Patent classifications
C08G59/60
PREPREGS AND PRODUCTION OF COMPOSITE MATERIAL USING PREPREGS
A prepreg having at least one layer of fibres and a curable thermosetting resin system at least partly impregnating the at least one layer of fibres, wherein the curable thermosetting resin system includes a curable thermosetting resin including at least two epoxide groups, a curing agent that includes at least one amine group, and an accelerator that includes an azole group; wherein the curable thermosetting resin, the curing agent and the accelerator are provided in respective concentrations in the prepreg to provide that, after curing the thermosetting resin at a cure temperature of at least 140 C. for a period of from 1 to 6 minutes, (i) the cured thermosetting resin has a glass transition temperature Tg which is greater than the cure temperature and is within the range of from 150 C. to 180 C. and (ii) the cured thermosetting resin is at least 90% cured.
Epoxy resin, method for producing epoxy resin, curable resin composition, cured product, fiber reinforced composite material, and molded article
Provided are a curable resin composition capable of providing excellent heat resistance and toughness for a cured product, in which these physical properties are less deteriorated even in a case of being exposed to humidity and heat conditions, and a cured product, a fiber reinforced composite material, and a molded article thereof. The curable resin composition includes an epoxy resin and a curing agent, in which the epoxy resin is an epoxy resin obtained by the polyglycidyl-etherification of a phenol novolac resin. The phenol novolac resin contains bisphenol F having different binding sites, and in the bisphenol F components, the content of the [o, p] conjugate is in a range of 30% to 45% relative to the total of the [o, p] conjugate+the [o, o] conjugate+the [p, p] conjugate in terms of the area ratio according to a liquid chromatography measurement.
Epoxy resin, method for producing epoxy resin, curable resin composition, cured product, fiber reinforced composite material, and molded article
Provided are a curable resin composition capable of providing excellent heat resistance and toughness for a cured product, in which these physical properties are less deteriorated even in a case of being exposed to humidity and heat conditions, and a cured product, a fiber reinforced composite material, and a molded article thereof. The curable resin composition includes an epoxy resin and a curing agent, in which the epoxy resin is an epoxy resin obtained by the polyglycidyl-etherification of a phenol novolac resin. The phenol novolac resin contains bisphenol F having different binding sites, and in the bisphenol F components, the content of the [o, p] conjugate is in a range of 30% to 45% relative to the total of the [o, p] conjugate+the [o, o] conjugate+the [p, p] conjugate in terms of the area ratio according to a liquid chromatography measurement.
ENCAPSULATION COMPOSITION FOR STORAGE OR CONFINEMENT OF WASTE WHICH IS TOXIC TO HEALTH AND/OR THE ENVIRONMENT
The invention relates to an encapsulation composition for the storage or the confinement of waste which is toxic to health and/or the environment, comprising a resin composition containing at least one epoxy resin, and a hardening composition containing at least one polyamidoamine and at least one aromatic polyamine, said encapsulation composition having an aromaticity rate which is equal to, or higher than, 35%. The invention also relates to the use of said composition for encapsulating said waste.
ENCAPSULATION COMPOSITION FOR STORAGE OR CONFINEMENT OF WASTE WHICH IS TOXIC TO HEALTH AND/OR THE ENVIRONMENT
The invention relates to an encapsulation composition for the storage or the confinement of waste which is toxic to health and/or the environment, comprising a resin composition containing at least one epoxy resin, and a hardening composition containing at least one polyamidoamine and at least one aromatic polyamine, said encapsulation composition having an aromaticity rate which is equal to, or higher than, 35%. The invention also relates to the use of said composition for encapsulating said waste.
APCHA AS A BUILDING BLOCK IN CURING AGENT FORMULATIONS FOR STRUCTURAL ADHESIVES
The invention relates to structural adhesive compositions and more particularly to two-component (2K) structural adhesive compositions. The two components chemically react to bond structural surfaces. N-(3-Aminopropyl)cyclohexylamine (APCHA) has been found to be an improved curing agent for use with epoxy resins in 2K adhesive compositions. APHCA exhibits favorable features including viscosity, pot life and reactivity, and adhesive and thermal performance after curing with epoxy resin. These features and its unique chemistry allow the use of APCHA in curing agent formulations for structural adhesives, in particular wind turbine blade adhesives. APCHA solves issues with viscosity build-up, working time, through-cure, compatibility and adhesive performance that cannot be addressed with the commonly used amine formulations.
APCHA AS A BUILDING BLOCK IN CURING AGENT FORMULATIONS FOR STRUCTURAL ADHESIVES
The invention relates to structural adhesive compositions and more particularly to two-component (2K) structural adhesive compositions. The two components chemically react to bond structural surfaces. N-(3-Aminopropyl)cyclohexylamine (APCHA) has been found to be an improved curing agent for use with epoxy resins in 2K adhesive compositions. APHCA exhibits favorable features including viscosity, pot life and reactivity, and adhesive and thermal performance after curing with epoxy resin. These features and its unique chemistry allow the use of APCHA in curing agent formulations for structural adhesives, in particular wind turbine blade adhesives. APCHA solves issues with viscosity build-up, working time, through-cure, compatibility and adhesive performance that cannot be addressed with the commonly used amine formulations.
Epoxy resin, method for producing epoxy resin, curable resin composition and cured product thereof, fiber-reinforced composite material, and molded article
Provided is an epoxy resin which has a low viscosity and excellent impregnation capability into reinforcing fibers and provides a cured product having a high elastic modulus and excellent heat resistance when the epoxy resin is used for a fiber-reinforced resin material, and a method for producing the epoxy resin, a curable resin composition, and a cured product thereof, a fiber-reinforced composite material, and a molded article. An epoxy resin which is polyglycidyl ether that is a polycondensation product of phenol and hydroxybenzaldehyde, the resin includes the trinuclear body (X) represented by the following Structural Formula (1), in which the content of a [o,p,p] bonding body (x1) represented by the following Structural Formula (1-1) among the trinuclear body (X) is in the range of 5% to 18% in terms of an area ratio as measured by liquid chromatography. ##STR00001##
Epoxy resin, method for producing epoxy resin, curable resin composition and cured product thereof, fiber-reinforced composite material, and molded article
Provided is an epoxy resin which has a low viscosity and excellent impregnation capability into reinforcing fibers and provides a cured product having a high elastic modulus and excellent heat resistance when the epoxy resin is used for a fiber-reinforced resin material, and a method for producing the epoxy resin, a curable resin composition, and a cured product thereof, a fiber-reinforced composite material, and a molded article. An epoxy resin which is polyglycidyl ether that is a polycondensation product of phenol and hydroxybenzaldehyde, the resin includes the trinuclear body (X) represented by the following Structural Formula (1), in which the content of a [o,p,p] bonding body (x1) represented by the following Structural Formula (1-1) among the trinuclear body (X) is in the range of 5% to 18% in terms of an area ratio as measured by liquid chromatography. ##STR00001##
RESIN COMPOSITION, CONDUCTIVE RESIN CONPOSITION, ADHESIVE, CONDUCTIVE ADHESIVE, PASTE FOR FORMING ELECTRODES, AND SEMICONDUCTOR DEVICE
There is provided a resin composition which has long-term heat resistance, rapid curing properties, high adhesive strength during heating, a low change ratio of adhesive strength, and a low normal temperature elastic modulus. The resin composition includes (A) a compound having in its molecule an OH group and any one of primary to tertiary amines, (B) dicyandiamide and/or imidazoles, (C) bismaleimides, and (D) a compound having in its molecule one or more epoxy groups, or cyanate ester.