A Mannich base of formula (1) and the use thereof as a component of a hardener for epoxy resins, wherein the Mannich base of formula (1) has a high Renewable Carbon Index. It makes it possible to produce high-quality and sustainable epoxy resin products which have a surprisingly good processability, cure rapidly and in an unimpeded manner at ambient temperature and form a pleasing surface at a high final hardness.

The present invention relates to epoxy curing agent compositions comprising naphthol and naphthol derivatives in combination with at least one polyamine having three or more active amine hydrogens, and use of these curing agents as hardener for epoxy resins. These curing agent compositions may be used to cure, harden and/or crosslink an epoxy resin.

The present disclosure relates to an amine composition comprising a) an alkylated diamine b) a tertiary amine; and c) a polyoxyalkyleneamnne. Also disclosed are an epoxy system prepared from the amine composition and an epoxy resin and use thereof.

A two-part curable resin composition contains the following agents A and B. The agent A is a composition containing a component (a) and a component (b). The component (a) is an epoxy resin having two or more epoxy groups in one molecule. The component (b) is an alkoxide-based aluminum catalyst. The agent B is a composition containing a component (c) and a component (d). The component (c) is an organic polymer having two or more hydrolyzable silyl groups. The component (d) is a curing agent for the component (a).

A multi-part curable composition includes an A part including a polyoxyalkylene polymer (A) having a reactive silicon group, a (meth)acrylic ester polymer (B) having a reactive silicon group, an epoxy resin curing agent (D) having a tertiary amine moiety, an alicyclic structure-containing amine (E1), and a B part including an epoxy resin (C). Each of the reactive silicon groups of the polymer (A) and polymer (B) are represented by SiR.sup.5.sub.cX.sub.3-c. R.sup.5 is a substituted or unsubstituted hydrocarbon group having 1 to 20 carbon atoms, X is a hydroxy group or a hydrolyzable group, and c is 0 or 1. A multi-part curable composition includes an A part including the polymer (A), polymer (B), and an epoxy resin curing agent (D) having a tertiary amine moiety, and a B part including an epoxy resin (C), where either or both of the A and B parts include an amino alcohol compound (E2).

A condensation product of at least one (hydroxymethyl)phenol and at least one polyoxyalkylene diamine and a process for the preparation thereof and the use thereof in the curing of epoxy resin systems are described.

A composition including: at least one silane group-containing polymer with a silicon content ranging from 0.6 to 2 wt. %, obtained by reacting at least one isocyanate group-containing polymer and at least one amino-, mercapto-, or hydroxysilane, at least one liquid epoxy resin, andat least one polyamine with at least three amine hydrogens which are reactive towards epoxy groups. The composition facilitates adhesives, coatings, or sealing compounds with a good storage stability, a fast curing time, even in the event of moisture or humidity, a surprisingly high degree of strength while having a high degree of elasticity, a high degree of resistance against further tearing, a high degree of resistance in particular against glycol/water mixtures, and a high degree of adhesion to many substrates. When used on metals such as steel or aluminum, the composition protects same against corrosion.

This resin composition for molding contains: an epoxy resin; a curing agent containing an active ester compound and a phenol curing agent; and an inorganic filler containing calcium titanate particles.

The invention relates to a method of forming an epoxy resin curative, derived from a polyamine, and having exceptionally high purity with regard to contamination with said polyamine precursor. The invention also provides high purity epoxy resin curatives, epoxy resin curative compositions comprising said epoxy resin curatives, and uses of the same. In one aspect, the invention provides a method of forming an epoxy resin curative, by contacting a difunctional epoxide compound with one or more polyamine, to provide a diadduct, purifying the diadduct such that the purified diadduct comprises less than 0.1 wt. % of the one or more polyamine, as determined by GC, and using the diadduct to form a Mannich base, amide containing compound, ketimine, or aldimine, for use as an epoxy resin curative.

Two-part curable compositions capable of demonstrating substantially no phase separation at room temperature over time and improved adhesion strength retention at elevated temperature conditions.