Described herein are processes for producing moldings comprising oxazolidinone groups, where polyisocyanate (a) is mixed with at least one organic compound (b) having two or more epoxide groups, at least one catalyst (c) for the isocyanate/epoxide reaction, and optionally auxiliary and additive materials (d) to form a reaction mixture, which is introduced into or applied to a mold and reacted to give moldings including oxazolidinone groups, where the catalyst (c) for the isocyanate/epoxide reaction includes a compound of the general formula [M(R.sub.1)(R.sub.2)(R.sub.3)(R.sub.4)].sup.+ [X I.sub.n].sup.−, where M is a nitrogen atom or a phosphorus atom, R.sub.1, R.sub.2, R.sub.3 and R.sub.4 are an organic radical, X is fluorine, chlorine, bromine or iodine, I is iodine, and n stands for rational numbers from 0.1 to 10.

Stabilizing cosmetic trays adapted to restrain cosmetic items in a steadfast emplaced position are provided by equipping the cosmetic tray beds with a cohesive and adhesive thermoset overlay typically provided by overlaying a bed of the cosmetic tray therewith. The overlay adhesively restrains emplaced cosmetic items until physically removed by force from the overlay by the cosmetic user.

A catalyst for the synthesis of oxazolidinones, preferable polyoxazolidinones, comprising an N-heterocyclic carbene and a Lewis acid (L). The invention is also related to a process for the production of an oxazolidinone compound, preferably a polyoxazolidinone compound, by reacting an isocyanate compound, preferably a polyisocyanate compound with an epoxide compound, preferably a polyepoxide compound, in the presence of the N-heterocyclic carbene and a Lewis acid catalyst and also to the resulting polyoxazolidinone.

The disclosure relates to an omniphobically coated fluid channel including a channel defining an interior channel surface and a flow volume, and a thermoset omniphobic composition as a coating on the interior channel surface. The thermoset omniphobic composition (such as an omniphobic polyurethane or epoxy composition) includes a thermoset polymer with first, second, and third backbone segments. The first, second, and third backbone segments can correspond to urethane or urea reaction products of polyisocyanate(s), amine-functional omniphobic polymer(s), and polyol(s), respectively, for omniphobic polyurethanes. Similarly, the first, second, and third backbone segments can correspond to urea or beta-hydroxy amine reaction products of polyamine(s), isocyanate-functional omniphobic polymer(s), and polyepoxide(s), respectively, for omniphobic epoxies. The thermoset omniphobic composition coating protects the underlying channel material (such as metal material) from corrosion, and it can further reduce the pressure drop of fluid flowing through the channel. The omniphobically coated fluid channel can be used as a component of a heat transfer apparatus.

The present invention relates to a reaction mixture including one or more polyfunctional isocyanates such that the average isocyanate functionality of the mixture is greater than 2.1, and a catalyst composition including at least one trimerization catalyst and at least one epoxide group; and curing the reaction mixture to give a cured polymer composition made up of the reaction product of isocyanates with themselves.

A polymer resin composition free of solvent and adapted for in situ curing including: (a) at least one epoxy resin compound; (b) at least one isocyanate compound; and (c) a catalyst system including a combination of at least one primary catalyst and at least one secondary catalyst; wherein the primary catalyst includes (ci) at least one organoantimony catalyst; and wherein the secondary catalyst includes (cii) a nitrogen-containing catalyst; and a process for preparing the above composition.

The invention provides an adhesion promoter composition comprising at least one polymer A selected from at least one epoxy resin-phenol resin precondensate, a mixture of at least one epoxy resin-phenol resin precondensate and epoxy resins, a mixture of epoxy resins and phenol resins, polyamide resins and mixtures thereof, and at least one copolyamide-based hotmelt adhesive. Additionally described is a primer composition comprising at least one polymer B selected from saturated polyester resins, epoxy-phenol resin precondensates, mixtures of epoxy resins and phenol resins, and mixtures thereof, at least one crosslinker resin selected from the group consisting of melamine resins, blocked isocyanate resins and mixtures thereof, at least one catalyst, and at least one copolyamide-based hotmelt adhesive.

The present disclosure is related to an accelerator composition for the cure of polyfunctional isocyanates with epoxy resins comprising (a) a boron trihalide-amine complex, and (b) a quaternary ammonium or phosphonium halide as well as the use of such accelerator composition, cured isocyanate-epoxy resin products obtainable therefrom and a method of making a cured isocyanate-epoxy resin product.

A polyisocyanurate raw material composition containing a polyfunctional isocyanate, a compound (I) represented by general formula (I) shown below, and an epoxy compound. In general formula (I), each of R.sup.1 to R.sup.5 represents a hydrogen atom, an alkoxy group of 1 to 10 carbon atoms, an alkyl group of 2 to 10 carbon atoms (or an alkyl group of 1 to 10 carbon atoms in the case of R.sup.3 to R.sup.5), an aryl group of 6 to 12 carbon atoms, an amino group, a monoalkylamino group of 1 to 10 carbon atoms, a dialkylamino group of 2 to 20 carbon atoms, a carboxy group, a cyano group, a fluoroalkyl group of 1 to 10 carbon atoms, or a halogen atom (provide that R.sup.1 and R.sup.2 are not both hydrogen atoms).

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Provided are a curable resin composition having high durability and adherence to a base material such as a metal, a molded composite member formed by coating the base material with the curable resin composition and performing resin molding, and a production method for the same. The curable resin composition contains a polyamide-based resin, a blocked polyisocyanate, and an epoxy compound, and the polyamide-based resin has an amino group concentration from 20 to 300 mmol/kg, and has a water absorption of 1 mass % or less determined by a water absorption test specified by ASTM D570. The polyamide-based resin has a C.sub.8-18 alkylene chain and has a melting point from 160 to 250° C. Per 1 mol of amino groups of the polyamide-based resin, a proportion of isocyanate groups of the blocked polyisocyanate is from 1.5 to 5 mol, and a proportion of epoxy groups of the epoxy compound is from 0.1 to 0.8 mol.