The present invention relates to a novel method for manufacturing rigid epoxy foams. Furthermore the present invention relates to materials, especially novel two-component epoxy systems that are used to conduct this method.

This novel process is characterized in that an epoxy resin is mixed with a blowing agent, especially an encapsulated blowing agent, and afterwards with an ionic liquid. Surprisingly the reaction, including foaming, starts at room temperature after a short time like after only 2 to 3 minutes.

In summary, the present invention comprises a two-component foam-in-place structural material and a process for producing a rigid epoxy foam.

A method for strengthening metal structure, including steps: i) mixing two-component epoxy resin composition; ii) applying composition to metal structure surface, or onto strengthening element, or both; iii) contacting applied epoxy resin composition with strengthening element surface and/or metal structure surface wherein composition forms interlayer between metal structure and strengthening element, and iv) curing epoxy resin composition at 100° C. or below; wherein two-component epoxy resin composition contains: first component between 10-50 wt.-% of at least one epoxy resin contains on average more than one epoxy group per molecule; second component between 5-30 wt.-% of hardener for epoxy resins; between 3-25 wt.-% of at least one impact strength modifier in one or both components; between 15-80 wt.-% of at least one filler in one or both components; and wherein two-component epoxy resin composition exhibits after curing Elastic Modulus at least 2500 MPa, and Impact Peel Strength at least 15 N/mm.

A curable composition includes a polyamide composition that includes a first polyamide. The first polyamide includes a tertiary amide in the backbone thereof and is amine terminated. The curable composition further includes an amino functional compound comprising from 2 to 20 carbon atoms, a multifunctional (meth)acrylate, an epoxy resin, and an inorganic filler. The inorganic filler is present an amount of at least 25 wt. %, based on the total weight of the curable composition.

Provided are curable compositions including a base part comprising an amine-reactive curable resin and a curative part comprising a polymeric toughener dissolved in an amine. The polymeric toughener, optionally a rubbery polymer or thermoplastic polymer, is solid at ambient conditions with a weight average molecular weight of at least 5,000 g/mol while the amine is a liquid at ambient conditions. The curable composition is cured by mixing the base and curative parts with each other. Hardened compositions obtained thereof can achieve increased toughener loading, resulting in high peel and shear strength performance over a wide range of temperatures, including at temperatures exceeding 180° F. (82° C.).

Provided are an adhesive for an endoscope, a cured product of the adhesive for an endoscope, an endoscope produced using the adhesive for an endoscope, and a method for producing an endoscope. The adhesive for an endoscope includes at least one epoxy resin (A) selected from the group consisting of bisphenol A epoxy resins, bisphenol F epoxy resins, and phenol novolac epoxy resins, a polyamine compound (B), and a specific compound (C) having an epoxy group.

A curing agent and method for producing the same are provided, the method includes: esterification reaction: reacting a polyhydric alcohol with a polybasic acid anhydride to obtain an ester-based emulsifier (A); chain extension reaction: reacting an ester-based emulsifier (A) with a bifunctional epoxy resin to obtain a polymer intermediate (B); and reacting the polymer intermediate (B) with a polyamine compound to obtain a curing agent (C).

A curing agent composition and a curing agent coating formula thereof are provided. The curing agent composition includes 5 to 25 wt % of an ester group-containing amine end group adduct, 2 to 25 wt % of a C8-C22 hydrophobic saturated or unsaturated fatty amine, 2 to 25 wt % of a polyamine compound, 2 to 20 wt % of a silane compound, and 10 to 60 wt % of an ether solvent.

Provided are an amine compound represented by the following formula (1), which has a low active hydrogen equivalent weight and thus is capable of providing a cured product having good properties because the amine compound has sufficient curability even though the amount of amine compound blended in an epoxy resin composition is small when the amine compound is used as an epoxy resin curing agent, and an amine composition and an epoxy resin curing agent, which contain the compound: ##STR00001## wherein A is a 1,2-phenylene group, a 1,3-phenylene group, or a 1,4-phenylene group.

The invention relates to a polymeric composite. The polymeric composite includes a polymeric matrix that further includes a thermoset polymer and a phase change material that has been mixed with the polymeric matrix using a thickening agent. In some cases, the polymeric composite is at least 10% by weight of the phase change material.

Room temperature curing, two-component epoxy adhesives useful in bonding oily substrates include a resin side A and a curative side B. The resin side A includes an epoxy resin, a toughening component, a plasticizer and filler, and the curative side B includes a polyetheramine, amine-terminated butadiene rubber and a curing catalyst.