An epoxy resin composition is provided which includes a poly-naphthalene-based epoxy resin having two or more epoxy groups per molecule combined with a non-linear multi-phenyl epoxy resin and an additional epoxy resin having an epoxy functionality of 3 or more, as well as a prepreg, and a fiber-reinforced composite material prepared using the epoxy resin composition. More specifically, an epoxy resin composition is provided which contains a combination of particular types of epoxy resins and curatives that, when cured, provides high flexural modulus and that is suitable for preparing a fiber-reinforced composite material capable of withstanding extreme use environments such as low-temperature environments and high-temperature moisture-absorbing environments. In addition, epoxy resin systems are provided which are capable of achieving a high Tg along with good thermal stability for long periods of time at elevated temperatures (e.g., 180° C. or more) when cured at 210° C. for 2 hours.

The present invention relates to a resin composition containing a transparent resin and a light absorber, wherein a cured product of the resin composition has an absorption maximum wavelength in a wavelength range of 550 to 720 nm.

A method for protecting a substrate from lightning strikes is provided including providing a lightning strike protectant composition to the substrate. The lightning strike protectant composition comprises a reactive organic compound and a conductive filler that, during the cure of the organic compound, is capable of self-assembling into a heterogeneous structure comprised of a continuous, three-dimensional network of metal situated among (continuous or semi-continuous) polymer rich domains. The resulting composition has exceptionally high thermal and electrical conductivity.

Laminate, method of manufacturing laminate, transistor, and method of manufacturing transistor using a composition having the following (a) to (c): (a) a first organic compound represented by Formula (1) below (R represents a hydrogen atom or a glycidyl group. A plurality of Rs may be identical to or different from each other, but each of at least two Rs is a glycidyl group), (b) a second organic compound represented by Formula (2) below, and (c) a photocationic polymerization initiator

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A hardener composition including: (a) a polymeric adduct; (b) a monomeric unmodified amine; and (c) an extender; a curable composition including (A) at least one epoxy compound; and (B) the above hardener composition; and a thermoset prepared from the above curable composition.

Provided is a Fresnel lens which has excellent heat resistance and which can covert light even from a poor-quality semiconductor light sources into uniform, high-quality light and can disperse the resulting light without lowering the central illuminance. The Fresnel lens according to the present invention includes two or more sawtooth prisms in a surface thereof and is made of a cured product of a curable composition containing an epoxy compound (A). Of the sawtooth prisms, a sawtooth prism having a longest inclined side in a cross section has a roughened surface, where the cross section is given by cutting the Fresnel lens in a plane which passes through the center of the Fresnel lens and which is perpendicular to a reference plane of the Fresnel lens.

An amine of the formula (I) for use as hardener for epoxy resins, hardeners for epoxy resins containing the amine of the formula (I) and resultant epoxy resin compositions which more particularly can be used as low-emission room-temperature-curing epoxy-resin coatings with high hardness and surface quality. The amine of the formula (I) has little odour and is a very successful diluent for epoxy resin compositions. It is more particularly obtained by reductive alkylation from 1,2-propylenediamine and an aldehyde or ketone.

The present invention relates to compositions and methods for reducing or preventing the loss of drilling fluids and other well servicing fluids into a subterranean formation during drilling or construction of boreholes in said formation. Specifically, this invention comprises a curable thermosetting composition comprising a polyfunctional (meth)acrylate, a polyfunctional (meth)acrylamide, or mixture thereof, one or more epoxy resin, and one or more (cyclo)aliphatic polyamine.

A curable composition includes (A) a first component having from 5.0 wt % to 39.0 wt %, based on the total weight of the first component, of a toughening agent component including a Bisphenol F based epoxy resin and an urethane acrylate component, a hardener component having at least one amine based hardener and is present in a ratio of 0.8 to 1.2, based on a number of equivalents of amino hydrogen groups in the hardener component to a number of equivalents of reactive groups in the first component capable of forming a covalent link with the amine reactive groups in the hardener, and an epoxy base component that accounts for a remainder of the total weight of the first component and that has at least one epoxy resin separately provided from the Bisphenol F based epoxy resin. The Bisphenol F based epoxy resin is present in an amount from 2.5 wt % to 50.0 wt % and the urethane acrylate component is present in an amount from 50.0 wt % to 97.5 wt %, based on the total weight of the toughening agent component. The urethane acrylate component includes the capping reaction product of an acrylate and an isocyanate terminated prepolymer and the isocyanate-terminated prepolymer is the reaction product of a polyisocyanate and at least a DMC derived polyol having a molecular weight of at least 3000 g/mol. The curable composition may further include (B) an optional second component that has at least one of a filler and any additional ingredient for a targeted application of the curable composition.

A composition including an amidoamine curing agent composition or a polyamide curing agent composition are disclosed. The composition includes the reaction products of (1) an amine component including at least one multifunctional amine of structure (I):

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wherein each R is independently H or CH.sub.2CH.sub.2CH.sub.2NH.sub.2; R.sub.1 is H, CH.sub.3CH.sub.2CH.sub.2N—, C1-C21 alkyl, or C1-C21 alkenyl; n is 2; and m is 1 or 2, with (2) a fatty acid or ester component selected from the group consisting of a dimer fatty acid or ester component, a monofunctional fatty acid or ester component, and combinations thereof. The amidoamine curing agent composition remains as liquid at ambient temperature.