C08G59/4028

RESIN COMPOSITION, AND RESIN FILM, METAL FOIL WITH RESIN, METAL CLAD LAMINATE, WIRING BOARD, AND CIRCUIT MOUNT COMPONENT USING SAME

One aspect of the present invention relates to a resin composition containing a polyrotaxane (A), an epoxy resin (B), and a curing agent (C), in which the curing agent (C) contains an acid anhydride (C-1) in an amount of 0.1 parts by mass or more and less than 10 parts by mass based on a total of 100 parts by mass of the polyrotaxane (A), the epoxy resin (B), and the curing agent (C).

METHOD FOR THE PRODUCTION OF A THERMOPLASTIC POLYOXAZOLIDINONE

A process for producing a thermoplastic polyoxazolidinone comprising copolymerization of a diisocyanate compound (A) with a bisepoxide compound (B) in the presence of a specific a quaternary ammonium, quaternary phoshonium and/or quaternary stibonium-based catalyst (C), a compound (D), a compound (F) wherein compound (D) and compound (F) is one or more compounds selected from the group consisting of a monofunctional isocyanate, a monofunctional epoxide, a cyclic carbonate, a monofunctional alcohol, a monofunctional amine optionally in a solvent (E), and wherein bisepoxide compound (B) comprises an epoxy-terminated oxazolidone-based prepolymer. The invention is also related to the resulting thermoplastic polyoxazolidinone.

EPOXY RESIN COMPOSITION
20230279218 · 2023-09-07 ·

Provided is an epoxy resin composition that, although it can be cured even at a low temperature, can form a cured product having excellent impact resistance and has excellent adhesive strength. Specifically, provided is an epoxy resin composition containing: (A) an epoxy resin which is liquid at 25° C.; (B) an epoxy resin which is solid at 25° C.; (C) a rubber-modified epoxy resin (excluding the (A) and the (B)); (D) a blocked urethane resin; (E) a spherical inorganic filler having an average particle size of 0.1 μm to 150 μm; (F) an organic filler; and (G) a latent curing agent.

Oligomer, composition, packaging structure, and method of disassembling packaging structure

An oligomer is formed by reacting a diacid monomer with (a) epoxy resin or (b) glycidyl methacrylate, wherein the diacid monomer has a chemical structure of ##STR00001##
wherein X is —O—, ##STR00002##
and each R.sup.1 is independently CH.sub.3, CH.sub.2F, CHF.sub.2, or CF.sub.3. A composition containing the oligomer can be cured to serve as a sealant of an optoelectronic device, and the sealant can be lifted off by a laser beam irradiation.

CATIONIC ELECTRODEPOSITION COATING COMPOSITION

The present invention provides a cationic electrodeposition coating composition with a rust prevention property enhanced by improving the adhesion and the blocking property of a coating film obtained from a cationic electrodeposition coating composition as compared with conventional ones. The present invention provides a cationic electrodeposition coating composition including an aminated epoxy resin and a blocked polyisocyanate curing agent, wherein the aminated epoxy resin is an aminated epoxy resin obtained by reacting an amine compound with an epoxy resin, the aminated epoxy resin has a molecular weight distribution of 2.7 or less, and a rate of elongation of an electrodeposition coating film formed by applying the cationic electrodeposition coating composition to a steel sheet such that a cured film thickness is 20 μm, followed by baking at 160° C. for 15 minutes, is 0.1 to 4.5%.

SYNTHESIS OF LINEAR POLYOXAZOLIDINONES USING URETDIONES AS DIISOCYANATE COMPONENT
20230348657 · 2023-11-02 · ·

A process for preparing a thermoplastic polymer involves reacting at least components (a) to (b), in the presence of a catalyst composition (c). Component (a) is an isocyanate composition containing at least one uretdione diisocyanate (a-i), and component (b) is an epoxide composition containing at least one diepoxide (b-i). The catalyst composition (c) contains at least one ionic liquid (c-i), preferably selected from 1-ethyl-3-methyl imidazolium bromide, 1-benzyl-3-methyl imidazolium chloride. 1-butyl-1-methylpiperidinium chloride, 1-ethyl-2,3-dimethylimidazolium bromide, 1-(2-hydroxyethyl)-3-methyl imidazolium chloride, butyl-1-methylpiperidinium acetate, or mixtures of two or more thereof. A thermoplastic polymer obtained or obtainable from the process is useful for the preparation of a fibre or a molded article or as a modifier for another thermoplastic material.

Thermoplastic polyoxazolidones from diisocyanates and diglycidyl ether of 2-phenyl- 1,3-propanediol derivaitives
11401365 · 2022-08-02 · ·

A method for preparing a thermoplastic polyoxazolidone, the method including catalytically reacting one or more aromatic diisocyanates and one or more diepoxides, wherein the one or more diepoxides comprise one or more 2-phenylpropane-1,3-diol diglycidyl ether derivatives. The one or more diepoxides further contain one or more diglycidyl ethers of aromatic diols.

CONDUCTIVE PAINT, METHOD FOR PRODUCING SHIELD PACKAGE USING THE SAME, AND METHOD FOR PRODUCING RESIN MOLDED ARTICLE HAVING SHIELD LAYER

Provided is a conductive paint that can be cured at a temperature of 110° C. or less and has both excellent conductivity and adhesiveness. The conductive paint includes, per 100 parts by mass of a binder component (A) containing an epoxy resin, 1,000 to 4,000 parts by mass of metal particles (B), 50 to 150 parts by mass of a blocked isocyanate curing agent (C), and 200 to 1,500 parts by mass of a solvent (D).

CURABLE COMPOSITION, CURED PRODUCT, FIBER-REINFORCED COMPOSITE MATERIAL, AND MOLDED ARTICLE
20220251285 · 2022-08-11 · ·

The present invention provides a curable composition containing a urethane-modified epoxy resin (A) as an essential component of a main agent and an acid anhydride (B) as an essential component of a curing agent, the urethane-modified epoxy resin (A) being a reaction product obtained by using a polyisocyanate compound (a1), a polyether polyol (a2), and a hydroxy group-containing epoxy resin (a3) as essential reaction materials; a cured product thereof; a fiber-reinforced composite material; a fiber-reinforced resin molded article; and a method for producing a fiber-reinforced resin molded article. The curable composition can form a cured product having excellent fracture toughness and tensile strength in the cured product.

CURABLE COMPOSITION AND ELECTRONIC DEVICE
20210317251 · 2021-10-14 ·

A curable composition comprises a blocked isocyanate compound (PhI) having a plurality of isocyanate groups each protected by phenols (Ph), and an epoxy compound (E) having a plurality of epoxy groups. The curable composition does not contain an isocyanate scavenger which may react with the isocyanate groups nor an epoxy scavenger which may react with the epoxy groups.