Formulations comprising from 10 to 80% by weight of the formulation of a halogenated epoxy resin; from 1 to 15% by weight of the formulation of an antimony based fire retardant; from 1 to 10% by weight of the formulation of an inorganic or non-polymeric organic phosphorous containing fire retardant; and from 1 to 30% by weight of the formulation of a curative system are provided. The formulations are particularly suitable for producing aircraft interior composite components having good fire retarding properties, low smoke emission, low smoke toxicity and low heat release properties. The formulations also have excellent processing and mechanical properties. Further components may be included in the compositions to improve various properties, including the fire retarding, low smoke emission, low smoke toxicity and low heat release properties and to also further improve the processing and mechanical properties, including toughness. Compositions produced from the formulations have excellent processing and mechanical properties, and may also have good surface finishes.

A thermoplastic polymer-based composite material and a preparation method thereof are provided. The thermoplastic polymer-based composite material is obtained by impregnating a reinforcing material with a mixture or an oligomer of an epoxy resin, a bisphenol A/F, and a catalyst and then performing an in-situ polymerization. The thermoplastic polymer-based composite material is less expensive to produce, has an optimal impregnation effect, excellent secondary processing performance, high heat resistance, desirable mechanical properties and excellent overall performance.

Flame retardant coating formulation in the form of an aqueous dispersion comprising a binder, particles of a brominated polymeric flame retardant; and particles of at least one of magnesium hydroxide and aluminum trihydrate, wherein the aqueous dispersion is substantially free of antimony oxide. A process for preparing the formulation and a method of reducing the flammability of wood and wood products by coating them with the formulation are also provided.

A composition containing: a compound represented by the following formula (D):

##STR00001##

wherein m is an integer of 0 to 6; p is 0 or 1; q is an integer of 0 to 6; Rf is a C1-C8 perfluoroalkyl group optionally containing oxygen with one fluorine atom being optionally replaced by a hydrogen atom, and a compound represented by the following formula (E):

##STR00002##

wherein n is an integer of 0 or greater; and M is a group represented by the following formula (E1):

##STR00003##

a group represented by the following formula (E2):

##STR00004##

or a group represented by the following formula (E3):

##STR00005##

wherein Z is hydrogen or a C1-C10 fluoroalkyl group.

A thermoset epoxy resin, its preparing composition and making process are disclosed. In particular, the thermoset epoxy resin is glycidyl ether of diphenolic bis-carbamate and formed by curing a one component epoxy composition and has a general structure as shown in formula (1).

An electromagnetic interface (EMI) shielding material and method for producing the electromagnetic interface (EMI) shielding material. The EMI shielding material including a polymer matrix and a van der Waals material embedded in the polymer matrix and forming quasi-one-dimensional atomic threads, and wherein the van der Waals material is a trichalcogenide compound.

An ultra-high solids content primer coating composition comprising: (i) 5.0 to 50 wt % of at least one bisphenol F epoxy resin; (ii) 1.5 to 12 wt % of at least one silane; (iii) 0 to 20 wt % of at least one hydrocarbon resin; (iv) 0 to 15 wt % of at least one reactive diluent; (v) at least one curing agent; wherein said composition has a solids content of at least 90 wt % according to ASTM D5201-05; wherein said composition has a viscosity of 200 to 800 cps at 23° C. and 50% RH (ASTM D4287); and wherein the ratio between hydrogen equivalents in the curing agent and epoxy equivalents of the coating composition is in the range 50:100 to 120:100.

A fluorine-containing epoxy resin for an electronic component represented by the following formula (E) wherein n is an integer of 0 or greater, an average value of n is 0.18 or smaller, and M is a group represented by the following formula (E1), a group represented by the following formula (E2), or a group represented by the following formula (E3) wherein Z is hydrogen or a C2-C10 fluoroalkyl group. The formula (E) being:

##STR00001##

the formula (E1) being:

##STR00002##

the formula (E2) being:

##STR00003##

the formula (E3) being:

##STR00004##

Also disclosed is a method for producing the fluorine-containing epoxy resin as well as a curable composition containing the fluorine-containing epoxy resin and a curing agent.

A thermoplastic polymer-based composite material and a preparation method thereof are provided. The thermoplastic polymer-based composite material is obtained by impregnating a reinforcing material with a mixture or an oligomer of an epoxy resin, a bisphenol A/F, and a catalyst and then performing an in-situ polymerization. The thermoplastic polymer-based composite material is less expensive to produce, has an optimal impregnation effect, excellent secondary processing performance, high heat resistance, desirable mechanical properties and excellent overall performance.

A thermal-curable resin composition is provided. The thermal-curable resin composition comprises: (A) a thermal-curable resin component, which comprises: (a1) bismaleimide resin; (a2) cyanate ester resin; and (a3) epoxy resin, wherein the cyanate ester resin (a2) and the epoxy resin (a3) are respectively in an amount ranging from 50 parts by weight to 150 parts by weight and from 24 parts by weight to 51 parts by weight per 100 parts by weight of the bismaleimide resin (a1); and (B) a filler, wherein the filler (B) is in an amount ranging from 40 parts by weight to 55 parts by weight per 100 parts by weight of the dry weight of the resin composition; and wherein the resin composition has a dynamic viscosity of not higher than 800 Pa.Math.s after being brought into a semi-cured state (B-stage), and the resin composition has a dissipation factor (Df) of not higher than 0.006 at 10 GHz after being cured completely.