A curable resin represented by General Formula (1). In General Formula (1), R.sub.1 each independently represent a monovalent substituent (an alkyl group, an alkoxy group, a fluorine atom, and the like), m is 0 to 4, n is 0 to 40, and R.sup.2's are each independently a monovalent group including a polymerizable functional group. ##STR00001##

The present invention relates to an epoxy resin composition for a copper clad laminate, and an application of the epoxy resin composition. The epoxy resin composition may be used for the preparation of pre-pregs and copper clad laminates. By using brominated epoxy resin such as a low bromine epoxy resin and a high bromine epoxy resin as bromine sources and taking a phosphorus-containing phenanthrene-type compound as a phosphorus source, and adjusting the proportions of the brominated epoxy resins and the phosphorus-containing phenanthrene-type compound within the epoxy resin composition, the bromine content is controlled at 5-12%, the phosphorus content is controlled at 0.2-1.5%, and the flame retardancy achieves the level of UL94 V-0. Compared to pure bromine flame retardant copper clad laminates, the heat resistance is higher, and a higher CTI value is achieved. Compared to pure phosphorus flame retardant copper clad laminates, the moisture absorption is low, and the adhesion performance and process operability required for printed circuit substrates are provided. Compared to the use of a large amount of aluminum hydroxide in traditional high CTI sheet material, the present invention achieves CTI>600V using a small amount of aluminum hydroxide or without using aluminium hydroxide.

A thermally expandable resin composition containing an epoxy resin, a thermally expandable graphite, and an inorganic filler excluding graphite. The epoxy compound contained in said epoxy resin contains a brominated epoxy compound, and contains, in addition to the brominated epoxy compound, a bisphenol-type epoxy compound and/or an aliphatic epoxy compound, wherein the weight ratio of the brominated epoxy compound to the bisphenol-type epoxy compound and/or aliphatic epoxy compound is in the range 99:1-1:99.

An electromagnetic interface (EMI) shielding material and method for producing the electromagnetic interface (EMI) shielding material. The EMI shielding material including a polymer matrix and a van der Waals material embedded in the polymer matrix and forming quasi-one-dimensional atomic threads, and wherein the van der Waals material is a trichalcogenide compound.

To provide a fluorinated compound capable of obtaining a cured product which is excellent in heat resistance and mold release and has a high Abbe number; a curable composition containing such a compound; and a cured product which is excellent in heat resistance and mold release and has a high Abbe number. The fluorinated compound is represented by the following formula (A):

[ZOCH.sub.2CF.sub.2CF.sub.2CF.sub.2OCFHCF.sub.2X-].sub.nQ(A)

where n is an integer of at least 1, Q is a n-valent organic group, X is O, NH or S, and Z is a group having at least one polymerizable functional group.

The present invention provides a composite flame retardant, a flame retardant resin composition, a composite metal substrate, a flame retardant electronic material and a flame retardant engineering plastic, wherein the composite flame retardant comprises a bromine-containing flame retardant, as well as a sulfur-containing flame retardant and/or a phosphorus-containing flame retardant; said bromine-containing flame retardant is a bromine-containing phenol compound and epoxy resins thereof. The bromine-containing flame retardant has a synergistic effect on the flame retardant effect with the sulfur-containing flame retardant and/or the phosphorus-containing flame retardant, thereby enhancing the flame retardancy of the composite flame retardant and further enhancing the flame retardancy of the resin composition of the present invention. Therefore, the composite metal substrate, the flame retardant electronic material and the flame retardant engineering plastic prepared from the composite flame retardant or the flame retardant resin composition of the present invention have good flame retardancy, good mechanical properties and heat resistance.

A flame-retardant epoxy resin composition includes on the basis of the total weight of the composition: 2565 wt % of epoxy resin, 1630 wt % of brominated epoxy resin, the brominated epoxy resin having a capping group selected from an epoxy group and a tribromophenol group, and 1025 wt % of organophosphorus flame retardant. The flame-retardant epoxy resin composition further relates to a method for preparing a composite material by vacuum infusion of the flame-retardant epoxy resin composition, and an article obtained by the method.

The present invention relates to brominated polyether polyols, processes for the production as well as intermediates useful in the production of the same and to processes for the preparation of flame-retardant blends, premixes as well as polyurethane foams.

The present invention is a composition for forming an organic film, containing: (A) a material for forming an organic film; (B) a polymer having a repeating unit represented by the following general formula (1); and (C) a solvent, where W.sub.1 represents a saturated or unsaturated divalent organic group having 2 to 50 carbon atoms and having one or more fluorine-containing structures represented by the following formulae (2), and W.sub.2 represents a saturated or unsaturated divalent organic group having 2 to 50 carbon atoms. This can provide: a composition for forming an organic film which is excellent in film-formability on a substrate and filling property, suppresses humps in an EBR process, and has an excellent process margin when used for an organic film for a multilayer resist process; a method for forming an organic film, using the composition; a patterning process; and a polymer to be contained in the composition for forming an organic film.

##STR00001##

A novolak resin including a partial structure represented by C(CF.sub.3)H. In addition, there are provided a photosensitive resin composition containing the above-described novolak resin and a photosensitizing agent. In addition, there is provided an epoxy resin having a partial structure represented by C(CF.sub.3)H. In addition, there is provided a curable resin composition containing the novolak resin or the epoxy resin. In addition, there is provided a cured substance obtained by curing the composition. In addition, there is provided a production method for a novolak resin, including reacting an aromatic compound with fluoral in a presence of an acid catalyst to produce a novolak resin having a partial structure represented by C(CF.sub.3)H. Further, there is provided a production method for an epoxy resin, including an epoxidation step of reacting a novolak resin having a partial structure represented by C(CF.sub.3)H with epihalohydrin in a presence of a base.