Disclosed is a heat-curable composition including at least one epoxy monomer including two or three epoxy groups, which is not a hydrolysis-polymerizable silicon compound (monomer (a)), at least one epoxy compound bearing at least one silicon atom having at least one hydrolyzable group directly linked to the silicon atom and at least one epoxy group, at least one epoxy ring-opening catalyst and at least one organic solvent selected from glycol monoethers. The composition includes less than 10% by weight of monomers (a) and provides upon curing a coating having improved hardness properties.

An object is to provide a resin composition which is excellent in resistance to impact when dropped after curing and which is also excellent in solvent resistance, a cured product thereof, an adhesive agent for electronic components including this resin composition, a semiconductor device and an electronic component including the cured product of this resin composition. This resin composition includes (A) a hydrogenated bisphenol A-type epoxy resin, (B) a multifunctional thiol resin, and (C) a curing catalyst. The cured product of the resin composition has an elastic modulus of 0.5 GPa or more at 50 C. The resin co sition preferably includes a glycoluril compound as the component (B).

The invention provides a resin composition comprising a specific silicone-modified epoxy resin, a specific silicone-modified phenolic resin, black pigment, and an inorganic filler. The invention also provides a resin composition comprising a specific cyanate ester compound, a specific silicone-modified epoxy resin, and a specific phenol compound and/or silicone-modified phenolic resin.

Provided is an epoxy resin composition that can achieve excellent low dielectric characteristics and high adhesive strength to metal. Specifically, provided is an epoxy resin composition comprising organic fine particles and an epoxy resin having a specific structure.

Provided is an epoxy resin composition that has excellent electric characteristics (particularly low dielectric tangent), and that can achieve high adhesive strength to metal. Specifically, provided is an epoxy resin composition comprising an active ester compound and an epoxy resin having a specific structure.

A protective coating, comprising a binder component mixture having a reactive mixture portion and a filler mixture portion, wherein the reactive mixture portion includes an epoxy resin part and an epoxy silane part, wherein the epoxy silane part is present in an amount of about 10 wt % of the reactive mixture portion and about 40 wt % of the reactive mixture portion; and a curing component having one or more amine curing compounds, wherein the amine curing compound of the curing component comprises an unmodified diamino cyclohexane (DACH) that is present in an amount between about 70 wt % and about 100 wt % of the curing component.

A stacked structure including a conductive layer disposed on a substrate and a protective layer disposed on the conductive layer and including a cured product of a cation polymerizable compound and a cation initiator, wherein the cation initiator comprises a cation and a resonance-stabilized counteranion, a window for an electronic device, and an electronic device that includes the stacked structure.

Provided are a low temperature curing composition, a cured film obtained by curing the composition, and an electronic device comprising the cured film, wherein the composition comprises: (A) an epoxy group-containing siloxane compound represented by Chemical Formula 1:
(R.sup.1R.sup.2R.sup.3SiO.sub.1/2).sub.M(R.sup.4R.sup.5SiO.sub.2/2).sub.D1(R.sup.6SiO.sub.3/2).sub.T1(R.sup.7R.sup.8SiO.sub.2/2).sub.D2(R.sup.9SiO.sub.3/2).sub.T2[Chemical Formula 1]
(In Chemical Formula 1, each of R.sup.1 to R.sup.9 is an organic group independently selected from a substituted or unsubstituted monovalent aliphatic hydrocarbon group of C1 to C6, a substituted or unsubstituted monovalent cycloaliphatic hydrocarbon group of C6 to C20, a substituted or unsubstituted monovalent aromatic hydrocarbon group of C6 to C20, and an epoxy-substituted monovalent organic group, at least one of R1 to R6 is an epoxy-substituted monovalent organic group, 0M<1, 0D1<1, 0<T1, 0D2<1, 0T2<1, and M+D1+T1+D2+T2=1, wherein each of the structural units represented by M, D1, T1, D2, and T2 can include one or more types of different structural units); and (B) a cationic thermal initiator for a ring-opening reaction of epoxide, the initiator being a salt of a sulfonium-based cation and a borate-based anion, wherein the compound represented by chemical formula 1 is a combination of a siloxane 1,000 and a siloxane compound of which a number average molecular weight is in a range of 1,000-10,000.

An epoxy-functionalized polyorganosiloxane toughener providing toughening properties for thermosetting resins is described. The epoxy-functionalized polyorganosiloxane toughener is an epoxy-functionalized siloxane polyether with a siloxane backbone, at least one epoxy-containing alkyl chain, and at least one alkoxyl polyether chain, each said at least one epoxy-containing alkyl chain and at least one alkoxyl polyether chain grafted to the siloxane backbone. Also disclosed is a thermosetting resin-based composition comprising the epoxy-functionalized polyorganosiloxane toughener of claim 1 and at least one of an epoxy resin, a hardener, and an accelerator.

The present invention provides an epoxy resin composition that can produce a cured product maintaining good dielectric characteristics (low dielectric constant and low dielectric loss tangent), and having high adhesion strength to metal; and also provides a process for producing the same, a cured product obtained by curing the epoxy resin composition, and use thereof. The present invention includes an epoxy resin composition comprising an epoxy resin, an acid anhydride-based curing agent, and a curing accelerator, the epoxy resin being represented by the formula (1):

##STR00001##

wherein X is a divalent group obtained by removing two hydrogen atoms from a hydrocarbon ring, or a divalent group represented by the formula (2):

##STR00002##

wherein Y is a bond, a C.sub.1-6 alkylene group, etc.;

R.sup.1 is the same or different, and is a C.sub.1-18 alkyl group, etc.,

R.sup.2 is the same or different, and is a C.sub.1-18 alkylene group, etc.,

R.sup.3 is the same or different, and is a C.sub.1-18 alkyl group, etc., and

n is the same or different, and is an integer of 0 to 3. The present invention also includes a process for producing the same, a cured product of the epoxy resin composition, and use thereof.