Aqueous polymer compositions and their use as coatings are disclosed. A composition includes at least one polyurethane (meth)acrylate A and at least one compound B having a molecular weight of below 1000 g/mol and having at least two ethylenically unsaturated double bonds per molecule. The polyurethane (meth)acrylates A include the following components: component A1 includes at least one polyisocyanate A1a and at least one diisocyanate A1b; component A2 includes at least one compound having at least one ethylenically unsaturated double bond, and at least one functional group F; component A3 includes at least one neutral polyol including at least one aliphatic, polymeric polyol A3a and at least one low molecular weight diol A3b; component A4 includes at least one compound having at least one ionic or ionizable group I and at least one functional group F; and component A5 includes at least one poly-C.sub.2-C.sub.3 alkylene ether.

A composition and process useful to make flexible polyurethane foams and in particular flexible molded polyurethane foams is disclosed. The usage of dipolar aprotic liquids such as DMSO, DMI, sulfolane, N-methyl-acetoacetamide, N, N-dimethylacetoacetamide as well as glycols containing hydroxyl numbers OH#1100 as cell opening aides for 2-cyanoacetamide or other similar molecules containing active methylene or methine groups to make a polyurethane foam is also disclosed. The advantage of using cell opener aids results in a) no foam shrinkage; b) lower use levels of cell opener; c) foam performance reproducibility d) optimum physical properties. In addition, combining the acid blocked amine catalyst together with the cell opener and the cell opener aid results in a less corrosive mixture as well as provides a method that does not require mechanical crushing for cell opening.

The present invention provides a moisture-curing sealant comprising a) at least one silane-functional polymer and b) at least one catalyst for the crosslinking of the silane-functional polymer, said sealant being free of organotin compounds and having, in the cured state, a secant modulus at 100% elongation and 23 C., determined to ISO 8339, of less than 0.4 MPa and a resilience at 100% elongation, determined to ISO 7389, of greater than 70%. The sealant is especially suitable as a construction sealant of the 25LM class according to DIN EN ISO 11600, especially as a facade sealant, or as a sealant according to ASTM C719 Class 50.

In one aspect, compositions are described herein, and in another aspect methods are described herein. In some embodiments, a polymerizable composition described herein comprises (i) one or more alkoxylated or alkenoxylated, or non-alkoxylated and non-alkenoxylated, citric acid, citrate, or ester/amide of citric acid; (ii) a polyol or polyamine such as a diel or diamine; and (iii) at least one of an associated or dissociated salt comprising a monovalent, divalent, or trivalent metal cation. In some cases, the polymerizable composition comprises additional monomers. In some cases, a composition described herein comprises a polymer or oligomer formed from a polymerizable compositions described herein. In other instances, a self-setting composite material comprising a mixture of a metal oxide crosslinker and a citrate based polymer, as well as methods of preparing same, are described herein.

The present invention provides a moisture-curing sealant comprising a) at least one silane-functional polymer and b) at least one catalyst for the crosslinking of the silane-functional polymer, said sealant being free of organotin compounds and having, in the cured state, a secant modulus at 100% elongation and 23 C., determined to ISO 8339, of less than 0.4 MPa and a resilience at 100% elongation, determined to ISO 7389, of greater than 70%. The sealant is especially suitable as a construction sealant of the 25LM class according to DIN EN ISO 11600, especially as a facade sealant, or as a sealant according to ASTM C719 Class 50.

The present invention provides an adhesive composition for a flexible printed wiring board containing (A) an epoxy resin; (B) no phosphorus-containing epoxy resin; and (C) a polyamide-imide resin.