Patent classifications
C08G59/3245
MEMBER FOR ELECTROPHOTOGRAPHY, PROCESS CARTRIDGE AND ELECTROPHOTOGRAPHIC APPARATUS
There is provided a member for electrophotography, which contributes to formation of a high-quality electrophotographic image. The member for electrophotography includes an electro-conductive substrate and an electro-conductive layer as an outermost layer, wherein the electro-conductive layer contains a resin having a nitrogen-containing heterocyclic cation structure, an anion, and a specific carbon black.
HIGHLY SOLUBLE TRIS- (2, 3-EPOXYPROPYL)- ISOCYANURATE AND METHOD FOR PRODUCING SAME
There is provided an epoxy composition which has difficulty in precipitating a crystal during storage, is homogeneous and can be stored for a long period; and a cured product of the composition having excellent transparency, heat resistance, and light resistance can be obtained on curing. An -type tris-(2,3-epoxypropyl)-isocyanurate crystal including -type tris-(2,3-epoxypropyl)-isocyanurate in the crystal in a ratio of 2% by mass to 15% by mass. A method for producing the -type tris-(2,3-epoxypropyl)-isocyanurate crystal including step (i) separating -type tris-(2,3-epoxypropyl)-isocyanurate contained in a tris-(2,3-epoxypropyl)-isocyanurate solution from the solution as a solid to obtain a crystal with an increased content ratio of -type tris-(2,3-epoxypropyl)-isocyanurate.
White heat-curable epoxy resin composition for optical semiconductor element encapsulation and optical semiconductor device using same
Provided are a white heat-curable epoxy resin composition capable of yielding a cured product that is tough and superior in initial reflection rate and heat resistance; and a semiconductor device with a light receiving element and other semiconductor elements being encapsulated by such cured product. The white heat-curable epoxy resin composition contains: (A) a prepolymer as a molten mixture of (A-1) an epoxy resin: a triazine derivative epoxy resin and/or an alicyclic epoxy compound having an epoxy group and an alicyclic structure in one molecule and being non-fluid at 25 C., (A-2) an acid anhydride having no carbon-carbon double bond and (A-3) an acrylic resin-based modifier having an epoxy group and a weight-average molecular weight of 1,000 to 30,000; (B) a white pigment containing a titanium oxide; (C) an inorganic filler; (D) a curing accelerator; and (E) an antioxidant.
PREPREG AND FIBER-REINFORCED COMPOSITE MATERIAL
The purpose of the present invention is to provide a prepreg which satisfies one of a)-c): a) having superior storage stability and capable of providing a fiber-reinforced composite material having superior mechanical properties; b) capable of providing a fiber-reinforced composite material having superior mechanical properties, and the obtained fiber-reinforced composite material has superior appearance quality; and c) having superior storage stability, generating less amount of heat when cured, and enabling the cure extent and the viscosity in the B-stage state to be flexibly controlled. To achieve the purpose, the present invention provides a prepreg including reinforced fibers and an epoxy resin composition which contains an epoxy resin and a curing agent represented by a specific chemical formula, and which satisfies a specific condition.
EPOXY RESIN COMPOSITION, PREPREG, AND FIBER-REINFORCED COMPOSITE MATERIAL
The present invention provides an epoxy resin composition that serves to produce a cured epoxy resin that simultaneously realizes a high heat resistance, a high elastic modulus, and a low color and to produce a molded article having a good appearance without suffering the formation of white spots on the surface thereof when used as matrix resin in a fiber reinforced composite material. The epoxy resin composition includes an epoxy resin as component [A], an aromatic urea [B1] and/or an imidazole compound [B2] as component [B], and a borate ester compound as component [C], containing dicyandiamide in the amount of 0.5 part by mass or less relative to the total quantity of epoxy resins which accounts for 100 parts by mass, wherein the epoxy resin composition meets certain sets of further requirements with respect to its composition.
FLOOR COATING AGENT HAVING EXCELLENT SURFACE ADHESION AND HARDNESS, AND CONSTRUCTION METHOD USING THE SAME
The present invention provides a floor coating agent with excellent adhesion and hardness, and a construction method using the same.
The floor coating agent with excellent adhesion and hardness according to the present invention includes a primer layer applied onto the surface of floor and then cured, and a floor coating layer applied onto the primer layer and then cured, wherein the primer layer is produced from a mixture of a self-emulsified epoxy resin, an acrylic polyol resin, a defoaming agent, 1,3,5-triglycidyl isocyanurate, dodecanedioic acid, anhydrous sodium citrate and water, and the floor coating layer is produced from a floor coating layer composition including an acidic copolymer alkyl ammonium salt, zinc oxide, oxalic acid, ammonium hydroxide and distilled water.
Based on this configuration, the present invention can improve durability, abrasion resistance, gloss and the like of a floor surface, based on excellent adhesion to the floor surface and superior surface hardness.
CURABLE RESIN COMPOSITION
A curable resin composition includes (A) a specific curable resin and (C) a curing agent, and further includes (BI) 0.1 parts by mass or more and 20 parts by mass or less of a polyhydric alcohol having 2 to 5 hydroxyl groups, based on based on 100 parts by mass of the curable resin (A); (BII) a cyclic compound having 3 to 6 reactive groups and a reactive group equivalent of 100 g/eq or more and 300 g/eq or less; or (BIII) a specific oxetane compound in a mass ratio of the curable resin (A) to the oxetane compound (BIII) being 5:5 to 9:1.
Epoxy resin composition, prepreg, and fiber reinforced material
An epoxy resin composition includes: an [A] epoxy resin at least comprising an [A1] isocyanurate epoxy resin and an [A2] glycidyl amine epoxy resin; [B] dicyandiamide; and [C] diaminodiphenyl sulfone, wherein (1) an average epoxy equivalent of the [A] epoxy resin is 115 g/eq to 150 g/eq, and (2) an amount of the component [C] added is an amount of 0.05 equivalent to 0.3 equivalent relative to epoxy groups in the [A] epoxy resin in terms of active hydrogen groups.
EPOXY RESIN SYSTEMS
Compositions and methods for forming epoxy resin systems are provided. In one embodiment, a composition is provided for an epoxy resin system including an epoxy resin blend comprising an epoxy resin, a first curing agent selected from the group of a polyarylene alkylphosphonate, a polyarylene arylphosphonate, and combinations thereof, and a second curing agent.
HIGHLY SOLUBLE MODIFIED EPOXY RESIN COMPOSITION
An epoxy resin composition in a liquid or solid state having excellent solubility and having high preservation stability. A modified epoxy resin composition including: Compound A containing tris-(2,3-epoxypropyl)-isocyanurate having 1 to 3 glycidyl group(s) in a molecule substituted with a functional group(s) of Formula (1):
##STR00001##
in which R.sup.1 and R.sup.2 are each independently an alkyl group, an alkenyl group, an alkynyl group, an aryl group, an aralkyl group, a heterocyclic group; or a halogenated derivative, an aminated derivative, or a nitrated derivative of these groups; and Compound B containing tris-(2,3-epoxypropyl)-isocyanurate, wherein tris-(2,3-epoxypropyl)-isocyanurate of Compound A before the substitution and tris-(2,3-epoxypropyl)-isocyanurate of Compound B comprise 2% by mass to 15% by mass of -type tris-(2,3-epoxypropyl)-isocyanurate and a remaining percentage of -type tris-(2,3-epoxypropyl)-isocyanurate based on a total mass of Compound A before the substitution and Compound B.