Patent classifications
C08G18/698
POLYESTER PREPOLYMERS AS IMPACT MODIFIERS IN EPOXY FORMULATIONS
What is described is a polymer which is a polyurethane polymer having blocked isocyanate groups or a reaction product of said polyurethane polymer with at least one epoxy resin, where the polyurethane polymer having blocked isocyanate groups is an addition product formed from at least one polyisocyanate and at least one polyester polyol, wherein the isocyanate groups of the addition product have been blocked by reaction with at least one aromatic compound having at least one hydroxyl group. Such a polymer is suitable as an impact modifier in epoxy resin compositions, especially when they are used as adhesives or structural foams. The polymer improves the corrosion resistance and vertical expansion of the epoxy resin composition.
Polyurethane Adhesives for Bonding Low Surface Energy Films
The present invention relates to a polyurethane laminating adhesives, methods for producing a multilayer laminate by laminating at least two films with a polyurethane laminating adhesive, and multilayer laminates obtainable by these methods wherein the polyurethane laminating adhesive comprises an NCO-terminated polyurethane prepolymer obtainable by reacting a polyol mixture comprising: 0.1 to 20.0 wt % relative to the total weight of the polyol mixture of at least one polybutadiene polyol; and 5.0 to 99.9 wt % relative to the total weight of the polyol mixture of at least one polyether polyol, wherein the at least one polyether polyol comprises at least one polyether polyol with a number average molecular weight M.sub.n in the range of >1000 g/mol to 10000 g/mol; with at least one polyisocyanate, wherein the at least one polyisocyanate is used in an amount such that the isocyanate groups are present in molar excess relative to the hydroxyl groups of the polyol mixture. Also encompassed are the use of the described adhesives for laminating two or more films, and the multilayer laminates obtainable by the described methods.
URETHANE ADHESIVE COMPOSITION
An object of the present invention is to provide a urethane adhesive composition having excellent initial adhesiveness and excellent adhesion durability. The present invention is a urethane adhesive composition containing a urethane prepolymer (A) having an isocyanate group, an isocyanate compound (B) having an isocyanurate structure and an isocyanate group, and an adduct of a compound represented by Formula (X) below (in Formula (X), R.sup.11 and R.sup.12 each independently represent a hydrocarbon group) and a phenol compound.
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Heat-curing epoxy resin composition containing non-aromatic ureas as accelerator
Heat-curing epoxy resin compositions are characterized by high impact strength, good storage stability, and a low curing temperature. The epoxy resin compositions are suitable for use as a construction shell adhesive and for producing structural foams. They can already be cured in so-called bottom-baking conditions. Furthermore, it has been found that the use of an accelerator of the formula (Ia) or (Ib) results in an increase of the impact strength of heat-curing epoxy resin compositions.
ONE-COMPONENT TOUGHENED EPOXY ADHESIVES WITH IMPROVED HUMIDITY RESISTANCE
The present invention is a toughened one component epoxy adhesive composition demonstrating improved resistance to humidity. Wherein said one-part structural adhesive comprises: A) a blocked PU-polymer toughener compound; B) an epoxy resin component comprising a solid epoxy resin, a liquid epoxy resin, or mixture thereof; C) a curing agent; D) a urea compound; and E) optionally a filler, wherein the blocked PU-polymer toughener (A) is a reaction product of a reaction mixture comprising of: i) a polyether, ii) a hydroxyl-terminated polybutadiene, iii) a polyisocyanate, iv) a chain extender, and v) a capping group.
POROUS MATERIALS FOR ENERGY MANAGEMENT
Method for preparing porous polyurethane materials with controlled pore size and shape using isocyanates, polyols, and additives, and the porous polyurethane materials prepared therefrom. Method for preparing porous polyimides using at least one polyamine and a dianhydride and the porous polyimides materials prepared therefrom. The porous materials are useful for energy management, such as thermal, impact and vibration energy, and can exhibit improved fire-resistant performance.
CURABLE POLYFARNESENE-BASED COMPOSITIONS
A polymer having a hydrophobic polymer chain derived from monomers of farnesene and other optional monomers, such as dienes and vinyl aromatics. The polymer also includes one or more terminal functional groups, such as an amino group, a glycidyl group, a carboxylic acid group, a (meth)acrylate group, a silane group, an isocyanate group, an acetoacetate group, a phenolic group, and a hydroxyl group. Functional groups, such as carboxylic acids, may also be grafted along the hydrophobic polymer chain. The polymer may be incorporated in curable compositions that optionally include one or more polymer resins having similar functional groups. Methods for preparing the curable polymer compositions are also provided. The curable or cured form of the polymer composition may be used in various products, such as a sealant, a coating, a caulk, an electric potting compound, a membrane, a sponge, a foam, an adhesive, or a propellant binder.
Compositions containing hydrophobic modified isocyanate functional prepolymer containing adhesives
Disclosed are curable compositions containing isocyanate functional prepolymer containing two part adhesives wherein the prepolymers contain in their backbones hydrophobic segments and the curative part comprises one or more oligomeric or polymeric compounds having more than one isocyanate reactive groups; and one or more low molecular weight compounds having more than one isocyanate reactive groups wherein the low molecular weight compounds and the amount of such low molecular weight compounds are selected to such that the composition after full cure exhibits a ratio of modulus (e.g., Young's modulus or shear storage modulus) measured at −35° C. to the modulus measured at 23° C. of less than 10. The cured compositions exhibit higher stiffness across the common use temperature range and improved hydrolytic stability especially when exposed to elevated temperatures. Also disclosed are methods of bonding substrates together utilizing such compositions.
Thermoplastic polyurethane and composite article
A thermoplastic polyurethane is the reaction product of a polybutadiene diol, a polyester diol, and a isocyanate component. The polybutadiene diol has a weight average molecular weight (M.sub.w) of from 200 to 20,000 g/mol. The polyester diol has a melting point of from 40 to 90° C. The reactants allow the thermoplastic polyurethane itself to have a melt flow index measured at 120° C. and 22.6 kg of from 0.1 to 200 grams, per 10 minutes as measured according to ASTM 1238. The thermoplastic polyurethane also has a melting point of from 50 to 300° C. The thermoplastic polyurethane is used to form a composite article.
THERMOSETTING EPOXY RESIN COMPOSITION HAVING LOW CURING TEMPERATURE AND GOOD STORAGE STABILITY
A thermosetting epoxy resin composition including, as curing agent, a dihydrazide selected from the group consisting of glutaric dihydrazide, adipic dihydrazide and pimelic dihydrazide, in combination with a specific urea accelerator, which features good storage stability and a low curing temperature. The epoxy resin composition is especially suitable for use as bodywork adhesive.