The present invention relates to novel photoaligning polymer materials, to their use as orienting layer for liquid crystals, which are used for the production of non-structured and structured optical elements, electro-optical elements, multi-layer systems or in nanoelectronics.

A resin composition for underlayer film formation capable of forming an underlayer film having good adhesiveness and excellent surface flatness, a layered product, a method for forming a pattern and a process for producing a device are provided. The resin composition for underlayer film formation includes a resin having a group represented by General Formula (A) and a group represented by General Formula (B), and a solvent. Ra1 represents a hydrogen atom or a methyl group, Rb1 and Rb2 each independently represents an unsubstituted linear or branched alkyl group having 1 to 20 carbon atoms or an unsubstituted cycloalkyl group having 3 to 20 carbon atoms, Rb3 represents an unsubstituted linear or branched alkyl group having 2 to 20 carbon atoms or an unsubstituted cycloalkyl group having 3 to 20 carbon atoms, and Rb2 and Rb3 may be bonded to each other to form a ring. ##STR00001##

A resin composition for underlayer film formation capable of forming an underlayer film having good adhesiveness and excellent surface flatness, a layered product, a method for forming a pattern and a process for producing a device are provided. The resin composition for underlayer film formation includes a resin having a group represented by General Formula (A) and a group represented by General Formula (B), and a solvent. Ra1 represents a hydrogen atom or a methyl group, Rb1 and Rb2 each independently represents an unsubstituted linear or branched alkyl group having 1 to 20 carbon atoms or an unsubstituted cycloalkyl group having 3 to 20 carbon atoms, Rb3 represents an unsubstituted linear or branched alkyl group having 2 to 20 carbon atoms or an unsubstituted cycloalkyl group having 3 to 20 carbon atoms, and Rb2 and Rb3 may be bonded to each other to form a ring. ##STR00001##

The present disclosure provides for new photoalignment (co)polymer materials which demonstrate improved adhesion to a substrate. The (co)polymeric structure includes at least one photochemically active chromophore and at least one adhesion promoter group. Articles of manufacture, optical elements, ophthalmic elements and liquid crystal cells which include at least one photoalignment layer made from the photoalignment (co)polymer materials and methods for formation are also disclosed.

Disclosed is a resin comprising a structural unit derived from a compound represented by formula (I) and a structural unit having an acid-labile group:

##STR00001## ##STR00002##

wherein R.sup.1 and R.sup.2 each independently represent an alkyl group which may have a halogen atom, a hydrogen atom or a halogen atom,

Ar represents an aromatic hydrocarbon group which may have a substituent,

L.sup.1 represents a group represented by formula (X.sup.1-1), etc.,

L.sup.11, L.sup.13, L.sup.15 and L.sup.17 each independently represent an alkanediyl group,

L.sup.12, L.sup.14, L.sup.16 and L.sup.18 each independently represent O, CO, COO, OCO or OCOO, and

* and ** are bonds, and ** represents a bond to an iodine atom.

A resin composition for primary coating of an optical fiber contains a photopolymerizable compound containing a difunctional urethane (meth)acrylate and a monofunctional urethane (meth)acrylate, and a photopolymerization initiator, the difunctional urethane (meth)acrylate is a reaction product of a diol, a diisocyanate, and a hydroxyl group-containing (meth)acrylate, and the monofunctional urethane (meth)acrylate is a reaction product of a polyoxyalkylene monoalkyl ether, a diisocyanate, and a hydroxyl group-containing (meth)acrylate, or a reaction product of a polyoxyalkylene monoalkyl ether and an isocyanate group-containing (meth)acrylate.

A resin composition for primary coating of an optical fiber contains a photopolymerizable compound containing a difunctional urethane (meth)acrylate and a monofunctional urethane (meth)acrylate, and a photopolymerization initiator, the difunctional urethane (meth)acrylate is a reaction product of a diol, a diisocyanate, and a hydroxyl group-containing (meth)acrylate, and the monofunctional urethane (meth)acrylate is a reaction product of a polyoxyalkylene monoalkyl ether, a diisocyanate, and a hydroxyl group-containing (meth)acrylate, or a reaction product of a polyoxyalkylene monoalkyl ether and an isocyanate group-containing (meth)acrylate.

Provided is an adhesive composition having high adhesiveness to polyamides. An adhesive composition for bonding adherends comprising a polyamide, comprising the following components (1) to (4): (meth)acrylates (1), excluding the component (2), comprising the following ingredients (1-1), (1-2), and (1-3): a (meth)acrylate (1-1), excluding an ingredient (1-3), having an aromatic group; a (meth)acrylate (1-2) having a hydroxy group; and a (meth)acrylate (1-3) represented by general formula (A); an acidic phosphate compound (2); a polymerization initiator (3); and a reducing agent (4) comprising a transition metal salt.

##STR00001##

Provided is an adhesive composition having high adhesiveness to polyamides. An adhesive composition for bonding adherends comprising a polyamide, comprising the following components (1) to (4): (meth)acrylates (1), excluding the component (2), comprising the following ingredients (1-1), (1-2), and (1-3): a (meth)acrylate (1-1), excluding an ingredient (1-3), having an aromatic group; a (meth)acrylate (1-2) having a hydroxy group; and a (meth)acrylate (1-3) represented by general formula (A); an acidic phosphate compound (2); a polymerization initiator (3); and a reducing agent (4) comprising a transition metal salt.

##STR00001##

A protective film composition includes a polymer having the following formula:

##STR00001## each of a, b, and c is a mole fraction; a+b+c=1; 0.05a/(a+b+c)0.3; 0.1b/(a+b+c)0.6; 0.1c/(a+b+c)0.6; each of R.sup.1, R.sup.2, and R.sup.3 is a hydrogen atom or a methyl group; R.sup.4 is a hydrogen atom, a butyrolactonyl group, or a substituted or unsubstituted C3 to C30 alicyclic hydrocarbon group; and R.sup.5 is a substituted or unsubstituted C6 to C30 linear or cyclic hydrocarbon group. A method of manufacturing a semiconductor package includes forming a sawing protective film on a semiconductor structure by using the protective film composition and sawing the sawing protective film and the semiconductor structure from the sawing protective film.