A two-component waterborne coating system includes: a first component including an acid-functional polymer having an acid value of at least 100, based on total resin solids, dispersed in an aqueous medium; and a second component separate from the first component. The second component includes an epoxy-functional compound. A method of preparing a two-component waterborne coating system and two-component waterborne coating system kit are also described herein.

The present disclosure provides for latent curing accelerators as well as compositions containing such a latent curing accelerator with a substance to be cured (e.g., an epoxy resin). The latent curing accelerators comprise a urea compound and an encapsulant system having a polyphenol resin and/or at least one additional excipient. Methods of making and use are further provided.

Epoxy-based adhesive compositions are provided, exhibiting improved uncured humidity resistance, cured humidity resistance and improved wash-off resistance, which upon curing result in crash durable and stress resistant cured bonds on steel and low surface tension surfaces, e.g. ZnMgAl, hot dipped galvanized (HDG) and treated aluminum surfaces. Also provided are bonded assemblies comprising pre-cure or fully cured epoxy-based adhesives, methods of making the epoxy-based adhesives, methods of bonding assemblies and articles of manufacture comprising the bonded assemblies.

Resin composition of the present disclosure includes: an epoxy resin; and a hardener, in which the hardener contains a styrene-maleic anhydride copolymer (SMA) and an anhydride having only one anhydride group in a molecule. An acid value of the SMA is in a range from 300 to 550, inclusive. A ratio of an anhydride equivalent number of the anhydride with respect to an epoxy group equivalent number of the epoxy resin is in a range from 0.05 to 0.5, inclusive. A ratio of the total number of the equivalent numbers of the anhydride groups of the anhydride and the SMA with respect to the epoxy group equivalent number is a range from 0.5 to 1.2, inclusive.

Provided are a thermosetting epoxy resin composition and a prepreg, laminated board and printed circuit board using the thermosetting epoxy resin composition. The thermosetting epoxy resin composition comprises the following components in parts by weight: 2-10 parts of a phosphorus-containing anhydride, 5-40 parts of a phosphorus-free anhydride, 5-45 parts of an epoxy resin, 40-70 parts of a filler, and 0-15 parts of a phosphorus-containing flame retardant, with the total part by weight of all these components being 100 parts, wherein the phosphorus-containing anhydride has a structure as represented by formula I or II, and the epoxy resin is selected from one of or a combination of at least two of a bisphenol A epoxy resin, a bisphenol F epoxy resin and a biphenyl epoxy resin. The thermosetting epoxy resin composition also has good heat resistance, discoloration resistance and dimensional stability after curing while ensuring V-0 grade flame resistance, and can be used for the preparation of printed circuit board substrates in the field of LEDs.

The invention relates to an adhesive composition having an added component of rubber-epoxy such as XNBR-epoxy adducts. It was found that the new adhesive composition significantly reduces meander formation in the making of automotive parts.

Epoxy curing agents are disclosed having an epoxy curing agent comprising at least one room temperature ionic liquid salt, the room temperature ionic liquid salt being a reaction product of (a) at least one polyalkylene polyamine compound represented by formula (I): ##STR00001##
wherein x, y, and z are integers of 2 and 3, m and n and integers of 1-3; and (b) an organic acid having pKa (the negative of the logarithm of the acid dissociation constant) less than 6. The liquid salt is a stable liquid at a temperature greater than 15 C. Curable epoxy-based compositions including the curing agent and articles formed by the curable epoxy-based compositions are also disclosed.

Provided is a thermosetting biscitraconimide resin composition including (A) a biscitraconimide compound, (B) a monocitraconimide compound having a melting point of 60 C. or less, (C) an epoxy resin, (D) an epoxy resin curing agent, and (E) a curing accelerator.