A polymer composite formed from an epoxy based polymer and an amino-graphene. The epoxy based polymer forms a polymer matrix and the amino graphene is dispersed throughout the polymer matrix. Further, a graphene is functionalized with 3,5-dinitrophenyl groups to form functionalized graphene and one or more amine functional groups form Meisenheimer complexes with the functionalized graphene to form the amino-graphene. An associated method of making the polymer composite is also provided.

Epoxy curing agents are disclosed having an epoxy curing agent comprising at least one room temperature ionic liquid salt, the room temperature ionic liquid salt being a reaction product of (a) at least one polyalkylene polyamine compound represented by formula (I):

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wherein x, y, and z are integers of 2 and 3, m and n and integers of 1-3; and (b) an organic acid having pKa (the negative of the logarithm of the acid dissociation constant) less than 6. The liquid salt is a stable liquid at a temperature greater than 15° C. Curable epoxy-based compositions including the curing agent and articles formed by the curable epoxy-based compositions are also disclosed.

The present invention relates to the field of a protection system based on composite material used in ballistics. The application relates to a two-steps light and heat curable resin composition, a process of forming in a first step a prepreg using said resin and in a second step a protection system comprising the laminated composite of the invention.

An object of the present invention is to provide a composition for forming a thermally conductive material, from which a thermally conductive material having excellent thermally conductive properties can be obtained. In addition, another object of the present invention is to provide a thermally conductive material formed of the composition for forming a thermally conductive material, a thermally conductive sheet, and a device with a thermally conductive layer.

A composition for forming a thermally conductive material of the present invention includes an epoxy compound, an inorganic substance, and a compound X containing one or more functional groups selected from the group consisting of an alkenyl group, an acrylate group, a methacrylate group, a silyl group, an acid anhydride group, a cyanate ester group, an amino group, a thiol group, and a carboxylic acid group, or having a polyamic acid structure, in which a content of the inorganic substance is 10% by mass or more with respect to a total solid content of the composition, and a content of the compound X is 10% by mass or more with respect to the total solid content of the composition.

Provided is a resin composition for an acoustic matching layer, the resin composition including metal particles (A), an epoxy resin (B), a polythiol compound (C), and a cure-accelerating compound (D). The epoxy resin (B) includes at least one epoxy resin selected from the group consisting of bisphenol A epoxy resins, bisphenol F epoxy resins, and phenol novolac epoxy resins, and the polythiol compound (C) includes a compound having at least two specific partial structures. Also provided are a cured product formed of the composition, an acoustic matching sheet, an acoustic probe, an acoustic measuring apparatus, and a method for producing an acoustic probe. Further provided is an acoustic matching layer material set suitable for preparation of the composition.

A curable composition including a first compound having a group represented by general formula (x) and an epoxy group and having a molecular weight of 1000 or less. In the general formula (x), Rf.sub.1 and Rf.sub.2 each independently represent a fluorine-containing alkyl group.

—C(Rf.sub.1)(Rf.sub.2)—OH  (x)

A carbonate-containing epoxy resin and a manufacturing method for a carbonate-containing epoxy resin, an epoxy curable product and a method for degrading an epoxy curable product are provided. The carbonate-containing epoxy resin includes a structure represented by formula (I) or formula (II). Formula (I) and formula (II) are defined as in the specification.

The purpose of the present invention is to provide: an epoxy resin composition having both excellent dispersibility of a solid curing agent and excellent impregnation of reinforcing fibers; a molding material for the fiber-reinforced composite material that has excellent dispersibility of the solid curing agent in the post-thickened resin; and a fiber-reinforced composite material that has excellent appearance quality and mechanical characteristics and little unevenness in physical properties. In order to achieve the aforementioned purpose, this epoxy resin composition has the following configuration. The epoxy resin composition includes all components (A)-(C). The degree of dispersion of component (B) in component (A) is 0.1-0.8, the viscosity at 25° C. is 0.1-100 Pa.Math.s, and the glass transition temperature of an epoxy resin cured product at any hardness between 85%-95% is at least 110° C. Component (A): An epoxy resin having at least two epoxy groups in each molecule Component (B): A solid curing agent Component (C): A dispersant miscible with component (A)

The invention relates to a composition that is liquid at room temperature, can be fixed by radiation and cured by heat, comprising the following components: (A) an at least bifunctional epoxy-containing compound; (B) an at least bifunctional thiol; (C) a radiation-curable compound; (D) a photoinitiator; (E) a stabilizer blend that contains at least one sulfonyl isocyanate and at least one acid; and (F) a nitrogen compound as an accelerator. The compositions are processable at room temperature over a period of at least 24 h and can be completely cured even at low temperatures.

An amino-functional addition product from the reaction of at least one diamine of the formula (I) with at least one aromatic diepoxide in a stoichiometric ratio in the range of 1.3 to 1.7 mole diamine per 1 mole-equivalent of epoxy groups. The addition product is liquid at room temperature without a diluent and has surprisingly low viscosity. The composition allows the manufacture of low-emission epoxy-resin coatings that have good workability, cure particularly rapidly and with high surface quality in cold and damp conditions, and allow for a wide range of combinations with other amines and diluents.