Patent classifications
C08G59/4028
Raw material composition for polyisocyanurate and method for producing polyisocyanurate
A polyisocyanurate raw material composition containing a polyfunctional isocyanate, a compound (I) represented by general formula (I) shown below, and an epoxy compound. In general formula (I), each of R.sup.1 to R.sup.5 represents a hydrogen atom, an alkoxy group of 1 to 10 carbon atoms, an alkyl group of 2 to 10 carbon atoms (or an alkyl group of 1 to 10 carbon atoms in the case of R.sup.3 to R.sup.5), an aryl group of 6 to 12 carbon atoms, an amino group, a monoalkylamino group of 1 to 10 carbon atoms, a dialkylamino group of 2 to 20 carbon atoms, a carboxy group, a cyano group, a fluoroalkyl group of 1 to 10 carbon atoms, or a halogen atom (provide that R.sup.1 and R.sup.2 are not both hydrogen atoms). ##STR00001##
Eco-friendly adhesive coating agent composition for steel pipe using intermediate for structural adhesive
Disclosed is an eco-friendly adhesive coating agent composition having high adhesion properties and fast-curing properties by using a thiol-modified epoxy intermediate. The composition includes: a main material including 25 to 40 parts by weight of polyoxypropyleneamine, 20 to 30 parts by weight of a cross-linking agent, 10 to 30 parts by weight of the thiol-modified epoxy intermediate, 10 to 20 parts by weight of an inorganic filler, 5 to 10 parts by weight of a pigment, and 2 to 5 parts by weight of an additive; and a curing agent including 60 to 80 parts by weight of a rubber-modified epoxy resin, 20 to 40 parts by weight of a polyol, 10 to 30 parts by weight of the thiol-modified epoxy intermediate, and 4 to 10 parts by weight of an additive, with respect to 100 parts by weight of an isocyanate mixture.
NAIL STICKER, COMPOSITION FOR NAIL STICKER AND METHOD FOR PREPARING COMPOSITION
A nail sticker, a composition for the nail sticker and a method for preparing the composition are disclosed. Raw materials of the composition include a sizing material, which is made of the following raw materials in parts by weight: 45-85 parts of a UV thermosetting resin, 2-9 parts of a photoinitiator, 1.5-2 parts of a curing agent, 0.1-1 part of a thermal promoter, and 0.1-1 part of a leveling agent. The synchronization of the release of essential oil molecules with light/thermal curing promotes the essential oil molecules to be diffused to the interior of the sizing material more uniformly in a wider range, and during the curing and film forming of the nail sticker, an aroma spreads as tantalizing as that of baked food.
OLIGOMER, COMPOSITION, PACKAGING STRUCTURE, AND METHOD OF DISASSEMBLING PACKAGING STRUCTURE
An oligomer is formed by reacting a diacid monomer with (a) epoxy resin or (b) glycidyl methacrylate, wherein the diacid monomer has a chemical structure of
##STR00001##
wherein X is —O—,
##STR00002##
and each R.sup.1 is independently CH.sub.3, CH.sub.2F, CHF.sub.2, or CF.sub.3. A composition containing the oligomer can be cured to serve as a sealant of an optoelectronic device, and the sealant can be lifted off by a laser beam irradiation.
WATERBORNE EPOXY RESIN FOR ANTI-CORROSION COATING, AND PREPARATION METHOD AND USE THEREOF
The present disclosure discloses a waterborne epoxy resin for an anti-corrosion coating, and a preparation method and use thereof. In the preparation method, a strongly-hydrophilic polyethylene glycol (PEG) branch is introduced into a molecular chain of epoxy resin to realize the self-emulsification function of epoxy resin. Moreover, due to the short molecular chain, a solid content can reach up to 66.7% under the action of PEG. In addition, the waterborne emulsion can be prepared without adding any additional alcohol-soluble solvents and other high-boiling-point organic solvents, and a production process and a product use process both are very environmentally friendly. The waterborne epoxy resin can be mixed with a waterborne ammonia curing agent to form a film for corrosion protection.
Electrodeposition system
An electrocoat system for electrodeposition is described. The system includes an inorganic bismuth-containing compound or a mixture of inorganic and organic bismuth-containing compounds. The system demonstrates a high degree of crosslinking and produces a cured coating with optimal crosslinking and corrosion resistance.
Epoxy adhesive resistant to open bead humidity exposure
Epoxy adhesives are made using core-shell rubbers and small amounts if any of other elastomeric materials. The epoxy adhesives contain a mixture of latent curing agents and/or high levels of calcium oxide. The adhesives exhibit excellent bonding properties even when an open or closed bead is exposed to humid air for prolonged periods before the epoxy adhesive is cured.
EPOXY RESIN AND ELECTRODEPOSITION PAINT
An epoxy resin, which is obtained by reacting at least a compound having one or more epoxy groups and a compound having a functional group that reacts with the epoxy groups, satisfies conditions (I) and/or (II): (I) the compound having a functional group that reacts with the epoxy groups includes a trihydric or higher phenol compound and/or a compound including a trifunctional or higher polyisocyanate; (II) the epoxy resin has an average degree of polyfunctionalization (X1) per molecule, as expressed by Formula (1), of 0.30 or more:
Average degree of polyfunctionalization (X1)=number of ends per molecule of epoxy resin−2. Formula (1):
HOT MELT ADHESIVE SHEET
A hot melt adhesive sheet according to the present invention is a hot melt adhesive sheet including a base material having at least one surface on which an adhesive layer made of a hot melt adhesive is disposed. The hot melt adhesive includes a crosslinked product of an adhesive composition including a crosslinking agent, and includes a polyurethane resin, an epoxy resin, an isocyanate-based crosslinking agent, and a crystalline polyester resin. The epoxy resin includes a bisphenol A type epoxy resin and a rubber-modified epoxy resin. The crystalline polyester resin has a number average molecular weight Mn of 33,000 or less, and a glass transition temperature Tg of 5 C. or less. The isocyanate-based crosslinking agent is included in an amount of 14 mass parts or less based on 100 mass parts of a total of the polyurethane resin and the crystalline polyester resin.
ADHESIVE COMPOSITION FOR ORGANIC FIBER CORD, RUBBER-ORGANIC FIBER CORD COMPOSITE, AND TIRE
The present disclosure provides: an adhesive composition capable of realizing good adhesion even when neither resorcin nor formalin is included therein; and a rubber-organic fiber cord composite and a tire, which are excellent in adhesion between rubber and organic fiber cords and make a low impact on the environment. Specifically, the present invention provides an adhesive composition for an organic fiber cord, comprising therein: an epoxy compound (A); a compound (B) having an amide group and an amino group per molecule; and rubber latex (C). Further, the present disclosure provides a rubber-organic fiber cord composite, comprising a rubber member and an organic fiber cord, wherein at least a portion of the organic fiber cord is coated with the adhesive composition described above.