A curable epoxy composition comprising a polyvalent epoxy compound (A) having a biphenyl structure and/or condensed polycyclic structure, a trivalent or higher polyvalent phenol type epoxy compound (B), and a triazine structure-containing phenol resin (C) and a film, laminated film, prepreg, laminate, cured article, and composite article obtained using the same are provided.

Provided is a structural member for electronic devices which uses a material that is flexible and has excellent restoration properties after extension and stress relaxation properties. The structural member for electronic devices has the following properties A and B: (Property A) In a case where predetermined deformation is applied, stress that applies the deformation is relaxed (reduced) with time: and (Property B) In a case where the stress that applies deformation is 0, the deformation rarely remains while a resin composition is recovered. That is, when stress is 0, residual strain substantially becomes 0 (specifically 3% or lower).

A resin composition of the present invention is a resin composition used for forming a stress relaxation layer (102) of a metal base copper-clad laminate (100) configured by laminating a metal plate (101), the stress relaxation layer (102), and a piece of copper foil (103) in this order, the resin composition including: an epoxy resin having a polyether structure; a phenoxy resin; and a heat dissipation filler, in which the resin composition satisfies a characteristic of a storage elastic modulus at 25° C. being equal to or more than 0.01 GPa and equal to or less than 1.6 GPa.

A composition formed of an epoxy resin incorporating a fire retardant.

An epoxy functionalized surfactant composition including a reaction product of: (a) a hydrophilic material and (b) an epoxy resin hydrophobe material having an average molecular weight of greater than about 370 Daltons; the above epoxy functionalized surfactant composition being used to prepare a waterborne epoxy dispersion composition including (A) the above epoxy functionalized surfactant composition, (B) an epoxy resin, and (C) water; and processes for preparing the epoxy functionalized surfactant composition and the above waterborne epoxy dispersion composition.

Provided is an epoxy resin composition with improved heat resistance and resin elongation. Further provided is a fiber-reinforced composite material which uses the epoxy resin composition and thereby excels in compression strength in high-temperature environments and interlaminar toughness. The epoxy resin composition comprises the constituents [A], [B] and [C], 8-40 mass % of [B] is contained in the epoxy resin composition. The number of moles of active hydrogen contained in [C] is 1.05-2.0 times the number of moles of epoxy groups contained in the entire epoxy resin composition, in a cured resin formed by curing the epoxy resin composition and having a degree of curing of at least 90% obtained by DSC (differential scanning catorimetry), [A], [B] and [C] form a monolayer structure, or a phase separation structure of less than 500 nm. The rubber state modulus of elasticity Y (MPa) and glass transition temperature X (° C.) obtained by DMA (dynamic mechanical analysis) of the cured resin satisfy formula (1). [A] amine type epoxy resin [B] thermoplastic resin [C] aromatic amine

0.19X/° C.-31.5≦Y/MPa≦0.19X/° C.-27   (1)

Compositions for a curable substance for fixing purposes, comprising an epoxy component (a), which contains curable epoxides, and a hardener component (b), which comprises a Mannich base formulation, obtainable by reaction of specific amines, and/or mixtures of styrenated phenols with low molecular weight amines, to novel Mannich base formulations or mixtures of styrenated phenols with low molecular weight amines, and to the use of such Mannich base formulations and/or of such mixtures of styrenated phenols with low molecular weight amines, and in each case especially further additional ingredients, especially in hardener components for epoxy resins.

The invention is directed to a method of controlled conversion of thermosetting resins and additive manufacturing thereof by selective laser sintering. Partial curing of a thermosetting formulation can be used to increase the T.sub.g of the resin and minimize the additional cure needed to cross-link a printed object. After printing, the partially cured material is finally cured via a slow temperature ramp maintained just below the material's evolving T.sub.g.

The present invention provides thermosetting resin pre-impregnated or infused fiber materials or prepregs comprising a thermosetting resin mixture and a fiber material component of a heat resistant fiber, such as carbon fiber, having an areal weight of from 500 to 3,000 g/m2 having a coating of from 0.5 to 4 phr of a latent, particulate curative or solid curative, preferably, dicyandiamide, wherein the prepregs are infused with a thermosetting resin mixture comprising (a) at least one liquid epoxy resin, and (b) a hardener and/or a catalyst, as well as methods of making the same. The prepregs of present invention enables the simple provision of lightweight composites having consistent resin cure throughout.

A method i for forming an epoxidized polymer is provided. The method may include mixing an epoxidized plant oil with a synthetic epoxy resin and crosslinking the epoxidized plant oil and the synthetic epoxy resin using a curing agent. The epoxidized plant oil may be formed via: converting plant oil triglycerides to fatty amide alcohols via aminolysis using primary or secondary amines, converting the fatty amide alcohols to epoxidized fatty amide alcohols, and reacting the epoxidized fatty amide alcohols with vinyl monomers to obtain epoxidized plant oil monomers.