Provided is a water-based epoxy resin composition and a cured product thereof, the water-based epoxy resin composition obtained by blending a water-based epoxy resin (A) and a curing agent composition (B) containing a reaction product (b1) of epichlorohydrin and an amine compound represented by the following formula (1), the water-based epoxy resin composition having a content ratio of the component (A) and the component (B) defined as [number of epoxy groups in component (A)/number of active amine hydrogens in component (B)] of 1/1.1 to 1/0.3:

H.sub.2N—CH.sub.2—A—CH.sub.2—NH.sub.2   (1)

wherein A is a 1,2-phenylene group, a 1,3-phenylene group, or a 1,4-phenylene group.

A thermoset precursor composition includes a backbone comprising an imine bond bonding at least one of: 1) aromatic compounds together, or 2) bonding an aromatic compound to an aliphatic chain, and at least one of: an epoxy group terminating the backbone or an aldehyde group terminating the backbone. The thermoset precursor can have at least two epoxy groups, one epoxy group and one aldehyde group, or two aldehyde groups.

Adhesion promoters, Curable compositions containing the adhesion promoters, cured compositions that are formed from the curable compositions, and articles containing the cured compositions are provided. The adhesion promoter has at least one epoxide group and a plurality of hydrolyzable silyl groups. The curable compositions include an adhesion promoter, an epoxy resin, and a curing agent for the epoxy resin that has at least two amino groups that are primary and/or secondary amino groups.

The disclosure generally relates to omniphobic compatibilizers, which include a polymerization reaction product between a first vinyl monomer, optionally a second vinyl crosslinking monomer, and a functionalized omniphobic polymer. The functionalized omniphobic polymer can include two or more vinyl functional groups or at least one free radical initiator functional group such that the reaction product forming the omniphobic compatibilizer can be a vinyl or free-radical polymerization product. The omniphobic compatibilizer can be incorporated into a UV-curable or a non-UV-curable thermoset omniphobic composition. The UV-curable composition can be a crosslinked polymerization reaction product between the omniphobic compatibilizer, a third vinyl monomer, and a fourth polyvinyl crosslinking monomer. The non-UV-curable composition can be a crosslinked polymerization reaction product between the omniphobic compatibilizer, a first thermosetting component, and a second thermosetting component. The thermoset omniphobic composition can be a coating on a substrate in a corresponding coated article.

The disclosure generally relates to omniphobic compatibilizers, which include a polymerization reaction product between a first vinyl monomer, optionally a second vinyl crosslinking monomer, and a functionalized omniphobic polymer. The functionalized omniphobic polymer can include two or more vinyl functional groups or at least one free radical initiator functional group such that the reaction product forming the omniphobic compatibilizer can be a vinyl or free-radical polymerization product. The omniphobic compatibilizer can be incorporated into a UV-curable or a non-UV-curable thermoset omniphobic composition. The UV-curable composition can be a crosslinked polymerization reaction product between the omniphobic compatibilizer, a third vinyl monomer, and a fourth polyvinyl crosslinking monomer. The non-UV-curable composition can be a crosslinked polymerization reaction product between the omniphobic compatibilizer, a first thermosetting component, and a second thermosetting component. The thermoset omniphobic composition can be a coating on a substrate in a corresponding coated article.

A dry adhesive for attachment to a flexible adherend comprises a shape memory polymer having a glass transition temperature (T.sub.g) above 25° C. and a compliant backing layer attached to the shape memory polymer. The shape memory polymer is configured to form a conformal and/or hermetic contact with a flexible adherend at temperatures at or above the T.sub.g and to retain the conformal and/or hermetic contact during flexing of the flexible adherend at temperatures below the T.sub.g

Provided are curable compositions including a base part comprising an amine-reactive curable resin and a curative part comprising a polymeric toughener dissolved in an amine. The polymeric toughener, optionally a rubbery polymer or thermoplastic polymer, is solid at ambient conditions with a weight average molecular weight of at least 5,000 g/mol while the amine is a liquid at ambient conditions. The curable composition is cured by mixing the base and curative parts with each other. Hardened compositions obtained thereof can achieve increased toughener loading, resulting in high peel and shear strength performance over a wide range of temperatures, including at temperatures exceeding 180° F. (82° C.).

The present disclosure provides a polymeric material including a polymerized reaction product of a polymerizable composition including components, and a thermally activatable amine curative, and has a solids content of 90% or greater. The components include a uretdione-containing material including a reaction product of a diisocyanate reacted with itself; a first hydroxyl-containing compound; and an optional second hydroxyl-containing compound having a single OH group. The first hydroxyl-containing compound has more than one OH group and the optional second hydroxyl-containing compound is a primary alcohol or a secondary alcohol. The present disclosure also provides a two-part composition, in which a polymeric material is included in the first part and the second part includes at least one liquid amine. Further, a method of adhering two substrates is provided, including obtaining a two-part composition; combining at least a portion of the first part with at least a portion of the second part to form a mixture; disposing at least a portion of the mixture on a first substrate; and contacting a second substrate with the mixture disposed on the first substrate. The disclosure also provides a polymeric material and a method of curing a two-part composition. Advantageously, two-part compositions according to the present disclosure can be used as coatings and adhesive systems having a two-step cure with handling and performance similar to existing two-part urethane systems, but with less sensitivity to water.

A composition including a polythiol having more than one thiol groups, a polyepoxide having more than one epoxide group, a photolatent base catalyst that can photochemically generate a first amine, and a second amine phase-separated within the composition. A polymer network preparable from the composition, and a method for making the polymer network are also disclosed.

Adhesion promoters, Curable compositions containing the adhesion promoters, cured compositions that are formed from the curable compositions, and articles containing the cured compositions are provided. The adhesion promoter has at least one epoxide group and a plurality of hydrolyzable silyl groups. The curable compositions include an adhesion promoter, an epoxy resin, and a curing agent for the epoxy resin that has at least two amino groups that are primary and/or secondary amino groups.