A process of forming a resveratrol-based flame retardant small molecule with a phosphonate/phosphinate molecule that includes a chloride group and a terminal functional group.

A flame retardant levulinic acid-based compound, a process for forming a levulinic acid-based flame retardant polymer, and an article of manufacture comprising a material that contains a flame retardant levulinic acid-based polymer are disclosed. The flame retardant levulinic acid-based compound has variable moieties, which include phenyl-substituted and/or R functionalized flame retardant groups. The process for forming the flame retardant polymer includes forming a phosphorus-based flame retardant molecule, forming a levulinic acid derivative, chemically reacting the phosphorus-based flame retardant molecule and the levulinic acid derivative to form a flame retardant levulinic acid-based compound, and incorporating the levulinic acid-based flame retardant compound into a polymer to form the flame retardant polymer.

A polymer formed of at least one phenylphosphine oxide functional epoxide crosslinked with at least one phenylphosphine oxide amine such that the polymer has phosphorous concentrations of at least about 8 percent by weight, at least about 8.5 percent by weight, or any value or range of values therebetween.

One-component epoxy adhesives containing a phosphorus-modified epoxy resin, a toughener and an epoxy resin that is neither rubber-modified nor phosphorus-modified. These adhesives are structural adhesives useful in automotive applications. They exhibit particularly good corrosion resistance.

The present invention provides a resin composition that contains copper particles and a particular resin and that is capable of producing a cured product having a low volume resistance value, and a cured product obtained by curing the resin composition. The resin composition contains (A) copper particles having an average particle diameter of 0.1 to 20 m, (B) a phosphoric acid-modified epoxy resin obtained by reacting a phosphoric acid (b1) with an epoxy compound (b2), and (C) a curing agent, wherein the content of the component (B) and the content of the component (C), based on 100 parts by mass of the total amount of the components (A) to (C), are 0.1 to 30 parts by mass and 0.1 to 5 parts by mass, respectively. Further, the cured product is obtained by curing the resin composition.

A resin composition for a printed circuit board and an integrated circuit (IC) package, and a product using the same is provided. The resin composition includes an epoxy resin composite comprising an epoxy group, the epoxy resin composite including 5 to 20 parts by weight of a bisphenol A type epoxy resin, 30 to 60 parts by weight of a cresol novolak epoxy resin, 20 to 35 parts by weight of a phosphorus-based flame-retardant epoxy resin, and 5 to 30 parts by weight of a rubber-modified epoxy resin, based on 100 parts by weight of the epoxy resin composite, an aminotriazine-based hardener, a hardening accelerator, a filler, and 0.01 to 5 parts by weight of a surface improving agent based on 100 parts by weight of the epoxy resin composite.

Solvent free epoxy system that includes: a hardener compound H comprising: a molecular structure (Y.sup.1R.sub.1Y.sup.2), wherein R.sub.1 is an ionic moiety Y.sup.1 is a nucleophilic group and Y.sup.2 nucleophilic group; and an ionic moiety A acting as a counter ion to R.sub.1; and an epoxy compound E comprising: a molecular structure (Z.sup.1R.sub.2Z.sup.2), wherein R.sub.1 is an ionic moiety, Z.sup.1 comprises an epoxide group, and Z.sup.2 comprises an epoxide group; and an ionic moiety B acting as a counter ion to R.sub.2. In embodiments, the epoxy compound E and/or the hardener H is comprised in a solvent-less ionic liquid. The systems can further include accelerators, crosslinkers, plasticizers, inhibitors, ionic hydrophobic and/or super-hydrophobic compounds, ionic hydrophilic compounds, ionic transitional hydrophobic/hydrophilic compounds, biological active compounds, and/or plasticizer compounds. Polymers made from the disclosed epoxy systems and their methods of used.

Solvent free epoxy systems are disclosed that can include a hardener compound H comprising: a molecular structure (R.sub.1(Y.sup.1)n), wherein R.sub.1 is an ionic moiety, Y.sup.1 is a nucleophilic group, n is a between 2 and 10; and an ionic moiety A acting as a counter ion to R.sub.1; and an epoxy compound E comprising: a molecular structure (R.sub.2Z.sup.1)n), wherein R.sub.2 is an ionic moiety, Z.sup.1 comprises an epoxide group, n is a between 2 and 10, and an ionic moiety B acting as a counter ion to R.sub.2. In embodiments, the epoxy compound E and/or the hardener H is comprised in a solvent-less ionic liquid. The systems can further include accelerators, crosslinkers, plasticizers, inhibitors, ionic hydrophobic and/or super-hydrophobic compounds, ionic hydrophilic compounds, ionic transitional hydrophobic/hydrophilic compounds, biological active compounds, and/or plasticizer compounds. Polymers made from the disclosed epoxy systems and their methods of use are described.

To show a curable resin composition suitable as an adhesive for bonding a structural material having good adhesiveness to aluminum in particular. A curable resin composition containing (A1) phosphoric acid-modified epoxy resin obtained by reacting a phosphoric acid (a1) and an epoxy compound (a2) (excluding a urethane-modified epoxy resin and a urethane-modified chelate epoxy resin); and (A2) an epoxy resin (excluding component (A1)); (B) a block urethane; and (C) a latent curing agent, in which a phosphorus content in a total mass of component (A1) and component (A2) is 0.01 to 2.0% by mass.

An epoxy resin composition which is suppressed in curing shrinkage upon being cured to obtain a cured film having low warpage and high adhesion. The epoxy resin composition contains epoxy resin (A), compound (B) represented by formula (1) and nanosilica filler (C). In formula (1), R.sub.1 and R.sub.2 are independently an alkyl group having 1 to 10 carbons or a phenyl group, and X is independently hydrogen or a monovalent organic group, and in one molecule of the compound, at least one of X includes an epoxy group.

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