[Problem] To provide a dental photocurable composition having sufficient mechanical property and being excellent in color tone selectivity because of having a small color difference between before curing and after curing. [Solution] To provide a dental photocurable composition, comprising (A) polymerizable monomer, (B) photosensitizer, (C) photoacid generator, (D) photopolymerization accelerator and (E) filler, wherein, the dental photocurable composition comprises (B-1) α-diketone compound as the (B) photosensitizer, and the dental photocurable composition comprises, with respect to 100 parts by mass of the (A) polymerizable monomer, 0.15 parts by mass or less of the (B-1) α-diketone compound, 0.5 parts by mass or more of the (C) photoacid generator, and 100 parts by mass or more of the (E) filler.

The present invention is a water dispersible copolymer for scavenging formaldehyde, the copolymer being based on acrylic copolymer comprising one or more acetoacetyl functional groups and one or more hydrophilic groups chemically bonded to its molecular backbone, wherein the acrylic copolymer has a number average molecular weight of 2000-100,000 g/mol; and wherein the acrylic copolymer comprises between 10 wt % and 30 wt % of the acetoacetyl functional groups relative to the weight of the acrylic copolymer. The present invention also refers to an aqueous dispersion containing said water dispersible copolymer, as well as an article coated by a coating comprising the aqueous dispersion.

The present invention is a water dispersible copolymer for scavenging formaldehyde, the copolymer being based on acrylic copolymer comprising one or more acetoacetyl functional groups and one or more hydrophilic groups chemically bonded to its molecular backbone, wherein the acrylic copolymer has a number average molecular weight of 2000-100,000 g/mol; and wherein the acrylic copolymer comprises between 10 wt % and 30 wt % of the acetoacetyl functional groups relative to the weight of the acrylic copolymer. The present invention also refers to an aqueous dispersion containing said water dispersible copolymer, as well as an article coated by a coating comprising the aqueous dispersion.

Provided is a method for forming a multilayer coating film including the following steps (1) to (4): (1) applying a base paint (X) to a substrate to form a base coating film; (2) applying a specific effect pigment dispersion (Y) to the base coating film formed in step (1) to form an effect coating film with a specific dry film thickness; (3) applying a clear paint (Z) to the effect coating film formed in step (2) to form a clear coating film; and (4) heating the uncured base coating film, the uncured effect coating film, and the uncured clear coating film formed in steps (1) to (3) to simultaneously cure these three coating films.

Provided is a method for forming a multilayer coating film including the following steps (1) to (4): (1) applying a base paint (X) to a substrate to form a base coating film; (2) applying a specific effect pigment dispersion (Y) to the base coating film formed in step (1) to form an effect coating film with a specific dry film thickness; (3) applying a clear paint (Z) to the effect coating film formed in step (2) to form a clear coating film; and (4) heating the uncured base coating film, the uncured effect coating film, and the uncured clear coating film formed in steps (1) to (3) to simultaneously cure these three coating films.

A negative resist composition comprising a polymer comprising recurring units having at least two acid-eliminatable hydroxyl or alkoxy groups in the molecule is effective for forming a resist pattern having a high resolution and minimal LER while minimizing defects.

An object of the present invention is to provide: a compound containing an imide group which is not only cured under film formation conditions of inert gas as well as air, generates no by-product and has excellent heat resistance and properties of filling and planarizing a pattern formed on a substrate, but can also form an organic underlayer film with favorable adhesion to a substrate. The present invention provides a material for forming an organic film, including: (A) a compound for forming an organic film shown by the following general formula (1A) or (1B); and (B) an organic solvent, ##STR00001##
noting that in the general formula (1A), when W.sub.1 represents any of ##STR00002##
R.sub.1 does not represent any of ##STR00003##

An object of the present invention is to provide: a compound containing an imide group which is not only cured under film formation conditions of inert gas as well as air, generates no by-product and has excellent heat resistance and properties of filling and planarizing a pattern formed on a substrate, but can also form an organic underlayer film with favorable adhesion to a substrate. The present invention provides a material for forming an organic film, including: (A) a compound for forming an organic film shown by the following general formula (1A) or (1B); and (B) an organic solvent, ##STR00001##
noting that in the general formula (1A), when W.sub.1 represents any of ##STR00002##
R.sub.1 does not represent any of ##STR00003##

A resist composition including a compound (D0) represented by general formula (d0) and a polymeric compound (A10) having a structural unit (a0) derived from a compound represented by general formula (a0-1) shown below (in formula (d0), n represents an integer of 2 or more; in formula (a0-1), W.sup.1 represents a polymerizable group-containing group; C.sup.t represents a tertiary carbon atom, and the α-position of C.sup.t is a carbon atom which constitutes a carbon-carbon unsaturated bond; R.sup.11 represents an aromatic hydrocarbon group which may have a substituent, or a chain hydrocarbon group; R.sup.12 and R.sup.13 each independently represents a chain hydrocarbon group, or R.sup.12 and R.sup.13 are mutually bonded to form a cyclic group ##STR00001##

A resist composition including a compound (D0) represented by general formula (d0) and a polymeric compound (A10) having a structural unit (a0) derived from a compound represented by general formula (a0-1) shown below (in formula (d0), n represents an integer of 2 or more; in formula (a0-1), W.sup.1 represents a polymerizable group-containing group; C.sup.t represents a tertiary carbon atom, and the α-position of C.sup.t is a carbon atom which constitutes a carbon-carbon unsaturated bond; R.sup.11 represents an aromatic hydrocarbon group which may have a substituent, or a chain hydrocarbon group; R.sup.12 and R.sup.13 each independently represents a chain hydrocarbon group, or R.sup.12 and R.sup.13 are mutually bonded to form a cyclic group ##STR00001##