A curable void filler composition comprising at least one epoxy resin; at least one epoxy curing agent comprising at least one bicyclic carboxylic acid anhydride; and at least one epoxysilane compound according to formula (1), where formula (1) is Glycidoxy-R1Si(OR2)(OR3)(OR4), and R1 is selected from linear or branched alkyl comprising from 1 and 15 carbon atoms; and R2, R4 and R4 may be different or the same, and are independently selected from linear or branched alkyl comprising from 2 to 15 carbon atoms.

A two-component room temperature cure adhesive comprising an epoxy resin composition A, and a curative composition B, wherein the curative composition B comprises at least one room temperature curative and at least one chain extender having at least two reactive groups per molecule.

A fire-resistant two-part system comprising a first component and a second component. The first component comprises one or more fire resistance improving additives. The second component comprises one or more acids.

Provided is a UV-curable composition which, when cured, produces a product having a low dielectric constant and excellent workability when coated onto a base material, and which has a viscosity particularly suitable for coating by inkjet printing; and an organopolysiloxane serving as a main agent of the composition. The UV-curable composition comprises one or more organopolysiloxane (A) having, in each molecule, a UV-curable functional group, and a non-UV-curable monofunctional polycyclic functional group which may contain a hetero atom. The UV-curable composition is useful as an insulative coating agent.

Actinic radiation and moisture dual curable epoxy compositions and methods of curing such compositions are disclosed. The compositions comprise an alkoxysilane and epoxy dual functional oligomer comprising a functional group curable by actinic radiation, a functional group curable by moisture, and a functional group chemically linking the functional group curable by actinic radiation and the functional group curable by moisture; catalyst configured to react with the functional group curable by moisture in the presence of water; and at least one photoinitiator. The compositions are particularly useful for wearable electronics and medical devices. In some embodiments, unexpected results are obtained in the ability to use cationic photoinitiators and/or in avoiding the need for acrylates and/or heat curing.

Provided is an ultraviolet light curable composition containing a silicon atom, which provides a product obtained by curing that has excellent mechanical properties and low outgassing properties, and which also has excellent workability when applied to a substrate. The ultraviolet light curable composition includes: (A) one or more organopolysiloxanes or organosilanes having, on average, more than one cationically polymerizable functional group per molecule; (B) a compound that releases a basic substance when heated at 60 to 200 C.; and (C) a photoacid generating agent. The composition is substantially free of organic solvent, and the viscosity of the entire composition, measured at 25 C. using an E-type viscometer, is 500 mPa.Math.s or less.

A resin composition for a stator, which is used for forming a sealing member in a stator including a stator core having a plurality of teeth parts and a plurality of slots that are alternately formed in a circumferential direction, a coil wound around the slot, accommodated in the slot, and having a pair of coil ends that each protrude over both sides from the stator core in an axial direction, and a sealing member provided by covering the coil in the slot, the resin composition for a stator including a thermosetting component, in which a cured product obtained by thermally curing the resin composition for a stator has a structure represented by Formula (1) and has an easily disassembling property. (In Formula (1), R1 and R2 each independently represent any of a hydrogen atom, a hydrocarbon group or aromatic group having 1 to 30 carbon atoms, a hydroxyl group, and an alkoxyl group having 1 to 30 carbon atoms.)

A photosensitive resin composition comprising: an epoxy resin (A) represented by formula (1); an epoxy resin (B) that has an epoxy equivalent of 500 g/eq. or less and that is different from the epoxy resin (A) represented by formula (1); and a cationic polymerization catalyst,

##STR00001## where, in formula (1), R.sub.1, R.sub.2, R.sub.3, R.sub.4, and X.sub.1 are each independently an alkyl group with carbon numbers of 1 to 12, an aryl group with carbon numbers of 6 to 12, or an epoxy-comprising group; X.sub.2 is an epoxy-comprising group; m+n is an integer from 1 to 60; and a sequence of a structure of parentheses marked with m and a sequence of a structure of parentheses marked with n may be random or block.

A curable composition contains an alicyclic epoxy resin; and an active hydrogen compound having a pKa of 10 or less.

Various embodiments include an insulation material and/or impregnation resin for a wrapping tape insulation, comprising: a base resin curing to a thermoset; and a curing agent. The base resin comprises a siloxane-containing compound forming a SiR.sub.2O backbone in the thermoset.