C08G18/76

Radiation polymerizable composition, cured layer of same, optical fiber containing cured layer and method for producing same

[Problem] To provide a radiation curable resin composition which is suitable as a primary material for optical fibers, while having a high curing rate by means of irradiation of radiation [Solution] A radiation polymerizable composition for forming an optical fiber primary coating layer, said composition containing: (A) a urethane oligomer containing a structure represented by formula (I) (in formula (I), R represents a vinyl group; and * represents a bonding hand); (B) one or more compounds selected from among (i) maleic acid anhydride, (ii) a compound represented by formula (II) (in formula (II), R.sup.I represents a single bond or an alkanediyl group having from 1 to 6 carbon atoms; and R.sup.2 represents a hydrogen atom, a hydroxy group or a specific group represented by formula (II-1) or formula (II-2)), and (iii) a compound represented by formula (III) (in formula (III), R.sup.5 represents an alkanediyl group having from 1 to 6 carbon atoms); and (C) a radiation polymerization initiator.

Curable Composition, Cured Product, and Method of Producing Cured Product
20230212345 · 2023-07-06 ·

One embodiment of the present invention provides a curable composition, including a polyfunctional isocyanate compound, a compound selected from the group consisting of a multivalent alcohol and an epoxy compound, and a base amplifier.

Method for the reduction of aldehyde emission in polyurethane foam

The invention is related to a method for reducing the emission of acetaldehyde and/or propionaldehyde from a polyurethane or polyurea foam, by using a reaction mixture comprising at least one isocyanate reactive component selected from the group consisting of a polyether polyol, a polyester polyol, a polyether polyamine and a polyester polyamine; an isocyanate component; and cyanoacetamide.

Two-component polyurethane sealant for application at low temperature
11549038 · 2023-01-10 · ·

A two-component composition is described which comprises A) an isocyanate component comprising an isocyanate-terminated urethane prepolymer, B) a water component comprising water, and at least one latent amine hardener in component A). The two-component composition of the invention is suitable as a sealant, in particular as a joint sealant. Particular advantages are that primerless application is possible with good adhesion, even at low temperatures, such as 4.4° C. or below. The substrate to be sealed are preferably concrete substrates.

Urethane adhesive cord treatment for power transmission belt and belt

A belt with a tensile cord embedded in an elastomeric body, having an adhesive composition impregnating the cord and coating the fibers. The adhesive composition is the reaction product of a polyisocyanate and a polyol, or a polyurethane prepolymer derived therefrom, and a polyamine curative and optionally additional polyol, and with optionally added plasticizer. At least one of the polyisocyanate, the prepolymer, and the polyamine are blocked with a blocking agent. The belt body may be of cast polyurethane, vulcanized rubber, or thermoplastic elastomer. The cord may have an adhesive overcoat.

Isocyanate composition and method for producing isocyanate polymer

An isocyanate composition according to the present invention contains: a difunctional or more-functional isocyanate compound; and 1.0 ppm by mass to 1.0×10.sup.4 ppm by mass, based on the isocyanate compound, of a compound having at least one unsaturated bond excluding unsaturated bonds constituting an aromatic ring, the compound being different from the isocyanate.

Method for producing a resin lens from a polyisocyanate and release agent at reduced pressure

Provided is a method for producing a resin lens, comprising: A) mixing a polyisocyanate, a modified isocyanate, a catalyst and a release agent, and performing vacuum defoaming at 0˜30° C. for 10˜90 min to obtain a material a; B) mixing the material a with a sulfur-containing compound, and performing vacuum defoaming at 15˜20° C. for 20˜120 min to obtain mixed monomers; and C) completing casting of the mixed monomers, and curing to obtain a resin lens. The present disclosure uses polyisocyanate and a modified isocyanate at the same time to prepare a resin lens with higher glass transition temperature and higher surface hardness without producing bank mark and edge fogging. The present disclosure further provides a method for producing modified isocyanate. The obtained modified isocyanate used with polyisocyanate further improves the glass transition temperature and surface hardness of the resin lens without producing bank mark and edge fogging.

Oligomer or polymer and composition comprising the same
11548972 · 2023-01-10 · ·

Disclosed is an oligomer or polymer obtained by reacting at least one monomeric, oligomeric or polymeric isocyanate having two or more isocyanate groups with 2-hydroxy-3-butenoic acid and/or at least one alkyl ester of 2-hydroxy-3-butenoic acid. A composition comprising a said oligomer or polymer is also disclosed.

Modified polyisobutylene-based polymers, methods of making, and medical devices

A modified polyisobutylene-based polymer, method of making, and a medical device that includes such polymer, wherein the modified polyisobutylene-based polymer includes urethane, urea, or urethane-urea groups, hard segments, and soft segments, wherein the soft segments comprise phenoxy-containing polyisobutylene residues, and the hard segments include diisocyanate residues and optionally chain extender residues.

Composition for a polishing pad, polishing pad, and process for preparing the same

In the composition according to the embodiment, the content of an unreacted diisocyanate monomer in a urethane-based prepolymer may be controlled to control the physical properties thereof such as gelation time. Thus, since the micropore characteristics, polishing rate, and pad cut rate of a polishing pad obtained by curing the composition according to the embodiment may be controlled, it is possible to efficiently manufacture high-quality semiconductor devices using the polishing pad.