Methods in which toughness improvers based on terminally blocked polyurethane prepolymers are used to increase the maximum linear expansion of single component heat-curing epoxy resin compositions, in particular for joining substrates having different thermal expansion coefficients, in particular in the framework of transport agents or white goods.

The present invention relates to an adhesive composition containing (a) modified cellulose fibers having a cellulose I crystal structure, an average fiber length of 1000 nm or less, and an average fiber diameter of 1 nm or more and 300 nm or less; and (b) a resin. According to the present invention, an adhesive composition having excellent mechanical strength such as shearing adhesive strength can be provided. The adhesive composition of the present invention described above can be utilized in structural adhesion of vehicle assembly products and the like.

An adhesive for an endoscope, the adhesive including (A) an epoxy resin including at least one epoxy resin of a bisphenol A epoxy resin, a bisphenol F epoxy resin, or a phenol novolac epoxy resin, (B) a curing component including at least one of a phosphorus-containing compound, a polythiol compound, a dicyandiamide compound, a phenol compound, or a polyether-polyamine compound, and (C) an inorganic amphoteric ion exchanger; and a cured product of the adhesive. An endoscope including the cured product fixed, and a method for producing the endoscope.

Provided are: a structure adhesive composition which exhibits favorable thread breakage and improves shower resistance, and prevents stringiness when stitch-coating is performed; a method for producing a vehicle structure using the same; and a vehicle structure. A structure adhesive composition exhibiting favorable thread breakage, the structure adhesive composition being a structure adhesive composition containing no liquid rubber component, the structure adhesive composition contains: (A) an epoxy resin in which rubber particles are dispersed as primary particles; and (B) an epoxy resin latent curing agent; a compounded proportion of the rubber particles in the structure adhesive composition is from 10 to 45 mass %; and a viscosity at 50° C. of the structure adhesive composition is from 190 to 380 (Pa.Math.s) when a shearing speed is 5 (sec.sup.−1) and is from 1 to 30 (Pa.Math.s) when the shearing speed is 200 (sec.sup.−1).

Provided is a thermosetting resin composition which achieves both high heat resistance and high bending strength as a fiber-reinforced composite material, and also has rapid curability that enables high cycle press forming, thermal stability, and storage stability. The thermosetting resin composition of the present invention is a thermosetting resin composition comprising an epoxy resin, an epoxy resin curing agent, an imidazole compound, and an epoxy resin curing accelerator, in which the epoxy resin curing agent is dicyandiamide or a derivative thereof, and the epoxy resin curing accelerator comprises a urea derivative having two or more dimethylureido groups in a molecule.

Disclosed herein is a self-healing material comprising microcapsules comprising a monomeric or oligomeric healing agent, and a catalyst that is able to catalyse the polymerisation of the monomeric or oligomeric healing agent.

The epoxy resin composition for a prepreg according to an embodiment of the present invention contains (A) an epoxy resin, (B) a curing agent or a curing accelerator, (C) silica microparticles, and (D) core-shell rubber particles, the epoxy resin composition containing from 1 to 5 parts by mass of (C) the silica microparticles and from 2 to 10 parts by mass of (D) the core-shell rubber particles per 100 parts by mass of (A) the epoxy resin, and a mass ratio of (C) the silica microparticles to (D) the core-shell rubber particles, in terms of (C)/(D), being from 1/1 to 1/5.

An epoxy resin composition suitable for molding a fiber-reinforced plastic molded article is provided. The molded article has exceptional mechanical properties. In particular, a tubular molded article has high breaking strength. The epoxy resin composition contains components (A), (C), and (D), where component (A) is an epoxy resin of a particular formula, component (C) is an epoxy resin other than component (A) that is liquid at 25° C., and component (D) is a curing agent.

In developing epoxy resin compositions used as an adhesive for structure (structural adhesive) required to have adhesive properties, if each component is increased to further enhance the adhesive properties such as shear bond strength and peel strength, this causes problems, for example, as follows. The viscosity becomes so high that the workability deteriorates. Hence, the added amount has to be limited. Moreover, the cured product becomes excessively flexible, so that the shear bond strength deteriorates. An epoxy resin composition contains the following components (A) to (E), where the component (A) does not include the component (C): the component (A): an epoxy resin; the component (B): a blocked urethane resin; the component (C): a rubber-modified epoxy resin; the component (D): rubber particles; and the component (E): a latent curing agent.

The present invention provides a resin composition containing an epoxy compound A having a specific structure having an aromatic ring, and having an epoxy equivalent in the range of from 500 to 10,000 g/eq, and an epoxy compound B having an epoxy equivalent in the range of from 100 to 300 g/eq, and a bonding agent containing the resin composition. Further, the present invention provides a cured product containing resin particles and a matrix resin, wherein the resin particles are a cured product of an epoxy compound A having a specific structure having an aromatic ring, and having an epoxy equivalent in the range of from 500 to 10,000 g/eq, and the matrix resin is a cured product of an epoxy compound B having an epoxy equivalent in the range of from 100 to 300 g/eq, and a laminate having a substrate and the cured product.