Patent classifications
C08G59/245
Epoxy resin composition, prepreg and molded body
An epoxy resin composition including components (A), (B), (C) and (D); wherein a content of the component (A) is 60 to 90 parts by mass, and a content of the component (B) is 10 to 40 parts by mass, with respect to epoxy resins; the epoxy resin composition has a characteristic that, when cured and formed into a cured product, the cured product has a glass transition temperature of 200° C. or higher; and a viscosity at 100° C. of the resin composition is 5 to 35 Pa.Math.s, wherein Component (A) is an aromatic epoxy resin having at least 3 glycidyl groups in one molecule, Component (B) is an aromatic epoxy resin having two glycidyl groups in one molecule, Component (C) is an aromatic polysulfone resin having a reduced viscosity of 0.18 to 0.30 dl/g; and Component (D) is an aromatic amine compound.
Methods of preparing compositions for containers and other articles and methods of using same
This invention provides a polymer, which is preferably a polyether polymer. The polymer may be uses in coating compositions. Containers and other articles comprising the polymer and methods of making such containers and other articles are also provided. The invention further provides compositions including the polymer (e.g., powder coatings), which have utility in a variety of coating end uses, including, for example, valve and pipe coatings.
Thermosetting epoxy resin composition for the preparation of articles for electrical engineering, and the articles obtained therefrom
A multiple component anhydride-free, thermosetting epoxy resin composition comprising, (A) at least one epoxy resin, and (B) at least one curing agent selected from the group of (b1) a polyetheramine of the formula (1) (Formula (1)), wherein x is a number of from 2 to 8, and (b2) a polyetheramine with at least one terminal end group of the formula (2) (Formula (2)), and (C) at least one epoxy silane, is, in particular, suitable for the manufacture of instrument transformers and dry-type transformers by casting, potting and encapsulation processes, wherein said articles exhibit good mechanical, electrical and dielectrical properties. ##STR00001##
A CURABLE COMPOSITION AND A METHOD FOR ADHERING SUBSTRATES WITH THE SAME
Described is a curable composition, and particularly a two-component composition comprising a silane modified polymer; an epoxy resin terminated with epoxy terminal group; wherein the composition further comprises a hardening-compatibilizing agent which has at least one silane group and at least two amine groups. The curable composition exhibits enhanced adhesion strength and good elongation at break. A method for applying the curable composition on the surface of a substrate is also provided.
SHEET MOLDING COMPOUND RESIN COMPOSITION, SHEET MOLDING COMPOUND, MOLDED ARTICLE, AND METHOD FOR PRODUCING SHEET MOLDING COMPOUND
A sheet molding compound resin composition containing a thermosetting resin (A), a resin-curing agent (B), and a glycidyl ether (C) including an alkyl group having a carbon atom number of 7 to 14 and a glycidyl group is provided. The sheet molding compound resin composition can be favorably used for a sheet molding compound and a molded article of the sheet molding compound as a result of having excellent impregnating ability with respect to carbon fiber regardless of the resin viscosity.
Curing agent for epoxy resins
The present disclosure provides a curing agent comprising a polyetheramine, a tertiary amine and an alkanolamine. The curing agent may be combined with an epoxy resin to form a curable composition which is capable of being applied to a substrate and cured to form a cured article.
RESIN COMPOSITION AND MOLDED ARTICLE
Provided are a resin composition, which is used for transfer molding, including a resin (A), a magnetic powder (B) having a median diameter of 7.5 to 100 μm, and particles (C) having a median diameter of 0.2 to 5 μm, in which a saturation magnetic flux density of a molded article obtained by transfer molding the resin composition at 175° C. is equal to or more than 1.1 T; and a molded article formed of the resin composition. The particles (C) may include a magnetic powder or a non-magnetic powder.
BORON NITRIDE POWDER, METHOD OF MANUFACTURING BORON NITRIDE POWDER, RESIN MATERIAL, AND METHOD OF MANUFACTURING RESIN MATERIAL
Provided is a boron nitride powder having excellent adhesion to a resin. The boron nitride powder has a hexagonal structure, has a carboxyl group present on a surface of the boron nitride powder, and has a molar ratio of carboxyl group to nitrogen atom of 0.001 or more on a surface of the boron nitride powder.
A CURABLE COMPOSITION AND A METHOD FOR APPLYING THE SAME
Described is a curable composition comprising a silane modified polymer; an epoxy resin terminated with epoxy terminal group; a compatibilizer having at least one silane group and at least one epoxy terminal group or at least one nitrogen-containing groups; and optionally a hardening agent; wherein the composition further optionally comprises at least one of a nitrogen-containing unsaturated heterocyclic compound catalyst and a nitrogen-containing phenol catalyst. The curable composition exhibits high hermeticity, fast curing speed, quick adhesion build up, dry surface and strong adhesion strength. A method for applying the curable composition on the surface of a substrate is also provided.
EPOXY RESIN COMPOSITION, PREPREG, AND FIBER REINFORCED COMPOSITE MATERIAL
An object of the present invention is to provide an epoxy resin composition that can be preferably used for prepreg and fiber reinforced composite material applications, has high Tg, and is excellent in elastic modulus and strength. The present invention is the epoxy resin composition including the following components [A] to [C] and satisfying the following conditions (1) to (2): [A]: epoxy resin [B]: polyamine curing agent, and [C]: a compound having a boiling point of 130° C. or more and a molecular weight m of 50 or more and 250 or less, the compound having no epoxy group in the molecule and having substantially no curing ability of an epoxy resin, (1): at least a part of the component [C] satisfies that the sum of the polar component and the hydrogen bond component in the Hansen solubility parameters is 10.0 or less, (2): the ratio C/E of the amount by mole, E, for epoxy groups of the component [A] to the amount by mole, C, of the component [C] satisfying the condition (1) is 0.01 or more and 0.20 or less.