Provided is an epoxy resin composition maintaining excellent adhesion and having low dielectric tangent. Specifically, provided is an epoxy resin composition comprising a specific epoxy resin and a phenol-based curing agent.

A photosensitive resin composition comprising an isocyanurate-modified silicone resin containing an epoxy group in the molecule is easy to form a resin coating which has high transparency, light resistance and heat resistance, is amenable to micro-processing, and is useful in applications for protecting and encapsulating optical devices. The coating can be processed in thick film form to define a pattern having a fine size and perpendicularity, and becomes a cured coating which has improved adhesion to substrates, electronic parts, semiconductor devices, and supports for circuit boards, mechanical properties, electric insulation, and crack resistance, and is reliable as an insulating protective film.

A protective coating, comprising a binder component mixture having a reactive mixture portion and a filler mixture portion, wherein the reactive mixture portion includes an epoxy resin part and an epoxy silane part, wherein the epoxy silane part is present in an amount of about 10 wt % of the reactive mixture portion and about 40 wt % of the reactive mixture portion; and a curing component having one or more amine curing compounds, wherein the amine curing compound of the curing component comprises an unmodified diamino cyclohexane (DACH) that is present in an amount between about 70 wt % and about 100 wt % of the curing component.

A curable composition which is capable of forming a cured product having satisfactory heat resistance and adhesion to a base material, and has satisfactory curability, a cured film obtained from a cured product of the curable composition, a display panel or an OLED light provided with the cured film, and a method for producing a cured product using the curable composition. The composition includes a curable compound and a cationic polymerization initiator, and contains a cationic polymerizable compound having, as the main skeleton, a fused ring in which three or more rings including an aromatic ring are fused, and a salt including a gallium-containing anion as the cationic polymerization initiator.

Provided are a glass multilayer structure, a method of producing the same, and a flexible display panel including the same. More particularly, a glass substrate multilayer structure including a flexible glass substrate; and a functional layer formed on at least one surface of the flexible glass substrate. The functional layer is a phase-separated layer formed by a single coating and a flexible display panel including the same are provided.

A photosensitive resin composition comprising a dual end alicyclic epoxy-modified silicone resin having formula (A1) and a photoacid generator is provided. In formula (A1), R.sup.1 to R.sup.4 are a C.sub.1-C.sub.20 monovalent hydrocarbon group and n is an integer of 1-600. The composition enables pattern formation using radiation of widely varying wavelength, and the patterned film has high transparency, light resistance, and heat resistance. ##STR00001##

The invention relates to an anti-fatigue cold mixed epoxy resin material, preparation method and application thereof, comprising component A and component B with mass ratio of 1:1-10:1, component A comprising fluid epoxy resin, active toughener, active diluents, coupling agent and defoamer; component B is any one of or a mixture of two or more than two of alicyclic amine or amino terminated polyether, cyanoethylamine, phenolic modified amine or hydroxyalkyl modified amine. Introduced epoxy terminated organosilicon block polyurethane prepolymer breaks the limitation that elongation at fracture of epoxy resin system based on “sea-island structure” is difficult to break through 100%. The invention is suitable for bridge deck pavement of long-span cable bearing bridge, waterproof bonding material or used for airport pavement, municipal viaduct, ramp and other occasions with high requirements for fatigue resistance of pavement material.

An epoxy resin component(s) for a recyclable epoxy resin system is disclosed. The recyclable epoxy resin system comprises an epoxy resin component having a structural Formula I or an epoxy resin component having a structural Formula II and a curing agent. A process(es) for preparing the epoxy resin component having the structural Formula I and the epoxy resin system having the structural Formula II is also disclosed.

The present invention provides an epoxy resin composition that can produce a cured product maintaining good dielectric characteristics (low dielectric constant and low dielectric loss tangent), and having high adhesion strength to metal; and also provides a process for producing the same, a cured product obtained by curing the epoxy resin composition, and use thereof. The present invention includes an epoxy resin composition comprising an epoxy resin, an acid anhydride-based curing agent, and a curing accelerator, the epoxy resin being represented by the formula (1): ##STR00001##
wherein X is a divalent group obtained by removing two hydrogen atoms from a hydrocarbon ring, or a divalent group represented by the formula (2): ##STR00002##
wherein Y is a bond, a C.sub.1-6 alkylene group, etc.; R.sup.1 is the same or different, and is a C.sub.1-18 alkyl group, etc., R.sup.2 is the same or different, and is a C.sub.1-18 alkylene group, etc., R.sup.3 is the same or different, and is a C.sub.1-18 alkyl group, etc., and n is the same or different, and is an integer of 0 to 3. The present invention also includes a process for producing the same, a cured product of the epoxy resin composition, and use thereof.

An adhesion promoter comprises a reaction product of: a) a polyepoxide; b) an aminosilane represented by the formula HNR.sup.1R.sup.2. R.sup.1 and R.sup.2 independently represent —Z-SiL.sub.3. Each Z independently represents a divalent linking group having from 1 to 12 carbon atoms, and each L independently represents a hydrolyzable group; and c) an isocyanatosilane represented by the formula O=C═N—Z-SiL.sub.3, wherein Z and L are as previously defined. The adhesion promoter may be used to treat a surface of a substrate such as an abrasive particle, which may be included in a resin-bond abrasive article.