The present disclosure provides a curable adhesive composition precursor, comprising a first part (A) comprising (i) at least one first epoxy curing agent selected from diamines: (ii) at least one second epoxy curing agent selected from phenalkamides and/or phenalkamines: (iii) at least one first curing aid selected from metal salt hydrates: (iv) at least one second curing aid selected from phenolic amines: a second part (B) comprising (i) at least one epoxy resin: (ii) at least one first impact modifier; (iii) at least one second impact modifier different from the at least one first impact modifier: (iv) at least one amphoteric corrosion inhibitor selected from phosphonate compounds and phosphosilicate compounds.

Epoxy curatives and two-part compositions comprising epoxy curative and epoxy resin parts are provided as well as methods of their use in liquid shim applications. Epoxy curatives comprise at least one cycloaliphatic polyamine curative and at least one second curative selected from a) an aliphatic polyamidoamine and b) an adduct of an excess of an unbranched polyetherdiamine with an epoxy resin.

Epoxy curatives and two-part compositions comprising epoxy curative and epoxy resin parts are provided as well as methods of their use in liquid shim applications. Epoxy curatives comprise at least one cycloaliphatic polyamine curative and at least one second curative selected from a) an aliphatic polyamidoamine and b) an adduct of an excess of an unbranched polyetherdiamine with an epoxy resin.

An epoxy resin composition for a fiber-reinforced composite material includes: (a) one or more epoxy resins; (b) an aromatic diamine compound; (c) a dicyandiamide; (d) a urea compound; and (e) an amine adduct compound, blended in specific ranges.