An epoxy resin includes a reaction product between an epoxy compound and a compound having a naphthalene structure and a functional group that is reactive with an epoxy group.

A reinforcing resin composition includes an epoxy resin (A), a phenolic resin (B), and a benzoxazine compound (C).

An accelerator composition for epoxy resin formulations, the accelerator composition including (i) at least one transition metal complex and (ii) at least one salt where the cation of the salt is a metal or an onium cation with a non-nucleophilic anion; and a curable epoxy resin composition including (A) at least one epoxy thermosetting resin, (B) at least one curing agent, and (C) the above accelerator; a curable epoxy resin composition containing the above accelerator; and a cured thermoset produced from the above curable epoxy resin composition.

The disclosure relates to thermosetting reinforced resin compositions and methods of forming boards, sheets and/or films using of porous particulates impregnated with embedded live monomer and/or oligomer and/or polymer configured to partially leach out a functional terminal end of the live monomer and/or oligomer and/or polymer and react with a cross-linking agent and photoinitiated polymer radicals to form a reinforced board, sheet and/or film of hybrid interpenetrating networks.

The present invention relates to epoxy curing agents which are obtained from the reaction of a polyalkylene polyether modified polyepoxide resin and a polyamine component. They polyamine component is a reaction product of a polyethylene polyamine having 3 to 10 nitrogen atoms, for example, diethylenetriamine (DETA), and at least one aldehyde having 1 to 8 carbon atoms, for example, formaldehyde. The epoxy curing agent may be used as part of a two component coating system in the curing of liquid or pre-dispersed curable epoxy resins.

The present invention relates to a conductive composition containing a conductive metal powder and a resin component, in which the conductive metal powder contains at least a metal flake having a crystalline structure in which a metal crystal grows in a flake shape, and the resin component contains an aromatic amine skeleton.

A liquid sealing material which has excellent PCT (pressure cooker test) resistance, and an electronic component which is obtained by sealing a part to be sealed with use of the liquid sealing material. A liquid sealing material contains (A) a liquid epoxy resin, (B) a curing agent, (C) a silica filler and (D) a coupling agent, and the boron content in the silica filler (C) has an average of 1-50 ppm.

A curing agent composition for an epoxy resin compound useful for the chemical fastening of construction elements, an epoxy resin compound, and a multi-component epoxy resin system are provided. Methods for the chemical fastening of construction elements in boreholes and the use of a salt (S) as an accelerator in an epoxy resin compound for chemical fastening are provided, the epoxy resin compound including a benzoxazine-amine adduct and an amine which is reactive to epoxy groups.

A hardener for epoxy resins, containing at least one amine A1 of formula (I) and at least one amine A2 of formula (II), the weight ratio of amine A1 to amine A2 ranging between 20/1 and 1/2. The hardener allows the manufacture of low-emission epoxy resin adhesives having good workability, a sufficiently long pot-life and open time with rapid curing, high strength, low brittleness, high adhesion, in particular to steel, and a sufficiently high glass transition temperature.

Provided are: a resin composition, containing a polyester polyurethane resin (A), an epoxy resin (B), and a polyamide resin (C); as well as a bonding film, a layered body including a resin composition layer, a layered body, and an electromagnetic wave shielding film, each using the resin composition.