 20 mass % to 80 mass %, an amount of the first monomer ranges from 15 mass % to 75 mass %, an amount of the second monomer ranges from 5 mass % to 65 mass %, and a total amount of the urethane (meth)acrylate oligomer and the vinyl monomer is 100 mass %.

The present invention is a resist composition comprises a polymer compound having one or two repeating units selected from repeating units represented by the following general formulae (p-1), (p-2) and (p-3), a repeating unit represented by the following formula (a-1) and the formula (a-2) polarities of which are changed by an action of an acid, and a repeating unit represented by the following formula (b-1); a salt represented by the following general formula (B); and a solvent, wherein a difference of a C log P of the repeating unit (a-1) before and after changing the polarity is 3.0 to 4.5, and a difference of a C log P of the repeating unit (a-2) before and after changing the polarity is 2.5 to 3.2. This provides a resist composition which has high sensitivity, wide DOF and high resolution, reduces LER, LWR and CDU, and has good pattern shape after exposure and excellent etching resistance. ##STR00001##

A resin for an energy device electrode contains a structural unit derived from a nitrile group-containing monomer; and a structural unit derived from a monomer represented by the following Formula (I), wherein the resin does not contain a structural unit that is derived from a carboxy group-containing monomer and that contains a carboxy group, or the resin has a ratio of a structural unit that is derived from a carboxy group-containing monomer and that contains a carboxy group of 0.01 moles or less with respect to 1 mole of the structural unit derived from a nitrile group-containing monomer, and a ratio of the structural unit derived from a nitrile group-containing monomer to a total of structural units derived from each monomer is from 90% by mole to less than 100%. ##STR00001##

The present invention provides an actinic ray-sensitive or radiation-sensitive resin composition containing (A) a resin having a polarity that increases by an action of an acid, and (B) a compound that generates an acid upon irradiation with actinic rays or radiation, represented by a specific general formula, is which the resin (A) includes a repeating unit represented by a specific general formula; and an actinic ray-sensitive or radiation-sensitive film formed of the actinic ray-sensitive or radiation-sensitive resin composition, a pattern forming method, and a method for manufacturing an electronic device.

The present invention provides an actinic ray-sensitive or radiation-sensitive resin composition containing (A) a resin having a polarity that increases by an action of an acid, and (B) a compound that generates an acid upon irradiation with actinic rays or radiation, represented by a specific general formula, is which the resin (A) includes a repeating unit represented by a specific general formula; and an actinic ray-sensitive or radiation-sensitive film formed of the actinic ray-sensitive or radiation-sensitive resin composition, a pattern forming method, and a method for manufacturing an electronic device.