An epoxy resin component(s) for a recyclable epoxy resin system is disclosed. The recyclable epoxy resin system comprises an epoxy resin component having a structural Formula I or an epoxy resin component having a structural Formula II and a curing agent. A process(es) for preparing the epoxy resin component having the structural Formula I and the epoxy resin system having the structural Formula II is also disclosed.

A curable void filler composition comprising at least one epoxy resin; at least one epoxy curing agent comprising at least one bicyclic carboxylic acid anhydride; and at least one epoxysilane compound according to formula (1), where formula (1) is Glycidoxy-R1Si(OR2)(OR3)(OR4), and R1 is selected from linear or branched alkyl comprising from 1 and 15 carbon atoms; and R2, R4 and R4 may be different or the same, and are independently selected from linear or branched alkyl comprising from 2 to 15 carbon atoms.

An adhesive composition comprising a silane-modified epoxy resin, a dicyclopentadiene novolac epoxy resin and a curing agent. The composition shows good oily steel bonding, even in the absence of CTBN rubber or rubber adducts as toughening agents, with good Tg values of the cured resin and good Tg retention after hot wet aging.

The present invention relates to a heat-curable composition comprising at least one epoxy monomer having two or three epoxy groups, which is not a silicon compound having at least one hydrolyzable group directly linked to the silicon atom, at least one epoxy compound bearing at least one silicon atom having at least one hydrolyzable group directly linked to the silicon atom and at least one group comprising an epoxy function linked to the silicon atom though a carbon atom, and/or a hydrolyzate thereof, at least one epoxy ring-opening catalyst, and at least one compound comprising at least two (2,2,6,6-tetramethyl-4-piperidyl)-groups in which the nitrogen atom can be substituted with an alkyl group, an alkoxy group or an oxyl group.

A resin composition including the following (A) to (D): (A) a resin containing epoxy groups in the range of 140 to 5000 g/eq as an epoxy equivalent; (B) a phenolic curing agent; (C) a curing accelerator; and (D) at least one compound selected among what is expressed by the following formulae (0-1) to (0-5). This provides a resin composition having small warpage and excellent adhesive force, a high adhesion resin composition film made into a film form from the composition, a semiconductor laminate having a cured product of the film and its production method, a semiconductor device obtained by dicing the semiconductor laminate into individual chips and its production method. ##STR00001##

A liquid optically clear adhesive (LOCA) for bonding optical substrates includes siloxane and epoxy-containing oligomers, a UV-activated photo-acid generator, a cross-linker additive, a solvent; and a reactive plasticizer, such as an additive of Structure 1. In one example, the additive of Structure 1 constitutes about 1-7% of a total mass of the LOCA excluding the solvent. R.sub.1, R.sub.2, and R.sub.3 of Structure 1 include methoxide, ethoxide, propoxide, or a combination thereof. R.sub.4 of Structure 1 includes an alkyl chain that is linear or branched and includes 2-8 carbons. The LOCA material is characterized by a refractive index equal to or greater than about 1.6 at 450 nm and an optical absorption below about 0.1% per micrometer of a thickness of the LOCA material.

A thermoset epoxy resin, its preparing composition and making process are disclosed. In particular, the thermoset epoxy resin is glycidyl ether of diphenolic bis-carbamate and formed by curing a one component epoxy composition and has a general structure as shown in formula (1).

Various embodiments include an impregnation formulation for a wrapping tape insulation of an electrical machine. The formulation comprises: a resin formulation with an epoxy base resin and a first component; and a hardener formulation with a hardener. The resin formulation reacts when combined with the hardener formulation to produce an insulation material. The first component includes a saturated and/or unsaturated epoxycycloalkyl group. A glass transition temperature of the insulation material is elevated compared to an impregnation formulation without the first component.

Provided is an epoxy resin composition that gives a cured product having excellent adhesion to metal and low dielectric characteristics, and that has good workability during use and high storage stability. Specifically, provided is an epoxy resin composition comprising a specific epoxy resin and a specific phenol-based curing agent.

The invention relates to a curable coating composition comprising at least one glycidyl carbamate (GC) resin, at least one amphiphilic GC-functional prepolymer, and at least one curing agent. The invention also relates to a method of making the curable coating compositions. The invention also relates to an article of manufacture comprising the curable coating composition of the invention and a method of making such article. The invention also relates to a fouling-release (FR) coating system and an anti-coating system, each of which comprises the curable coating compositions of the invention, methods of applying the FR coating systems and anti-coating systems to substrates, and methods for reducing or preventing biofouling or icing of a surface exposed to an aqueous environment using the FR coating systems.