The TPU of this invention contains unsaturation in its polymeric backbone. The unsaturation can be present in the soft segment or in the hard segment or in both the soft and hard segments of the TPU. The TPU can be molded like a thermoplastic, and can be subsequently crosslinked by exposure to electron beam irradiation into thermoset articles having excellent chemical resistance, dimensional stability, set properties, heat resistance, oxidative resistance, and creep resistance. In one embodiment, the TPUs of this invention are the reaction product (1) a hydroxyl terminated intermediate, (2) a polyisocyanate, (3) a saturated glycol chain extender, and (4) a glycol chain extender containing carbon-carbon double bonds, such as the allyl moieties present in trimethylolpropane monoallyl ether. In another embodiment of this invention, the thermoplastic polyurethane which is crosslinkable by e-beam irradiation is comprised of the reaction product of (1) a saturated hydroxyl terminated intermediate, (2) an unsaturated hydroxyl terminated intermediate, wherein the unsaturated hydroxyl terminated intermediate contains carbon-carbon double bonds, (3) a polyisocyanate, and (4) a saturated glycol chain extender.

The present invention relates to novel associative thickeners belonging to the category of the HEURs (Hydrophobically modified Ethoxylated URethanes) comprising an associative compound of bicycloheptane type for thickening aqueous compositions, and also to formulations compositions comprising such thickeners and to the final compositions, for example paint, lacquer, varnish or paper coating colour formulations.

The present invention relates to an inkjet composition having 1.0-5.0 mol/kg acryloyl groups comprising: i) photo polymerization reactive compound (M) containing exactly one acryloyl group, ii) photo polymerization reactive compound (N) containing at least two acryloyl groups, iii) radical photoinitiator (R), iv) cyanate ester compound (D) containing at least two cyanate groups and v) cyanate ester curing catalyst (C), wherein (M) is different from (D) and (N) is different from (D), 25-50 mol % of the contained acryloyl groups are provided by the reactive compound (N) and the molar ratio of contained acryloyl groups to contained cyanate groups of compound (D) is 0.30 to 0.95.

Disclosed are: a photosensitive resin composition containing (A) a photopolymerizable compound having an ethylenically unsaturated group and an acidic substituent and (B) a block isocyanate compound having a molecular weight of 3,000 or less; and a photosensitive resin film, a printed wiring board and a semiconductor package using the photosensitive resin composition.