A moisture-curable reactive hot-melt adhesive composition comprises: a urethane prepolymer having an isocyanate group, the urethane prepolymer being a reaction product of a polyol component comprising a polyester polyol, a polyether polyol and a polybutadiene polyol with an isocyanate component; and an antioxidant.

What is described is a polymer which is a polyurethane polymer having blocked isocyanate groups or a reaction product of said polyurethane polymer with at least one epoxy resin, where the polyurethane polymer having blocked isocyanate groups is an addition product formed from at least one polyisocyanate and at least one polyester polyol, wherein the isocyanate groups of the addition product have been blocked by reaction with at least one aromatic compound having at least one hydroxyl group. Such a polymer is suitable as an impact modifier in epoxy resin compositions, especially when they are used as adhesives or structural foams. The polymer improves the corrosion resistance and vertical expansion of the epoxy resin composition.

What is described is a polymer which is a polyurethane polymer having blocked isocyanate groups or a reaction product of said polyurethane polymer with at least one epoxy resin, where the polyurethane polymer having blocked isocyanate groups is an addition product formed from at least one polyisocyanate and at least one polyester polyol, wherein the isocyanate groups of the addition product have been blocked by reaction with at least one aromatic compound having at least one hydroxyl group. Such a polymer is suitable as an impact modifier in epoxy resin compositions, especially when they are used as adhesives or structural foams. The polymer improves the corrosion resistance and vertical expansion of the epoxy resin composition.

The present invention relates to the use of block copolymers produced from OH-functionalized polyolefins and polyesters in adhesives or sealants and to adhesives or sealants containing said block co-polymers.

There is provided a solid electrolyte composition containing an inorganic solid electrolyte having ion conductivity of a metal belonging to Group 1 or Group 2 in the periodic table and a binder containing non-spherical binder particles consisting of secondary particles formed of primary particles having an average particle size of 1 to 1,000 nm. There are also provided an all-solid state secondary battery, an electrode sheet for an all-solid state secondary battery, and an all-solid state secondary battery, which have a layer constituted of this composition.

An epoxy group-terminated impact modifier is described, comprising the reaction product of a) two or more polyols, b) one or more polyisocyanates, and c) at least one epoxy resin comprising a primary or secondary hydroxy group-containing epoxy compound, wherein the polyols comprise a1) at least one polyether polyol and a2) at least one OH-terminated rubber, wherein the weight ratio of polyether polyol to OH-terminated rubber is in the range from 7:3 to 2:8; an isocyanate-terminated prepolymer as possible intermediate product is described; furthermore a method for producing same is described. The products obtained are suitable for improving the impact resistance of epoxy resin compositions, in particular of 1K or 2K epoxy resin adhesives.

A process for regulating the water retention of soil materials used in agriculture involving providing a composition comprising a polymer selected from the group consisting of a urethane, a urethaneurea, a thiocarbamate and mixtures thereof, said polymer comprising hydrophobic and hydrophilic segments; and applying the composition onto soil materials used in agriculture to form a polymer film thereon, wherein the hydrophobic and hydrophilic segments together provide reversible hydrophobic-hydrophilic switching in response to water, such that the film surface switches from a relatively hydrophobic state in dry conditions to a relatively hydrophilic state in response to the presence of water in contact with the film surface.

The present invention relates to a thermoplastic polyurethane composition imparted with crosslinking sites, which comprise a thermoplastic polyurethane containing crosslinking sites incorporated into the molecule of a polyol and/or a chain extender. The thermoplastic polyurethane composition has an easy-to-process viscosity at a processing temperature of about 130 C. or below in a low-temperature foaming process that is performed using an existing EVA crosslinking/foaming system. Thus, the thermoplastic polyurethane composition may be easily mixed with a crosslinking agent, a foaming agent and various additives, and when it is press-molded or injection-molded to provide a crosslinked foam, foam cells are easily formed by the crosslinking sites incorporated into the molecule of the polyol and/or the chain extender. In addition, a foam produced using the thermoplastic polyurethane composition has excellent mechanical properties and also has varying specific gravities depending on the amount of the foaming agent used.

A polymer having a hydrophobic polymer chain derived from monomers of farnesene and other optional monomers, such as dienes and vinyl aromatics. The polymer also includes one or more terminal functional groups, such as an amino group, a glycidyl group, a carboxylic acid group, a (meth)acrylate group, a silane group, an isocyanate group, an acetoacetate group, a phenolic group, and a hydroxyl group. Functional groups, such as carboxylic acids, may also be grafted along the hydrophobic polymer chain. The polymer may be incorporated in curable compositions that optionally include one or more polymer resins having similar functional groups. Methods for preparing the curable polymer compositions are also provided. The curable or cured form of the polymer composition may be used in various products, such as a sealant, a coating, a caulk, an electric potting compound, a membrane, a sponge, a foam, an adhesive, or a propellant binder.

Heat-curing epoxy resin compositions are characterized by high impact strength, good storage stability, and a low curing temperature. The epoxy resin compositions are suitable for use as a construction shell adhesive and for producing structural foams. They can already be cured in so-called bottom-baking conditions. Furthermore, it has been found that the use of an accelerator of the formula (Ia) or (Ib) results in an increase of the impact strength of heat-curing epoxy resin compositions.