A photocurable composition for three-dimensional stereolithography which has a lower viscosity and from which a cured product having a high refractive index is obtained, and a three-dimensional object formed by using the composition. The composition is a photocurable composition for three-dimensional stereolithography containing a fluorene monomer, a carbazole monomer, a diluent monomer, and a photopolymerization initiator, the carbazole monomer being contained in an amount of less than 30 wt % with respect to the total amount of the fluorene monomer and the carbazole monomer, and the diluent monomer being contained in an amount of at least 20 wt % with respect to total solids.

Disclosed are hydrophobic, acrylic materials having both high refractive index and a high Abbe number. The materials may have an internal wetting agent, are well suited for use as implantable ophthalmic devices, and have a refractive index which may be edited through application of energy. When used for an intraocular lens, the high refractive index allows for a thin lens which compresses to allow a small incision size.

Disclosed are hydrophobic, acrylic materials having both high refractive index and a high Abbe number. The materials may have an internal wetting agent, are well suited for use as implantable ophthalmic devices, and have a refractive index which may be edited through application of energy. When used for an intraocular lens, the high refractive index allows for a thin lens which compresses to allow a small incision size.

An optical adhesive including a viscoelastic or elastomeric adhesive layer and a cured polymer layer immediately adjacent the viscoelastic or elastomeric adhesive layer is described. The viscoelastic or elastomeric adhesive layer a refractive index less than 1.570 and the cured polymer layer has a refractive index of at least 1.570. An interface between the viscoelastic or elastomeric adhesive layer and the cured polymer layer is structured. The cured polymer layer has a storage modulus of at least 2000 MPa at 20° C. and a glass transition temperature of no more than 65° C.

An optical adhesive including a viscoelastic or elastomeric adhesive layer and a cured polymer layer immediately adjacent the viscoelastic or elastomeric adhesive layer is described. The viscoelastic or elastomeric adhesive layer a refractive index less than 1.570 and the cured polymer layer has a refractive index of at least 1.570. An interface between the viscoelastic or elastomeric adhesive layer and the cured polymer layer is structured. The cured polymer layer has a storage modulus of at least 2000 MPa at 20° C. and a glass transition temperature of no more than 65° C.

A polymer comprising a first repeating unit including an amino group protected by an alkoxycarbonyl group; a second repeating unit including a nucleophilic group; and a third repeating unit including a crosslinkable group, wherein the first repeating unit, the second repeating unit, and the third repeating unit are different from each other.

A compound including two or more constituent units derived from a monomer M having a radical polymerizable group and having a radical polymerizable group A at the terminal, in which the monomer M includes a monomer m having a structure that generates an active species by photoexcitation.

A compound including two or more constituent units derived from a monomer M having a radical polymerizable group and having a radical polymerizable group A at the terminal, in which the monomer M includes a monomer m having a structure that generates an active species by photoexcitation.

An adhesive sheet for temporary fixation which may have excellent heat resistance to exhibit a sufficient adhesive force even though it undergoes a high temperature process during a process of manufacturing a semiconductor device and may also exhibit a sufficient reduction of the adhesive force by photocuring during the step of peeling off, and a method of manufacturing a semiconductor device using the same, are provided.

An adhesive sheet for temporary fixation which may have excellent heat resistance to exhibit a sufficient adhesive force even though it undergoes a high temperature process during a process of manufacturing a semiconductor device and may also exhibit a sufficient reduction of the adhesive force by photocuring during the step of peeling off, and a method of manufacturing a semiconductor device using the same, are provided.