The invention relates to heat-curing and light-fixable epoxy-based compositions which are liquid at room temperature, comprising at least one epoxy-containing compound (A) having at least two epoxy groups, at least one curing agent (B) for the epoxy-containing compound, optionally an accelerator (C), at least one radiation-curing compound (D), at least one photoinitiator (E) for radical polymerization and at least one filler (F). The radiation-curing compound (D) comprises at least one at least trifunctional (meth)acrylate. In particular, the epoxy composition can be used for fixing and/or selectively encapsulating electrical, electronic and/or electromechanical components, and/or for bonding, coating and sealing.

Disclosed are compositions for coating substrates used in wet environments including boats, ships, other marine vessels and their parts that are submerged in water. The compositions comprise solvent-borne monomers, diluent, an adhesion promoter, a rheology modifier and a ceramic performance additive such as hollow spheres and non-hollow spheres. Once the composition is applied to a substrate, the coatings protect by minimizing cavitation and underwater radiation noise when the marine vessel is in operation. The coatings may also exhibiting improved substrate adhesion, overcoat adhesion, recoat adhesion, bending strength of at least 10 mm, reduced noise radiation, and/or improved hardness as indicated by scratch resistance (relative to a control).

A task is to provide a method for producing a polycyclic aromatic aminophenol compound through a reduced number of steps at a low cost with high safety. The method for producing a polycyclic aromatic aminophenol compound includes the step of reacting a compound represented by the general formula (1) below and an aromatic amino compound with each other:

##STR00001##

Wherein n represents an integer of 1 to 8, Ar represents a benzene ring optionally having a substituent, or a naphthalene ring optionally having a substituent, each of R.sup.1 and R.sup.2 independently represents a hydrogen atom, a hydrocarbon group having 1 to 6 carbon atoms and optionally having a substituent, or an aromatic group optionally having a substituent, and R.sup.3 represents a hydroxyl group, a methoxy group, or a halogen atom.

Disclosed is an extension of a partial application of the previous invention (P.R.C. Pat. Application No. 201110357015.X) that overcomes the issues of the previous invention requiring a too long curing time of the accelerator, curing agent and diluent after they are mixed with epoxy resin, polyurethane resin, polyurea resin and polyisocyanate resin at the conditions of low temperature and high humidity and producing amine blushing, amine blooming or treaded surface phenomenon. The present invention reduces the curing time and overcomes the aforementioned drawbacks of the resins effectively.

A process for the preparation of insulation systems for electrical engineering by automatic pressure gelation (APG) or vacuum casting, wherein a multiple component thermosetting resin composition is used, said resin composition comprising (A) at least one epoxy resin, (B) at least one carboxylic acid anhydride curing agent, and (C) 2,4,6-tris(dimethylaminomethyl)phenol,
provides encased articles exhibiting good mechanical, electrical and dielectrical properties, which can be used as, for example, insulators, bushings, switchgears and instrument transformers.

An adhesive composition (composition) comprises an epoxy resin, a binder, and a curing agent. Typically, the composition further comprises an aqueous solvent (e.g. water) such that the composition can be referred to as an aqueous adhesive composition. The epoxy resin is typically encapsulated to prevent premature cure of the composition. After rupture of the encapsulated epoxy resin, the composition cures to form an adhesive. The composition is useful for articles such as fasteners (e.g. nuts and bolts) such that it can be referred to as a fastener adhesive. Typically, the composition is disposed on a threaded surface of the fastener. The fastener can be used for an assembly in which the composition generally cures after installation of the fastener. To make the fastener, the adhesive composition can be applied on the threaded surface. After application, the composition can be dried in instances where the composition still includes the aqueous solvent.

The present invention relates to new compounds based on polyetheramine modified phenalkamine, their use as curing agents, compositions comprising the novel compounds, the manufacture of such compounds and of such compositions, and the use of these compositions, in particular in a potting process in electrical and electronic components and devices.

The use of a hardener containing at least one amine of formula (I) for crosslinking of amine-reactive compounds, wherein the amines of formula (I) are biobased and obtainable from vanillin or guaiacol. The amines of formula (I) have particularly good compatibility with epoxy resins as the amine-reactive compound. They make it possible to obtain biobased epoxy resin products that are superior to petrobased products not only in terms of sustainability but also in terms of technical performance.

An insulating heat-radiating coating composition including a coating layer-forming component including a main resin; and an insulating heat-radiating filler, which not only is capable of exhibiting excellent heat-radiating performance due to excellent thermal conductivity and heat radiation but also forms an insulating heat-radiating coating layer having a heat-insulating property. In addition, an insulating heat-radiating coating layer formed using the insulating heat-radiating coating composition has excellent adhesiveness to a surface to be coated, thereby remarkably preventing the peeling of an insulating heat-radiating coating layer during use and maintaining the durability of the insulating heat-radiating coating layer against physical and chemical stimuli such as external heat, organic solvents, moisture, and impact after formation of the insulating heat-radiating coating layer.

The present invention relates to new compounds based on polyetheramine modified phenalkamine, their use as curing agents, compositions comprising the novel compounds, the manufacture of such compounds and of such compositions, and the use of these compositions, in particular in a potting process in electrical and electronic components and devices.