The present invention is directed to sulfur-bridged difuran polyesters comprising a dicarboxylate component and a diol component. The present invention is further directed to films, coatings, packaging materials or packages comprising said sulfur-bridged difuran polyesters. Also, production methods for said polyesters are provided. Further, the invention provides sulfur-bridged difuran compounds and their use in the preparation of polymers having ultraviolet light (UV) blocking properties. The invention is also directed to curable resin compositions comprising said sulfur-bridged difuran compounds.

Provided is an oxygen barrier coating composition includes a resin including a compound of the following formula: where R1 is an alkyl, cycloalkyl, aryl, alkyl aryl, glycol or polyol group, where the alkyl, cycloalkyl, aryl, alkyl aryl, glycol or polyol group is substituted with one or more glycidyl groups, the alkyl group of R1 is further substituted with one or more OH, cycloalkyl, aryl, heteroaryl or glycidyl ethers or combinations thereof, and the cycloalkyl, aryl, alkyl aryl, glycol or polyol group of R1 optionally is substituted with one or more alkyl, OH, cycloalkyl, aryl, heteroaryl or glycidyl ethers or combinations thereof, and R2 is an alkyl, cycloalkyl, aryl or heteroaryl group, where the alkyl, cycloalkyl, aryl or heteroaryl group is substituted with one or more mercapto groups, and the aryl, alkyl aryl, alkyl, cycloalkyl or heteroaryl group optionally is substituted with one or more alkyl, OH, cycloalkyl, aryl, heteroaryl or glycidyl ethers or combinations thereof. Also provided are methods of reducing the transmission rate of a gas through a substrate, the method including applying the gas barrier coating composition provided herein on the substrate and drying the gas barrier coating composition.

The first curable resin composition contains a triphenylmethane epoxy resin having at least one selected from the group consisting of alkyl groups and alkoxy groups. The second curable resin composition contains a polysiloxane stress reliever and a triphenylmethane epoxy resin having at least one selected from the group consisting of alkyl groups and alkoxy groups. The third curable resin composition, when made into a cured product, has an elastic modulus at 260 C. of 400 MPa or less, a linear expansion coefficient at 180-200 C. of 32 ppm/ C. or more, and an adhesive strength of the cured product to Ag (silver) after treatment at 85 C. and 85% RH of 0.45 MPa or more.