A protective film forming composition forms a flat film having good mask function against a wet etching liquid during a semiconductor substrate processing, high dry etching rate and good coverage of a substrate with level difference, while having small film thickness difference after embedding. A protective film is produced using this composition. A substrate has a resist pattern. A method produces a semiconductor device. A composition forms a protective film against a wet etching liquid for semiconductors, containing a solvent and a ring-opened polymer (C) obtained by reaction between a diepoxy compound (A) and a bi- or higher functional proton-generating compound (B). The ring-opened polymer (C) is preferably represented by a unit structure of formula (A-1). (In formula (A-1), Q represents a divalent organic group generated by the diepoxy compound (A) ring-opening polymerization; and T represents a divalent organic group derived from the bi- or higher functional proton-generating compound (B)).

A composition contains a phenolic compound represented by General Formula (1), an epoxy compound, and an inorganic substance.

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An epoxy resin obtained by a reaction of an epoxy resin monomer having a mesogen backbone and having two glycidyl groups in one molecule with a divalent phenol compound having, as substituents, two hydroxyl groups on one benzene ring, in which a number average molecular weight in gel permeation chromatographic measurement is from 600 to 2,500.

The present application relates to a curable composition. The curable composition of the present application exhibits excellent adhesion ability and liquid crystal orientation ability simultaneously before or after curing, so that it can be effectively applied to various optical uses.

The present invention relates to a cross-linkable composition comprising an epoxy oligomer comprising at least six hydroxy groups, to a coating obtained by curing the cross-linkable composition and to an optical lens comprising said coating on a surface thereof, in particular on the edge surface thereof. The invention also relates to a method of preparing a coating for an optical lens and to a method of coating a surface of an optical lens, in particular the edge surface of an optical lens.

A curable coating composition precursor comprising a first part (A) and a second part (B). The first part (A) comprises at least one first epoxy curing agent selected from aliphatic and cycloaliphatic amines and any combinations and mixtures thereof. The second part (B) comprises at least epoxy compound selected from bisphenol A and bisphenol F diglycidylether resins, and any combinations and mixtures thereof; at least one polyfunctional epoxy resin; at least one novolac epoxy resin; and optionally, at least one reactive diluent, Part (A) and/or part (B) comprise at least one inorganic phosphate compound.

The present invention provides a conductive metal resin multilayer body that comprises: a metal foil; and a resin layer which is arranged on at least one surface of the metal foil, and which contains a resin, organic fibers and a conductive filler that is formed of a non-metal material.

There are provided: a microcapsule that includes a shell part containing a polymer and a core part which is encapsulated in the shell part, where the core part contains a coloring material and the polymer has an ultraviolet absorbent skeleton in the main chain thereof; and an application of the microcapsule.

A dispersion includes a hyperbranched polymer having latent crosslinking functionality and comprising the reaction product of: a partially neutralized, acid-functional resin; and an epoxy; and optionally, an effective amount of a crosslinking agent; wherein: the partially neutralized, acid-functional resin comprises the reaction product of a mixture of: a first acid-functional resin with a base and a second acid-functional resin; or a first and a second acid-functional resin with a base; the first acid-functional resin is not the same as the second acid-functional resin; at least one of the acid functional resins comprises a further functional group capable of Schiff-Base crosslinking after film formation; and the dispersion is a single pack waterborne polymer dispersion.

The present invention provides a resin composition for an acoustic matching layer which maintains uniform dispersibility of a hollow filler, can suppress bubble trapping, and is excellent in moldability and handleability. The resin composition for an acoustic matching layer, comprises a resin, a hollow filler, and a thixotropy imparting agent, wherein the resin composition has a viscosity measured using a B-type viscometer with rotor No. 4 at a rotation speed of 0.3 rpm at 25° C. of 1130 to 4000 Pa.Math.s, and has a thixotropy index expressed by the ratio (V1/V2) between a viscosity (V1) measured using a B-type viscometer with rotor No. 4 at a rotation speed of 0.3 rpm and a viscosity (V2) measured using a B-type viscometer with rotor No. 4 at a rotation speed of 1.5 rpm, at 50° C., of 3.0 to 5.0.