A compound of formula (I): MX.sub.y, alone or in combination with a compound of formula (II): MX.sub.zL, useful as a catalyst for accelerating the crosslinking of a reactive epoxy monomer, oligomer or polymer to form an epoxy thermoset resin, is provided. In formulas (I) and (II), M represents a rare earth metal cation, X represents an anion of formula R—Z—O″, wherein R represents a hydrocarbon radical optionally substituted with one or more halogen atom and —Z— represents —S(═O).sub.2— or —O—S(═O).sub.2—, z=y+1, and L represents Na.sup.+, H.sup.+, or a combination thereof.

Alkoxylated hydrophobes that include a poly(alkylene oxide) chain of at least 5 oxyalkylene units having a terminal secondary hydroxyl group or a terminal C.sub.1−8 hydrocarbyl group are effective internal mold release agents for epoxy resin moldings. The alkoxylated hydrophobe, when mixed with an epoxy resin, forms a mixture that is highly stable when heated to 80 to 100° C. and held at that temperature for a period of as much as 22 days.

A resin composition and method for installing a pipe liner that allows the liner to be fully wet out with a resin and activator and stored for a period of up to six months prior to installation and curing. A method of lining a pipe with a delayed curing resin composition is also provided that includes fully wetting out a liner with a blended two part epoxy composition such that the liner can be transported in a wet out fashion, placed in a pipe to be lined and repositioned as needed without concern for the resin composition to begin curing.

A resin composition and method for installing a pipe liner that allows the liner to be fully wet out with a resin and activator and stored for a period of up to six months prior to installation and curing. A method of lining a pipe with a delayed curing resin composition is also provided that includes fully wetting out a liner with a blended two part epoxy composition such that the liner can be transported in a wet out fashion, placed in a pipe to be lined and repositioned as needed without concern for the resin composition to begin curing.

An epoxy resin adhesive including at least one epoxy resin in the resin component, at least one adduct AD including primary amino groups which is free-flowing at room temperature and is formed from (i) at least one polyepoxide and (ii) at least one amine of the formula (I) and optionally further amines, and additionally at least one accelerator B having at least one dimethylamino group in the hardener component, and a total of at least 50% by weight of at least one inorganic filler. The epoxy resin adhesive has low odor and good processibility, rapidly builds up strength at room temperature and under cold conditions and, after curing, has high strengths, especially particularly high compressive strengths, and high bonding forces to substrates such as steel, carbon fiber composites (CRP) and concrete.

Proposed is a recyclable epoxy compound containing an α,β-unsaturated ketone group and/or a hydroxy ketone group bonded through an aldol reaction between a ketone group and an aldehyde group containing a hydroxyl group among non-toxic natural materials, without using a bisphenol A type epoxy, a toxic material. In addition, proposed are a method of preparing the same compound, an epoxy composite material containing the same compound, and a method of degrading the same composite material.

An insulating heat dissipation coating composition including a coating layer-forming component including a subject resin, and an insulating heat dissipation filler. Therefore, the coating composition may have excellent thermal conductivity and excellent thermal emissivity, and therefore an insulating heat dissipation coating layer which exhibits excellent heat dissipation performance and has insulating property may be formed. In addition, the heat dissipation coating layer formed thereby has a very excellent adhesive strength to a surface to be coated so as to significantly prevent peeling of the coating layer during use, and to maintain durability of the coating layer even against a physical or chemical stimulus such as external heat, organic solvent, moisture or shock, which is generated after the coating layer is formed.

An epoxy terminated polyester; an adhesive formulation including the epoxy terminated polyester and a curative composition; a laminating adhesive prepared from the above adhesive formulation; a process of making a laminate; a laminate made by the above process; and a flexible package prepared from the above laminate.

Epoxide functionalized polyaromatic feedstocks and processes for their preparation are described. The processes involve functionalizing polyaromatic hydrocarbon molecules and/or polyheterocyclic molecules present in petroleum or petrochemical streams with epoxide. The epoxide functionalized poly aromatic feedstock can be further treated so as to effect oligomerization or polymerization. The oligomers or polymers may be thermoplastic or thermoset materials and may find use in, for example, infrastructure applications, composites, fillers, fire retardants and 3-D printing materials.

Alkoxylated hydrophobes that include a poly(alkylene oxide) chain of at least 5 oxyalkylene units having a terminal secondary hydroxyl group or a terminal C.sub.1-8 hydrocarbyl group are effective internal mold release agents for epoxy resin moldings. The alkoxylated hydrophobe, when mixed with an epoxy resin, forms a mixture that is highly stable when heated to 80 to 100° C. and held at that temperature for a period of as much as 22 days.