Patent classifications
C08G59/245
Resin composition, copper clad laminate and printed circuit board using same
The present invention provides a resin composition comprising: (A) 100 parts by weight of epoxy resin; (B) from 10 to 80 parts by weight of benzoxazine resin; (C) from 10 to 50 parts by weight of dicyclopentadiene phenol resin; and (D) from 0.5 to 5 parts by weight of amine hardener; wherein the resin composition is free of diallyl bisphenol A (DABPA).
Resin composition, cured product, laminate, and electronic member
The present invention provides a resin composition containing an epoxy compound A having a specific structure having an aromatic ring, and having an epoxy equivalent in the range of from 500 to 10,000 g/eq, and an epoxy compound B having an epoxy equivalent in the range of from 100 to 300 g/eq, and a bonding agent containing the resin composition. Further, the present invention provides a cured product containing resin particles and a matrix resin, wherein the resin particles are a cured product of an epoxy compound A having a specific structure having an aromatic ring, and having an epoxy equivalent in the range of from 500 to 10,000 g/eq, and the matrix resin is a cured product of an epoxy compound B having an epoxy equivalent in the range of from 100 to 300 g/eq, and a laminate having a substrate and the cured product.
EPOXY RESIN COMPOSITION COMPRISING 2-(3,3,5-TRIMETHYLCYCLOHEXYL)PROPANE-1,3-DIAMINE AS HARDENER
An epoxy resin composition including A) at least one epoxy compound, and B) a hardener composition including B1) from 0.1%-100% by weight of 2-(3,3,5-trimethylcyclohexyl)propane-1,3-diamine, and B2) from 99.9%-0% by weight of at least one further diamine and/or polyamine, where the stoichiometric ratio of the epoxy groups of A) and the number of active hydrogen atoms of the functional groups of B) varies from 1:2 to 2:1.
COMPOSITION COMPRISING A POLYMER BASED ON EPOXIDE COMPOUNDS
The invention relates to a composition comprising components a), b) and c), to a process for the preparation thereof, and to the use thereof. In one embodiment, a composition is provided which comprises the following components a), b) and c): a) from 75 to 99.5% by weight of a polymer based on epoxide compounds, from 0.5 to 25% by weight of at least one polyhydric alcohol, and optionally additives, b) from 80 to 99% by weight of a curing agent which is suitable for curing the polymer based on epoxide compounds, from 1 to 20% by weight of a polycaprolactone-polysiloxane block copolymer, optionally an accelerator, and optionally additives, and c) optionally an accelerator.
CURABLE ADHESIVE COMPOSITIONS FOR FLEXIBLE SUBSTRATES
A thermally or photo curable adhesive composition containing a bisphenol F epoxy resin and a bisphenol A epoxy resin in a ratio between 2 and 10. The composition further contains at least one epoxy acrylate component and a rubber modified bisphenol. The adhesive composition is applicable by a melt or liquid coating technique and undergoes curing upon exposure to heat or radiation, showing improved viscoelastic properties and suitable to provide a cured product having superior durability.
EPOXY RESIN, EPOXY RESIN COMPOSITION, INORGANIC FILLER-CONTAINING EPOXY RESIN COMPOSITION, RESIN SHEET, CURED PRODUCT, AND EPOXY COMPOUND
An epoxy resin obtained by a reaction of an epoxy resin monomer having a mesogen backbone and having two glycidyl groups in one molecule with a divalent phenol compound having, as substituents, two hydroxyl groups on one benzene ring, in which a number average molecular weight in gel permeation chromatographic measurement is from 600 to 2,500.
PRIMER, SUBSTRATE EQUIPPED WITH PRIMER LAYER, METHOD FOR PRODUCING SUBSTRATE EQUIPPED WITH PRIMER LAYER, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
A primer for forming a primer layer on the surface of a substrate having surface free energy of 50 mN/m or higher, the primer including a liquid crystalline epoxy compound and a curing agent.
CHEMOENZYMATIC DEGRADATION OF EPOXY RESINS
Provided is a method for degrading epoxy resins by enzymatic route, in particular by adding an epoxy resin in a solvent followed by treatment with a glutathione S-transferase. A method for recycling a composite material comprising epoxy resin as well as the use of glutathione 5-transferase and eventually para-hydroxybenzoate hydroxylase for degrading epoxy resins are also provided.
IMPROVED FAST CURE EPOXY RESINS AND PREPREGS OBTAINED THEREFROM
This invention relates to a composition comprising a semisolid epoxy resin containing a curative dispersed therein. The curative has a particle size such that at least 90% of the particles have a size below 25 pm at ambient temperature of 21° C., wherein the composition further comprises a diluent containing a particulate filler. The composition is used as matrix in prepregs. The use of the diluent increases peel strength of the composition when brought into contact with metal or wood substrate.
WATERBORNE ONE COMPONENT NON-ISOCYANATE POLYURETHANE EPOXY HYBRID COATINGS
A method of preparing a composition for a one-package (1 K) waterborne non isocyanate polyurethane epoxy hybrid coating includes providing a cyclic carbonate; combining the cyclic carbonate with an internal emulsifier and a diamine to thereby obtain a non-isocyanate polyurethane (NIPU) prepolymer; subjecting the NIPU prepolymer to chain extension by combining the NIPU prepolymer with an epoxy resin, to thereby obtain a chain extended NIPU polymer; subjecting the chain extended NIPU polymer to neutralization by combining the chain extended NIPU polymer with a neutralizing agent, to thereby obtain a neutralized NIPU polymer; and dispersing the neutralized NIPU polymer in water to thereby provide a waterborne NIPU liquid dispersion.