A curing agent for curing an epoxy resin comprises a fluorinated central moiety covalently bonded to first and second imide-amine moieties, the first and second imide-amine moieties include amine terminal functional groups, wherein the amine functional groups of the curing agent, when applied to the epoxy resin, take part in curing reactions with ring molecules of the epoxy resin.

To provide a composition for a three-dimensional integrated circuit capable of forming a filling interlayer excellent in thermal conductivity also in a thickness direction, using agglomerated boron nitride particles excellent in the isotropy of thermal conductivity, disintegration resistance and kneading property with a resin. A composition for a three-dimensional integrated circuit, comprising agglomerated boron nitride particles which have a specific surface area of at least 10 m.sup.2/g, the surface of which is constituted by boron nitride primary particles having an average particle size of at least 0.05 m and at most 1 m, and which are spherical, and a resin (A) having a melt viscosity at 120 C. of at most 100 Pa.Math.s.

The present exemplary embodiments may provide a latent curing agent including an imidazole-based compound protected by a Diels-Alder reaction between a diene and a dienophile.

An adhesive composition comprising an epoxy compound and a compound comprising at least one aminimide functional group is disclosed. The compound comprising the at least one aminimide functional group is present in an amount from 2-8% by weight based on total weight of the adhesive composition and reacts with the epoxy compound upon activation by an external energy source. The adhesive composition also may comprise an amidine salt.

A thermosetting resin composition which produces no free isocyanate even when a carbodiimide compound is used and provides a cured resin having high heat resistance. The thermosetting resin composition makes it possible to reduce the curing temperature, cures in a short time and provides a cured rein having a high glass transition temperature. The thermosetting resin composition includes: (A) an epoxy resin (component A); and (B) a cyclic carbodiimide compound (component B) including a cyclic structure having one carbodiimide group and represented by the following formula (B-i) in which first nitrogen and second nitrogen are bonded together by a bond group and having 8 to 50 atoms forming the cyclic structure:

##STR00001##

(wherein Q is bivalent to tetravalent bond group which is an aliphatic group, alicyclic group, aromatic group, or a combination of these groups and may contain a hetero atom or substituent); and/or
(b) a polyvalent amine-based curing agent (component b) represented by the following formula (b-i):

##STR00002##

(wherein Ar.sup.1 to Ar.sup.4 are each independently a phenylene group or naphthalene-diyl group which may be substituted by a substituent).

There is provided a thermosetting resin composition including: an epoxy compound having an isocyanuric acid ring represented by the following formula (1); a solid lubricant; and a dicyanate compound, or the dicyanate compound and a bismaleimide compound. ##STR00001##

A resin composition according to the present invention contains a cyanate compound (A). Further, the resin composition according to the present invention contains a maleimide compound (B) and/or an epoxy resin (C); and primary hexagonal boron nitride particles (D) having an average aspect ratio of 4 to 10.

The present invention relates to an adhesive resin composition including a styrene-ethylene-butylene-styrene copolymer with a specific chemical structure, an epoxy resin, an acid anhydride compound, and a curing catalyst, an adhesive film obtained from the resin composition, and a flexible metal laminate including the adhesive film.

A curing agent for curing an epoxy resin comprises a fluorinated central moiety covalently bonded to first and second imide-amine moieties, the first and second imide-amine moieties include amine terminal functional groups, wherein the amine functional groups of the curing agent, when applied to the epoxy resin, take part in curing reactions with ring molecules of the epoxy resin.

There is provided a resin composition for printed wiring boards that, while maintaining excellent flame retardance, has excellent heat resistance, reflow resistance, and drilling workability, and, at the same time, has low water absorption without use of halogen compounds and phosphorus compounds. The resin composition comprises (A) a non-halogen epoxy resin, (B) a biphenyl aralkyl phenolic resin, (C) a maleimide compound and (D) an inorganic filler.